Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
100 words
In a printed circuit module for electronic applications, said printed circuit module including a circuit substrate (1) having conductive traces (2) in the form of an ink layer printed thereon, the improvement in the conductive traces comprising: conductive crystallites (8) embedded in the ink layer, said conductive crystallites formed from a non-oxidizable crystalline compound of an element of sub-group IV of the Periodic Table, and one of the elements of the group consisting of nitrogen and carbon, wherein the conductive crystallites are distributed within the ink layer such that each of the crystallites is in contact with an adjacent crystallite.
Claim 2
Dependent Claim
100 words
In a printed circuit module for electronic applications, said printed circuit module including a circuit substrate (1) having conductive traces (2) in the form of an ink layer printed thereon, the improvement in the conductive traces comprising: conductive crystallites (8) embedded in the ink layer, said conductive crystallites formed from a non-oxidizable crystalline compound of an element of sub-group IV of the Periodic Table, and one of the elements of the group consisting of nitrogen and carbon, wherein the conductive crystallites are distributed within the ink layer such that each of the crystallites is in contact with an adjacent crystallite.
Claim 3
Dependent Claim
51 words
In a printed circuit module as set forth in claim 1 wherein the conductive traces include contact areas (4) adapted to make an electrical connection with corresponding contact surfaces (6) of an electronic component (5), and wherein the conductive crystallites (8) are embedded within the ink layer at the contact areas.
Claim 4
Dependent Claim
97 words
In a printed circuit module as set forth in claim 2, wherein the contact surfaces (6) of the electronic component (5) include an adhesive layer (7) having the conductive crystallites (8) embedded therein and distributed such that there is no physical contact between the crystallites, whereby upon pressing down on the electronic component (5), the crystallites (8) of the adhesive layer (7) are pressed into contact with the crystallites (8) of the ink layer and the complementary contact surfaces (6) of the electronic component (5) to effect an electrical connection therebetween, perpendicular to the adhesive layer plane.
Claim 5
Dependent Claim
28 words
In a printed circuit module as set forth in claim 3, wherein the content of the crystallites (8) in the adhesive layer (7) is approximately 10% by weight.
Claim 6
Dependent Claim
30 words
In a printed circuit module as set forth in claim 3, wherein the thickness of the adhesive layer (7) is substantially equal to the thickness of a single crystallite (8).
Claim 7
Dependent Claim
18 words
In a printed circuit module as set forth in claim 1, wherein the crystallites consist of titanium nitride.
Claim 8
Dependent Claim
18 words
In a printed circuit module as set forth in claim 1, wherein the crystallites consist of titanium carbide.
Claim 9
Dependent Claim
22 words
In a printed circuit module as set forth in claim 1, wherein each of the crystallites (8) are of substantially equal size.