Patent US5315153A successfully refreshed from Google Patents.
US5315153A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packages for semiconductor integrated circuit
Assignee: Toyo Aluminum KK
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Filing: 1990-01-12
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Granted: 1994-05-24
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Expires: 2010-01-12
Abstract
Abstract A ceramic package comprising an aluminum nitride substrate, an IC on the substrate, leads attached to the substrate, a metal cap covering the substrate, a resin layer for adhesion of the above elements, and a water-resistant coating on the inner surface of the resin layer.
Inventors
- 👤 Yuji Nagai
- 👤 Eiki Tanikawa
- 👤 Hisao Ohshima
- 👤 Kazushige Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:38
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
91 words
A ceramic package for a semiconductor integrated circuit, the package comprising: a substrate made of aluminum nitride, a semiconductor integrated circuit formed on the substrate, leads attached to the substrate, a metal cap covering the substrate in a manner that forms a hollow space surrounding the semiconductor integrated circuit between the substrate and the metal cap, a resin layer for adhering the substrate, the leads and the metal cap to each other, and a coating of water-resistant material on the inner surface of the resin layer which defines the hollow space.
Claim 2
Dependent Claim
91 words
A ceramic package for a semiconductor integrated circuit, the package comprising: a substrate made of aluminum nitride, a semiconductor integrated circuit formed on the substrate, leads attached to the substrate, a metal cap covering the substrate in a manner that forms a hollow space surrounding the semiconductor integrated circuit between the substrate and the metal cap, a resin layer for adhering the substrate, the leads and the metal cap to each other, and a coating of water-resistant material on the inner surface of the resin layer which defines the hollow space.
Claim 3
Dependent Claim
39 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the resin layer is selected from the group consisting of epoxy resin, phenolic resin, polyimide resin, silicone resin, fluoro plastics, polybutadiene, polyester resin and polyphenylene sulfide resin.
Claim 4
Dependent Claim
30 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the substrate is a composite material composed of a thin aluminum nitride layer formed on a metal material.
Claim 5
Dependent Claim
31 words
A ceramic package for semiconductor integrated circuit according to claim 3 wherein the metal material is selected from the group consisting of aluminum, iron, copper, nickel and alloys of these metals.
Claim 6
Dependent Claim
26 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the coating of water-resistant material is formed by spray coating of a ceramic oxide.
Claim 7
Dependent Claim
24 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the coating of water-resistant material is formed by application of imide resin.
Claim 8
Dependent Claim
24 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the coating of water-resistant material is formed by application of silicone resin.
Claim 9
Dependent Claim
23 words
A ceramic package for semiconductor integrated circuit according to claim 1 wherein the coating of water-resistant material is a coating of metal oxide.
Claim 10
Dependent Claim
134 words
A ceramic package for ultra high-frequency semiconductor integrated circuit, the package comprising: a substrate made of aluminum nitride, a semiconductor integrated circuit formed on the substrate, leads attached to the substrate, a metal cap covering the substrate in a manner that forms a hollow space surrounding the semiconductor integrated circuit between the substrate and the metal cap, a spacer made of aluminum nitride and position between the substrate and the leads a resin layer for adhering the substrate, the spacer, the leads and the metal cap to each other, the spacer and the resin layer thereunder rendering the bonding position on the leads slightly higher than on the semiconductor integrated circuit device, and a coating of water-resistant material on the inner surface of the resin layer and the spacer which define the hollow space.
Claim 11
Dependent Claim
134 words
A ceramic package for ultra high-frequency semiconductor integrated circuit, the package comprising: a substrate made of aluminum nitride, a semiconductor integrated circuit formed on the substrate, leads attached to the substrate, a metal cap covering the substrate in a manner that forms a hollow space surrounding the semiconductor integrated circuit between the substrate and the metal cap, a spacer made of aluminum nitride and position between the substrate and the leads a resin layer for adhering the substrate, the spacer, the leads and the metal cap to each other, the spacer and the resin layer thereunder rendering the bonding position on the leads slightly higher than on the semiconductor integrated circuit device, and a coating of water-resistant material on the inner surface of the resin layer and the spacer which define the hollow space.
Claim 12
Dependent Claim
39 words
A ceramic package for semiconductor integrated circuit according to claim 9 wherein the resin layer is selected from the group consisting of epoxy resin, phenolic resin, polyimide resin, silicone resin, fluoro plastics, polybutadiene, polyester resin and polyphenylene sulfide resin.
Claim 13
Dependent Claim
26 words
A ceramic package for semiconductor integrated circuit according to claim 9 wherein the coating of water-resistant material is formed by spray coating of a ceramic oxide.
Claim 14
Dependent Claim
24 words
A ceramic package for semiconductor integrated circuit according to claim 9 wherein the coating of water-resistant material is formed by application of imide resin.
Claim 15
Dependent Claim
24 words
A ceramic package for semiconductor integrated circuit according to claim 9 wherein the coating of water-resistant material is formed by application of silicone resin.
Claim 16
Dependent Claim
23 words
A ceramic package for semiconductor integrated circuit according to claim 9 wherein the coating of water-resistant material is a coating of metal oxide.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-23 | 1997-11-22 | 1998-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-23 | 2001-11-22 | 2002-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-23 | 2005-11-22 | 2006-05-24 | $7700.00 | Window Closed / Lapsed |