Capacitor and a memory cell formed therefrom

Claim 2

A capacitor comprising: a substrate; an annular high-permittivity dielectric region formed overlying the substrate, the annular high-permittivity dielectric region having an inner perimeter and an outer perimeter, the inner perimeter and the outer perimeter being separated by a distance through the annular high-permittivity dielectric region which is greater than 500 Angstroms; a first capacitor electrode formed only within the inner perimeter of the annular high-permittivity dielectric region; and a second capacitor electrode formed only external to the outer perimeter of the annular high-permittivity dielectric region, the second capacitor electrode being separated from the first capacitor electrode by a distance which is greater than 500 Angstroms.

Claim 3

The capacitor of claim 1 further comprising: a first current electrode and a second current electrode of a transistor formed within the substrate, the first and second current electrodes being separated by a channel region; a gate dielectric formed overlying the channel region; a gate overlying the gate dielectric, overlying the channel region, and positioned between the first and second current electrodes; and a conductive material electrically coupling one of either the first current electrode or the second current electrode to the first capacitor electrode.

Claim 4

The capacitor of claim 1 further comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and a gate adjacent the channel region wherein the gate is electrically isolated from the channel region by a gate dielectric; and a conductive material electrically coupling one of either the first current electrode or the second current electrode to the first capacitor electrode to form one of either a dynamic random access memory cell or a non-volatile memory cell.

Claim 5

The capacitor of claim 1 wherein the first and the second capacitor electrodes are formed by selectively removing portions of a single conductive layer.

Claim 6

The capacitor of claim 1, further comprising: a plurality of capacitors overlying the substrate, each capacitor being in accordance with claim 1 and having the first and second capacitor electrodes formed from a single conductive layer; and a conductive material electrically connecting each second capacitor electrode of all capacitors in the plurality by using the single conductive layer.

Claim 7

The capacitor of claim 1, further comprising: a buffer layer underlying the annular high-permittivity dielectric region.

Claim 8

The capacitor of claim 1, further comprising: an etch stop layer overlying the annular high-permittivity dielectric region.

Claim 9

The capacitor of claim 1, further comprising: a polish stop layer overlying the annular high-permittivity dielectric region.

Claim 10

The capacitor of claim 1 wherein the annular high-permittivity dielectric region is a ferroelectric material.

Claim 11

The capacitor of claim 1, further comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and having a gate adjacent the channel region wherein the gate is physically separated from the channel region by a gate dielectric; a dielectric isolation region overlying the transistor, the dielectric isolation region having an opening that exposes a portion of one of either the first current electrode or the second current electrode to form an exposed electrode portion; and a conductive plug region formed within the opening which electrically connects the exposed electrode portion to the first capacitor electrode of said capacitor.

Claim 12

A memory cell comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and a gate adjacent the channel region wherein the gate is isolated from the channel region by a gate dielectric; a dielectric isolation region overlying the transistor, the dielectric isolation region having an opening that exposes a portion of one of either the first current electrode or the second current electrode to form an exposed electrode portion; an annular high-permittivity dielectric region having an inner and an outer sidewall, the annular high-permittivity dielectric region overlying the dielectric isolation region and functioning as a capacitor dielectric, the annular high-permittivity dielectric region having a width measured from the inner sidewall to the outer sidewall wherein the width is greater than 500 Angstroms, the inner sidewall defining an inner perimeter of the annular high-permittivity dielectric region and the outer sidewall defining an outer perimeter of the annular high-permittivity dielectric region; a first capacitor electrode formed adjacent the inner sidewall and within the inner perimeter of the annular high-permittivity dielectric region and being electrically coupled to the first current electrode; and a second capacitor electrode formed adjacent the outer sidewall and outside the outer perimeter of the annular high-permittivity dielectric region.

Claim 13

A memory cell comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and a gate adjacent the channel region wherein the gate is isolated from the channel region by a gate dielectric; a dielectric isolation region overlying the transistor, the dielectric isolation region having an opening that exposes a portion of one of either the first current electrode or the second current electrode to form an exposed electrode portion; an annular high-permittivity dielectric region having an inner and an outer sidewall, the annular high-permittivity dielectric region overlying the dielectric isolation region and functioning as a capacitor dielectric, the annular high-permittivity dielectric region having a width measured from the inner sidewall to the outer sidewall wherein the width is greater than 500 Angstroms, the inner sidewall defining an inner perimeter of the annular high-permittivity dielectric region and the outer sidewall defining an outer perimeter of the annular high-permittivity dielectric region; a first capacitor electrode formed adjacent the inner sidewall and within the inner perimeter of the annular high-permittivity dielectric region and being electrically coupled to the first current electrode; and a second capacitor electrode formed adjacent the outer sidewall and outside the outer perimeter of the annular high-permittivity dielectric region.

Claim 14

The memory cell of claim 11 wherein the first and the second capacitor electrodes are formed by selectively removing portions of a single conductive layer.

Claim 15

The memory cell of claim 11 wherein the memory cell is formed as one of either a dynamic random access memory or a non-volatile memory.

Claim 16

The memory cell of claim 11, further comprising: a buffer layer underlying the annular high-permittivity dielectric region.

Claim 17

The memory cell of claim 11, further comprising: an etch stop layer overlying the annular high-permittivity dielectric region.

Claim 18

The memory cell of claim 11, further comprising: a polish stop layer overlying the annular-permittivity dielectric region.

Claim 19

The memory cell of claim 11 wherein the annular high-permittivity dielectric region is a ferroelectric material

Claim 20

A capacitor comprising: a substrate; an annular high-permittivity dielectric region formed overlying the substrate, the annular high-permittivity dielectric region having an inner sidewall and an outer sidewall; a first capacitor electrode formed adjacent the inner sidewall of the annular high-permittivity dielectric region; and a second capacitor electrode formed adjacent the outer sidewall of the annular high-permittivity dielectric region wherein the first and the second capacitor electrodes are formed by selectively removing portions of a single conductive layer.

Claim 21

A capacitor comprising: a substrate; an annular high-permittivity dielectric region formed overlying the substrate, the annular high-permittivity dielectric region having an inner sidewall and an outer sidewall; a first capacitor electrode formed adjacent the inner sidewall of the annular high-permittivity dielectric region; and a second capacitor electrode formed adjacent the outer sidewall of the annular high-permittivity dielectric region wherein the first and the second capacitor electrodes are formed by selectively removing portions of a single conductive layer.

Claim 22

The capacitor of claim 18 further comprising: a first current electrode and a second current electrode of a transistor formed within the substrate, the first and second current electrodes being separated by a channel region; a gate dielectric formed overlying the channel region; a gate overlying the gate dielectric, overlying the channel region, and positioned between the first and second current electrodes; and a conductive material electrically coupling one of either the first current electrode or the second current electrode to the first capacitor electrode.

Claim 23

The capacitor of claim 18 further comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and a gate adjacent the channel region wherein the gate is electrically isolated from the channel region by a gate dielectric; and a conductive material electrically coupling one of either the first current electrode or the second current electrode to the first capacitor electrode to form one of either a dynamic random access memory cell or a non-volatile memory cell.

Claim 24

The capacitor of claim 18, further comprising: a plurality of capacitors overlying the substrate, each of the plurality of capacitors being in accordance with claim 18 and having the first and second capacitor electrodes formed from the single conductive layer; and a conductive material electrically connecting each second capacitor electrode of all capacitors in the plurality by using the single conductive layer.

Claim 25

The capacitor of claim 18, further comprising: a buffer layer underlying the annular high-permittivity dielectric region.

Claim 26

The capacitor of claim 18, further comprising: an etch stop layer overlying the annular high-permittivity dielectric region.

Claim 27

The capacitor of claim 18, further comprising: a polish stop layer overlying the annular high-permittivity dielectric region.

Claim 28

The capacitor of claim 18 wherein the annular high-permittivity dielectric region is a ferroelectric material.

Claim 29

The capacitor of claim 18, further comprising: a transistor having a first current electrode and a second current electrode separated by a channel region and having a gate adjacent the channel region wherein the gate is physically separated from the channel region by a gate dielectric; a dielectric isolation region overlying the transistor, the dielectric isolation region having an opening that exposes a portion of one of either the first current electrode or the second current electrode to form an exposed electrode portion; and a conductive plug region formed within the opening which electrically connects the exposed electrode portion to the first capacitor electrode of said capacitor.

Claim 30

A capacitor comprising: a substrate; a plurality of capacitors overlying the substrate, each capacitor comprising: an annular high-permittivity dielectric region formed overlying the substrate, the annular high-permittivity dielectric region having an inner sidewall and an outer sidewall; a first capacitor electrode formed adjacent the inner sidewall of the annular high-permittivity dielectric region; and a second capacitor electrode formed adjacent the outer sidewall of the annular high-permittivity dielectric region wherein the first capacitor electrode and the second capacitor electrode are formed by selectively removing a conductive layer; and a conductive material electrically connecting each second capacitor electrode of all capacitors in the plurality by using the conductive layer.

Claim 31

A capacitor comprising: a substrate; a plurality of capacitors overlying the substrate, each capacitor comprising: an annular high-permittivity dielectric region formed overlying the substrate, the annular high-permittivity dielectric region having an inner sidewall and an outer sidewall; a first capacitor electrode formed adjacent the inner sidewall of the annular high-permittivity dielectric region; and a second capacitor electrode formed adjacent the outer sidewall of the annular high-permittivity dielectric region wherein the first capacitor electrode and the second capacitor electrode are formed by selectively removing a conductive layer; and a conductive material electrically connecting each second capacitor electrode of all capacitors in the plurality by using the conductive layer.

Claim 32

The capacitor of claim 27 wherein the first and the second capacitor electrodes are formed by selectively removing portions of a single conductive layer.

Claim 33

The capacitor of claim 27, further comprising: a buffer layer underlying the annular high-permittivity dielectric region.

Claim 34

The capacitor of claim 27, further comprising: an etch stop layer overlying the annular high-permittivity dielectric region.

Claim 35

The capacitor of claim 27, further comprising: a polish stop layer overlying the annular high-permittivity dielectric region.

Claim 36

The capacitor of claim 27 wherein the annular high-permittivity dielectric region is a ferroelectric material.