Abstract A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a plurality of solder bumps being in contact with bonding pads of the semiconductor chip and a plurality of metal contacts formed on the solder bumps of the lid. The lid comprises an insulating polyimide film or a rectangular plate made of a nonconductive ceramic material. The semiconductor package eliminates the use of a lead frame and metal wires, thereby enabling the manufacture thereof to be simplified. It also achieves a simplification, a lightness, a thinness, a compactness in construction. With the simplified construction, a reduction in manufacture cost and an improvement in productivity are achieved. In manufacturing semiconductor devices, the semiconductor package also provides an improvement in the degree of dense integration.
A semiconductor package comprising: a semiconductor chip provided on its upper surface at opposite side edges thereof with a plurality of bonding pads; a base provided with a cavity in which the semiconductor chip is seated; a lid fixedly attached to an upper surface of the semiconductor chip received in the cavity for electrically insulating the semiconductor package; a plurality of solder bumps formed in said lid and being disposed on and in direct contact with the bonding pads, respectively; a plurality of metal contacts formed on and in direct contact with the solder bumps of the lid, respectively; and said semiconductor chip being fixedly attached to the cavity of the base by an adhesive material.
Claim 2
Dependent Claim
116 words
A semiconductor package comprising: a semiconductor chip provided on its upper surface at opposite side edges thereof with a plurality of bonding pads; a base provided with a cavity in which the semiconductor chip is seated; a lid fixedly attached to an upper surface of the semiconductor chip received in the cavity for electrically insulating the semiconductor package; a plurality of solder bumps formed in said lid and being disposed on and in direct contact with the bonding pads, respectively; a plurality of metal contacts formed on and in direct contact with the solder bumps of the lid, respectively; and said semiconductor chip being fixedly attached to the cavity of the base by an adhesive material.
Claim 3
Dependent Claim
21 words
A semiconductor package in accordance with claim 1, wherein the adhesive is made of a polyimide material or an epoxy material.
Claim 4
Dependent Claim
19 words
A semiconductor package in accordance with claim 1, wherein the base is made of a ceramic or an aluminum.
Claim 5
Dependent Claim
15 words
A semiconductor package in accordance with claim 1, wherein the lid comprises a polyimide film.
Claim 6
Dependent Claim
16 words
A semiconductor package in accordance with claim 1, wherein the lid is made of a ceramic.