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US5352913A Expired / Lapsed US ⏱️ 0.0 years remaining

Dynamic memory storage capacitor having reduced gated diode leakage

Assignee: Texas Instruments Inc
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Filing: 1994-03-02
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Granted: 1994-10-04
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Expires: 2014-03-02
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Abstract

Abstract A method of reducing gated diode leakage in trench capacitor type field plate isolated dynamic random access memory devices is disclosed. Trenches are etched into a face of a body of semiconductor material. Storage nodes surrounding the trenches are created. A polysilicon layer is formed on the trench walls. A storage dielectric layer is formed on the trench walls, adjacent to the layer of polysilicon on the trench walls, so that the layer of polysilicon on the trench walls lies between the storage dielectric layer and the storage node. The layer of polysilicon on the trench walls reduces leakage current from the storage node. A trench type field plate isolated random access memory cell structure is also disclosed.

Inventors

  • 👤 Gishi Chung
  • 👤 William R. McKee
  • 👤 Clarence W. Teng

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:26
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/038; H10D; H10D1/00; H10D1/60; H10D1/68

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 86 words
A dynamic memory storage capacitor formed in a face of a semiconductor body, comprising: a trench etched into the face of the semiconductor body, said trench having a semiconductor trench wall; a layer of polysilicon on and directly touching said semiconductor trench wall; a storage node in the face of the semiconductor body surrounding said trench wall in contact with said polysilicon; a storage dielectric layer on top of said layer of polysilicon on said trench wall; and a field plate extending down into said trench.
Claim 2
Dependent Claim 86 words
A dynamic memory storage capacitor formed in a face of a semiconductor body, comprising: a trench etched into the face of the semiconductor body, said trench having a semiconductor trench wall; a layer of polysilicon on and directly touching said semiconductor trench wall; a storage node in the face of the semiconductor body surrounding said trench wall in contact with said polysilicon; a storage dielectric layer on top of said layer of polysilicon on said trench wall; and a field plate extending down into said trench.
Claim 3
Dependent Claim 15 words
The dynamic memory storage capacitor of claim 1 wherein the storage node contains implanted arsenic.
Claim 4
Dependent Claim 14 words
The dynamic memory storage capacitor of claim 2 wherein the field plate is polysilicon.

References Cited (Backward Citations)

US5010378A Cited
US5010379A Cited
US5027172A Cited
US5168336A Cited
US5223730A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-10-03 1998-04-04 1998-10-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-10-03 2002-04-04 2002-10-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-10-03 2006-04-04 2006-10-04 $7700.00 Window Closed / Lapsed

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