Patent US5336547A successfully refreshed from Google Patents.
US5336547A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic components mounting/connecting package and its fabrication method
Assignee: Panasonic Holdings Corp
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Filing: 1993-02-26
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Granted: 1994-08-09
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Expires: 2013-02-26
Abstract
Abstract The present invention relates to an electronic components mounting/connecting package characterized by using bump electrodes to connect electronic components such as semiconductors and the like with patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated with bump electrodes. The composition of bump electrodes disclosed by the present invention is to have resin particles dispersed to high density in the metallic bump electrodes. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it has become possible to absorb the variations through elasticity presented by the bump electrodes and to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
Inventors
- 👤 Tetsuo Kawakita
- 👤 Takayuki Yoshida
- 👤 Kenzo Hatada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:10
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/01; H10W72/012; H10W72/01204; H10W72/071; H10W72/072; H10W72/07221; H10W72/07223; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/241; H10W72/251; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/249921; Y10T428/249953; Y10T428/249967; Y10T428/249968; Y10T428/24997; Y10T428/249986
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
26 words
An electronic components mounting/connecting package comprising bump electrodes of a composition wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 2
Dependent Claim
26 words
An electronic components mounting/connecting package comprising bump electrodes of a composition wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 3
Dependent Claim
36 words
An electronic components mounting/connecting package comprising bump electrodes each comprising alternate lamination of a metallic layer and a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 4
Dependent Claim
36 words
An electronic components mounting/connecting package comprising bump electrodes each comprising alternate lamination of a metallic layer and a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 5
Dependent Claim
38 words
An electronic components mounting/connecting package comprising bump electrodes of a two layer construction consisting of a metallic layer and a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 6
Dependent Claim
38 words
An electronic components mounting/connecting package comprising bump electrodes of a two layer construction consisting of a metallic layer and a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal.
Claim 7
Dependent Claim
47 words
An electronic components mounting/connecting package comprising bump electrodes of a three layer construction consisting of a sequential lamination of a first metallic layer, a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal and a second metallic layer.
Claim 8
Dependent Claim
47 words
An electronic components mounting/connecting package comprising bump electrodes of a three layer construction consisting of a sequential lamination of a first metallic layer, a mixed composition layer wherein resin particles having diameters in the range of 1-5 μm are dispersed in metal and a second metallic layer.
References Cited (Backward Citations)
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JPH02185050A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-08 | 1998-02-07 | 1998-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-08 | 2002-02-07 | 2002-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-08 | 2006-02-07 | 2006-08-09 | $7700.00 | Window Closed / Lapsed |