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EP0516170A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor chip mounted circuit board assembly and method for manufacturing the same

Assignee: Oki Electric Industry Co Ltd
•
Filing: 1992-05-29
•
Granted: —
•
Expires: 2012-05-29
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Abstract

Abstract A circuit board assembly comprises an electrical insulating circuit board with at least one hollow, a semiconductor IC chip mounted in the hollow wherein the upper surfaces of the circuit board and the semiconductor IC chip has the same surface level, the semiconductor IC chip having bonding pads on the upper surface thereof; a wiring pattern connected to one of the bonding pads of the semiconductor IC chip and extending over the surface of the insulating circuit board; and an insulating material layer filled between the semiconductor IC chip and side walls of the hollow so as to fix securely the semiconductor IC chip. <IMAGE>

Inventors

  • 👤 Kenichi c/o Oki Electric Ind. Co. Ltd. Anasako
  • 👤 Rokuro Homma

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 00:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/099; H10W70/69; H10W70/695; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W90/00; H10W90/701; H10W90/731; H10W90/734

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 104 words
A circuit board assembly comprising: an electrical insulating circuit board with at least one hollow; a semiconductor IC chip mounted in the hollow wherein the upper surfaces of said circuit board and said semiconductor IC chip has the same surface level, said semiconductor IC chip having bonding pads on the upper surface thereof; a wiring pattern connected to one of said bonding pads of said semiconductor IC chip and extending over the surface of the insulating circuit board; and an insulating material layer filled between said semiconductor IC chip and side walls of said hollow so as to fix securely said semiconductor IC chip.
Claim 2
Dependent Claim 26 words
A circuit board assembly according to claim 1, wherein said circuit board is made of one selected from a group of polychlorinated biphenyl, epoxy-glass, and ceramics.
Claim 3
Dependent Claim 19 words
A circuit board assembly according to claim 1, wherein said insulating material layer is made of a thermosetting resin.
Claim 4
Dependent Claim 21 words
A circuit board assembly according to claim 1, wherein said wiring pattern comprises a layer which is made by vapor-depositing aluminum.
Claim 5
Independent Claim 122 words
A method of manufacturing a circuit board assembly comprising the steps of: preparing an electrical insulating circuit board with at least one hollow, a semiconductor IC chip having bonding pads on the upper surface thereof; coating an adhesive layer in the hollow of said electrical insulating circuit board; mounting said IC chips into said hollow of said electrical insulating circuit board so as to make a flat surface of said IC chips and said electrical insulating circuit board; filling an insulating material between the gap of said semiconductor IC chip and side walls of said hollow so as to fix securely said semiconductor IC chip; forming wiring patterns on the surfaces of said semiconductor IC chips and said electrical insulating circuit board.

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