Patent US5311448A successfully refreshed from Google Patents.
US5311448A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Programmable load board with programmable simulation of thermal dissipation characteristics
Assignee: Hewlett Packard Development Co LP
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Filing: 1991-06-19
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Granted: 1994-05-10
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Expires: 2011-06-19
Abstract
Abstract A programmable load board which can be used for testing the electrical load requirements and thermal response characteristics of electronic equipment. The programmable load board of the present invention is capable of emulating the maximum power at which the electronic component of the emulated system is rated. Both the power requirements and the location of the heat sources of the emulated system can be simulated. In the preferred embodiment of the invention, the programmable load board is constructed generally in the form of a circuit board such as that typically installed in a personal computer. The system is programmable, thus allowing a series of tests at differing loads to be conducted unattended for extended periods of time.
Inventors
- 👤 Mark H. Waggoner
- 👤 Mark L. Hammons
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:06
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2832; G01R31/2836; G01R31/2846
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
77 words
A system for simulating electrical performance characteristics of electronic components at various locations on a printed circuit board comprising: a plurality of electrical loads, said electrical loads being arranged in a plurality of groups at various locations on said printed circuit board, each of said load groups producing a predetermined quantity of electrical load; and programmable means for selectively activating said load groups to simulate the electrical performance characteristics of electronic components on said printed circuit board.
Claim 2
Independent Claim
77 words
A system for simulating electrical performance characteristics of electronic components at various locations on a printed circuit board comprising: a plurality of electrical loads, said electrical loads being arranged in a plurality of groups at various locations on said printed circuit board, each of said load groups producing a predetermined quantity of electrical load; and programmable means for selectively activating said load groups to simulate the electrical performance characteristics of electronic components on said printed circuit board.
Claim 3
Dependent Claim
25 words
The system of claim 1, wherein said load groups produce a thermal output to simulate thermal dissipation by electronic components on said printed circuit board.
Claim 4
Dependent Claim
37 words
The system of claim 1, wherein said load groups are placed at predetermined locations on said printed circuit board to simulate the electrical load and thermal dissipation characteristics of electronic circuit components on said printed circuit board.
Claim 5
Dependent Claim
21 words
The system of claim 1, said plurality of electrical loads comprising a plurality of resistive loads connected to a power source.
Claim 6
Dependent Claim
27 words
The system of claim 4, said plurality of electrical loads further comprising active devices forming an electrical load and further controlling the operation of said resistive loads.
Claim 7
Dependent Claim
23 words
The system of claim 1, said programmable means for selectively activating said load groups comprising logic control circuitry for addressing individual load groups.
Claim 8
Dependent Claim
21 words
The system according to claim 6, said logic control circuitry comprising a central processing unit responsive to a stored computer program.
Claim 9
Independent Claim
78 words
A system for simulating electrical and thermal characteristics of electronic components on a printed circuit board, comprising: an electronic circuit board comprising a control portion and a load portion, said load portion comprising a plurality of electrical loads arranged in load groups at predetermined locations on said electronic circuit board, said control portion comprising programmable means for selectively activating said load groups to simulate the electrical and thermal load characteristics of electronic components on said electronic circuit board.
Claim 10
Independent Claim
78 words
A system for simulating electrical and thermal characteristics of electronic components on a printed circuit board, comprising: an electronic circuit board comprising a control portion and a load portion, said load portion comprising a plurality of electrical loads arranged in load groups at predetermined locations on said electronic circuit board, said control portion comprising programmable means for selectively activating said load groups to simulate the electrical and thermal load characteristics of electronic components on said electronic circuit board.
Claim 11
Dependent Claim
23 words
The system of claim 8, said programmable means for selectively activating said load groups comprising logic control circuitry for addressing individual load groups.
Claim 12
Dependent Claim
41 words
The system of claim 8, wherein said load groups are placed at predetermined locations on said printed circuit board to simulate the electrical load and thermal dissipation characteristics of electronic components operating at said predetermined locations on said printed circuit board.
Claim 13
Dependent Claim
16 words
The system of claim 8, said plurality of electrical loads comprising a plurality of resistive loads.
Claim 14
Dependent Claim
27 words
The system of claim 11, said plurality of electrical loads further comprising active devices forming an electrical load and further controlling the operation of said resistive loads.
Claim 15
Dependent Claim
60 words
A programmable load board for simulating thermal dissipation characteristics of an electronic circuit board, comprising: a plurality of electrical loads arranged in a plurality of load groups on said load board, each of said load groups producing heat when activated; and programmable means for selectively activating said load groups to simulate the thermal dissipation characteristics of the electronic circuit board.
Claim 16
Dependent Claim
60 words
A programmable load board for simulating thermal dissipation characteristics of an electronic circuit board, comprising: a plurality of electrical loads arranged in a plurality of load groups on said load board, each of said load groups producing heat when activated; and programmable means for selectively activating said load groups to simulate the thermal dissipation characteristics of the electronic circuit board.
Claim 17
Dependent Claim
55 words
The programmable load board of claim 13, wherein: said load groups are positioned at different locations on said load board to simulate components at various locations thereon; and said programmable means comprises means selectively adjusting said load groups being activated to simulate thermal dissipation of a component at a given location on said load board.
Claim 18
Dependent Claim
70 words
A programmable load board for simulating electrical load and thermal dissipation characteristics of an electronic circuit board, comprising: a plurality of electrical loads arranged in a plurality of load groups on said board, each of said load groups producing a predetermined quantity of electrical load and heat; and programmable means for selectively activating said load groups to simulate the electrical load and thermal dissipation characteristics of the electronic circuit board.
Claim 19
Dependent Claim
70 words
A programmable load board for simulating electrical load and thermal dissipation characteristics of an electronic circuit board, comprising: a plurality of electrical loads arranged in a plurality of load groups on said board, each of said load groups producing a predetermined quantity of electrical load and heat; and programmable means for selectively activating said load groups to simulate the electrical load and thermal dissipation characteristics of the electronic circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-09 | 1997-11-08 | 1998-05-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-09 | 2001-11-08 | 2002-05-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-09 | 2005-11-08 | 2006-05-10 | $7700.00 | Window Closed / Lapsed |