Cover tape for packaging chip type electronic parts

Claim 1

A cover tape used for packaging of electronic parts in the form of a chip comprising: an outer layer; a laminating adhesive layer; an intermediate layer; and an adhesion layer which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of electronic parts in the form of a chip; wherein the outer layer is made of a biaxially oriented film made from a polymer selected from the group consisting of polyester, polypropylene, and nylon and the visible light transmittance of the cover tape is at least 65.4% and the thickness of the outer layer is from 6 to 100 microns; the adhesive layer is between the outer layer and the intermediate layer; the intermediate layer is a polyolefin film comprising (a) 55-95% by weight of at least one ethylene polymer selected from the group consisting of polyethylene having a density of 0.91-0.93 g/cm 3 and ethylene-vinyl acetate copolymers containing 10% by weight or less of vinyl acetate; (b) 5-30% by weight of polystyrene and (c) 0-20% by weight of a thermoplastic elastomeric polymer selected from the group consisting of styrene-butadiene-styrene and styrene-isoprene-styrene, and having cohesive strength of 10-120 g per mm of sealing width and wherein the adhesion strength between the adhesion layer and the sealing surface of the carrier tape is larger than the cohesive strength of the intermediate layer of the cover tape; and the adhesion layer comprises a thermoplastic resin in which is dispersed from 10-10,000 parts by weight per 100 parts by weight of the thermoplastic resin a conductive fine powder, said conductive fine powder being selected from the group consisting of tin oxide, zinc oxide, titanium oxide, ethyl silicate, carbon black, and mixtures thereof, the thickness of the adhesion layer is 5 microns or less, and the surface resistivity of the adhesion layer is 10 13 ohms per square or less.