US4844784A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible cicuit substrate with electroconductive adhesive layer and its production
Assignee: Shinto Paint Co Ltd
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Filing: 1985-12-12
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Granted: 1989-07-04
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Expires: 2005-12-12
Abstract
Abstract An electroconductive adhesive layer of high molecular weight resin having electroconductive particles disposed therein is electrodeposited selectively on only the electroconductive circuit povided on a flexible circuit substrate. The adhesive layer permits precise bonding of the coated circuit with an identical circuit provided on a second flexible circuit substrate.
Inventors
- 👤 Tameyuki Suzuki
- 👤 Takuro Kamakura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 09:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/247; H01; H01B; H01B1/00; H01B1/20; H01R; H01R4/00; H01R4/04; H05K3/36; H05K3/361; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/023; H05K2203/00; H05K2203/06; H05K2203/066; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/30; H05K3/32; H05K3/321; Y; Y10; Y10S; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
187 words
A method of providing electroconductive bonding between a first flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and a second flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and which is identical to the electroconductive circuit on the first flexible circuit substrate and is provided on the surface of the second flexible circuit substrate which faces the first flexible circuit substrate, said method comprising the steps of forming by electrodeposition on the electroconductive circuit on the first flexible circuit substrate electroconductive adhesive layer consisting essentially of a high molecular resin and electroconductive particles of titanium carbide or titanium nitride dispersed therein, whereby said electroconductive layer is formed selectively on said electroconductive circuit on the first flexible circuit substrate, then bringing said electroconductive adhesive layer on the first flexible circuit substrate into contact with the electroconductive circuit on the second flexible circuit substrate so that the electroconductive circuits on the respective flexible circuit substrates are aligned with each other and bonded through the electroconductive adhesive layer.
Claim 2
Independent Claim
187 words
A method of providing electroconductive bonding between a first flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and a second flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and which is identical to the electroconductive circuit on the first flexible circuit substrate and is provided on the surface of the second flexible circuit substrate which faces the first flexible circuit substrate, said method comprising the steps of forming by electrodeposition on the electroconductive circuit on the first flexible circuit substrate electroconductive adhesive layer consisting essentially of a high molecular resin and electroconductive particles of titanium carbide or titanium nitride dispersed therein, whereby said electroconductive layer is formed selectively on said electroconductive circuit on the first flexible circuit substrate, then bringing said electroconductive adhesive layer on the first flexible circuit substrate into contact with the electroconductive circuit on the second flexible circuit substrate so that the electroconductive circuits on the respective flexible circuit substrates are aligned with each other and bonded through the electroconductive adhesive layer.
Claim 3
Dependent Claim
41 words
A method as described in claim 1, wherein there is a plurality of electroconductive circuits on at least two of the flexible circuit substrates and the interval between adjacent electroconductive circuits on a flexible circuit substrate is 0.2 mm or less.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-03 | 1993-01-02 | 1993-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-03 | 1997-01-02 | 1997-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-03 | 2001-01-02 | 2001-07-04 | $7700.00 | Window Closed / Lapsed |