EP0150882A1
Expired / Lapsed
EP
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Conductive die attach tape
Assignee: Ingredion Inc
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Filing: 1985-01-24
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Granted: —
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Expires: 2005-01-24
Abstract
Abstract A conductive die attach type is described which allows for mounting of diced semiconductor chips thereon, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/adhesive combination in a chip carrier preparatory to the wire bonding operation.
Inventors
- 👤 Joseph Anthony Aurichio
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 04:01
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10W20/00; H10W20/40; H10W72/071; H10W72/073; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10P72/7416
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
54 words
A conductive die attach tape useful in releasably supporting semiconductor chips on a conductive adhesive which comprises: (a) a support film; and (b) a pattern of conductive adhesive releasably affixed to one side of the support film, the adhesive pattern being of a size and shape to support at least one semiconductor chip thereon.
Claim 2
Dependent Claim
54 words
A conductive die attach tape useful in releasably supporting semiconductor chips on a conductive adhesive which comprises: (a) a support film; and (b) a pattern of conductive adhesive releasably affixed to one side of the support film, the adhesive pattern being of a size and shape to support at least one semiconductor chip thereon.
Claim 3
Dependent Claim
18 words
A tape as claimed in Claim 1 in which the support film is formed of a polyolefin polymer.
Claim 4
Dependent Claim
13 words
A tape as claimed in Claim 1 wherein the support film is polyethylene.
Claim 5
Dependent Claim
23 words
A tape as claimed in Claim 1 wherein the support film has a thickness of from about 12 microns to about 250 microns.
Claim 6
Dependent Claim
21 words
A tape as claimed in Claim 1 which further comprises a release layer on the film between it and the adhesive.
Claim 7
Dependent Claim
15 words
A tape as claimed in Claim 5 wherein the release layer comprises a silicone composition.
Claim 8
Dependent Claim
15 words
A tape as claimed in Claim 5 wherein the release layer comprises a fluorocarbon composition.
Claim 9
Dependent Claim
23 words
A tape as claimed in Claim 1 wherein the conductive adhesive has a thickness of from about 5 microns to about 75 microns.
Claim 10
Dependent Claim
25 words
A tape as claimed in Claim 1 wherein the conductive adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 11
Dependent Claim
23 words
A tape as claimed in Claim 2 wherein the support film has a thickness of from about 12 microns to about 250 microns.
Claim 12
Dependent Claim
27 words
A tape as claimed in Claim 9 which has a release layer on the film between it and the adhesive, said release layer comprising a silicone composition.
Claim 13
Dependent Claim
41 words
A tape as claimed in Claim 11 having a conductive adhesive of a thickness of from about 5 microns to about 75 microns and wherein the adhesive contains an effective amount for conductivity of a conductive metal in an adhesive matrix.
Claim 14
Dependent Claim
19 words
A tape as claimed in Claim 1 which also has a release liner over the pattern of conductive adhesive.
Claim 15
Dependent Claim
19 words
A film as claimed in Claim 12 which also has a release liner over the pattern of conductive adhesive.
Claim 16
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 1.
Claim 17
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 2.
Claim 18
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 3.
Claim 19
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 4.
Claim 20
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 5.
Claim 21
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 6.
Claim 22
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 7.
Claim 23
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 8.
Claim 24
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 9.
Claim 25
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 10.
Claim 26
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 11.
Claim 27
Dependent Claim
12 words
In combination, a semiconductor chip and the tape product of Claim 12.
Claim 28
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 1, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 29
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 2, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 30
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 3, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 31
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 4, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 32
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 5, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 33
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 6, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 34
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 7, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 35
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 8, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 36
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 9, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 37
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 10, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 38
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 11, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
Claim 39
Dependent Claim
47 words
A method of mounting a semiconductor chip in a chip carrier which comprises bonding the chip to the tape product of Claim 12, thereafter removing the chip and adherent conductive adhesive from the support film, and bonding the chip and adherent conductive adhesive to a chip carrier.
References Cited (Backward Citations)
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