Cover tape for packaging chip type electronic parts

Claim 2

A cover tape for packaging of chip type electronic parts which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, said cover tape comprising an outer layer and an adhesion layer; said outer layer is a biaxially oriented film selected from the group consisting of polyester, polypropylene, and nylon, said outer layer having a thickness of from 6 to 100 μm; said adhesion layer consisting of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders selected from the group consisting of tin oxides zinc oxide, titanium oxide, silicon-based organic compounds, and combinations thereof, said adhesion layer having a thickness of 5 μm or less; wherein the amount of conductive fine powders is 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer, and the surface resistance of the adhesion layer is 10 13 ohms per square or less; the interlaminar adhesion strength between the outer layer and the adhesion layer is 10/120 g/mm of sealing width; and the visible light transmittance of the cover tape is 10% or more.

Claim 3

The cover tape according to claim 1 wherein the thermoplastic resin is selected from the group consisting of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate copolymer resin, polyester resin, and combinations thereof.

Claim 4

The cover tape according to claim 1 wherein the adhesion strength between the adhesion layer of the cover tape and the sealing surface of the carrier tape is greater than the interlaminar adhesion strength between the outer layer and the adhesion layer.

Claim 5

A cover tape for packaging of chip type electronic parts which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts comprising an outer layer, an intermediate layer and an inner layer; said outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon, said outer layer having a thickness of from 6 to 100 μm; said intermediate layer consists of a polyolefin selected from the group consisting of polyethylene, ethylenevinyl acetate copolymer, ionomer, and polypropylene, said intermediate layer having a thickness of 10 μm or more; said adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders selected from the group consisting of tin oxide, zinc oxide, titanium oxide, a silicon-based organic compound, and combinations thereof said adhesion layer having a thickness of 5 μm or less; wherein the amount of the conductive fine powders is from 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer and the surface resistance of the adhesion layer is 10 13 ohms per square or less; the interlaminar adhesion strength between the intermediate layer and the adhesion layer is 10-120 g/mm of sealing width; the visible light transmittance of the cover tape is 10% or more.

Claim 6

A cover tape for packaging of chip type electronic parts which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts comprising an outer layer, an intermediate layer and an inner layer; said outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon, said outer layer having a thickness of from 6 to 100 μm; said intermediate layer consists of a polyolefin selected from the group consisting of polyethylene, ethylenevinyl acetate copolymer, ionomer, and polypropylene, said intermediate layer having a thickness of 10 μm or more; said adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders selected from the group consisting of tin oxide, zinc oxide, titanium oxide, a silicon-based organic compound, and combinations thereof said adhesion layer having a thickness of 5 μm or less; wherein the amount of the conductive fine powders is from 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer and the surface resistance of the adhesion layer is 10 13 ohms per square or less; the interlaminar adhesion strength between the intermediate layer and the adhesion layer is 10-120 g/mm of sealing width; the visible light transmittance of the cover tape is 10% or more.

Claim 7

A cover tape according to claim 4 wherein the thermoplastic resin of the adhesion layer is selected from the group consisting of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate copolymer resin, polyester resin, and combinations thereof.

Claim 8

A cover tape according to claim 4 wherein the adhesion strength between the adhesion layer of the cover tape and the sealing surface of the carrier tape is greater than the interlaminar adhesion strength between the intermediate layer and the adhesion layer of the cover tape.