US5296649A
Expired / Lapsed
US
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Solder-coated printed circuit board and method of manufacturing the same
Assignee: Furukawa Electric Co Ltd
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Filing: 1992-03-17
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Granted: 1994-03-22
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Expires: 2012-03-17
Abstract
Abstract A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H<W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W>D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
Inventors
- 👤 Izumi Kosuga
- 👤 Kenichi Fuse
- 👤 Takao Fukunaga
- 👤 Hirokazu Shiroishi
- 👤 Masanao Kohno
- 👤 Hisao Irie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:59
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; B23K35/22; B23K35/34; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2201/09818; H05K2201/09918; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/04; H05K2203/0435; H05K3/341; H05K3/3421; H05K3/3452; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
127 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having as older layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder alloy to an organic acid, and wherein a projecting height H of each pad from the surface of the board body and a width W of each pad satisfy the relation 2H<W.
Claim 2
Dependent Claim
127 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having as older layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder alloy to an organic acid, and wherein a projecting height H of each pad from the surface of the board body and a width W of each pad satisfy the relation 2H<W.
Claim 3
Dependent Claim
32 words
A circuit board according to claim 1, wherein the solder layer contains an Sn-Pb alloy formed by a substitution reaction between a lead salt of an organic acid and a tin powder.
Claim 4
Dependent Claim
33 words
A circuit board according to claim 1, wherein the solder layer contains an Sn-Pb-Bi alloy formed by a substitution reaction between a lead salt of an organic acid and an Sn-Bi alloy powder.
Claim 5
Dependent Claim
33 words
A circuit board according to claim 1, wherein the solder layer contains an Sn-Pb-In alloy formed by a subsitutution reaction between a lead salt of an organic acid and an Sn-In alloy powder.
Claim 6
Independent Claim
117 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads each satisfying a relation 2H<W, where H is a projecting height of each pad from a board body surface and W is a width of each pad, on the board body; and forming a solder layer on each pad, the solder layer being formed by a substitution between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid.
Claim 7
Independent Claim
117 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads each satisfying a relation 2H<W, where H is a projecting height of each pad from a board body surface and W is a width of each pad, on the board body; and forming a solder layer on each pad, the solder layer being formed by a substitution between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid.
Claim 8
Dependent Claim
146 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having a solder layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid, the plurality of pads being arranged at a pitch of not more than 0.5 mm to form a pad array, and wherein a width of each of said pads located at two ends of the pad array is larger than that of a pad located therebetween.
Claim 9
Dependent Claim
146 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having a solder layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid, the plurality of pads being arranged at a pitch of not more than 0.5 mm to form a pad array, and wherein a width of each of said pads located at two ends of the pad array is larger than that of a pad located therebetween.
Claim 10
Dependent Claim
32 words
A circuit board according to claim 6, wherein the solder layer contains an Sn-Pb alloy formed by a substitution reaction between a lead salt of an organic acid and a tin powder.
Claim 11
Dependent Claim
33 words
A circuit board according to claim 6, wherein the solder layer contains an Sn-Pb-Bi alloy formed by a substitution reaction between a lead salt of an organic acid and an Sn-Bi alloy powder.
Claim 12
Dependent Claim
33 words
A circuit board according to claim 6, wherein the solder layer contains an Sn-Pb-In alloy formed by a substitution reaction between a lead salt of an organic acid and an Sn-In alloy powder.
Claim 13
Independent Claim
136 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads on the board body to form a pad array which has a pitch of not more than 0.5 mm and in which a width of each of said pads at two ends of the pad array is larger than that of a pad located therebetween; and forming a solder layer on each of said plurality of pads, the solder layer being formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid.
Claim 14
Independent Claim
136 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads on the board body to form a pad array which has a pitch of not more than 0.5 mm and in which a width of each of said pads at two ends of the pad array is larger than that of a pad located therebetween; and forming a solder layer on each of said plurality of pads, the solder layer being formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid.
Claim 15
Dependent Claim
137 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having a solder layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid, wherein the plurality of pads are arranged at a pitch of not more than 0.5 mm to form a pad array, and a width W of each pad and a pad-to-pad distance D satisfy a relation W>D.
Claim 16
Dependent Claim
137 words
A solder-coated printed circuit board comprising: a printed circuit board body; and a plurality of pads formed on a surface portion of the board body and each pad having a solder layer of a thickness necessary for soldering a parts lead, wherein the solder layer is of a type formed by a substitution reaction between (a) one of a powder of a metal having the highest ionization tendency among metals constituting the solder layer and a powder of an alloy thereof, and (b) a salt formed by bonding another metal or metals in the solder layer to an organic acid, wherein the plurality of pads are arranged at a pitch of not more than 0.5 mm to form a pad array, and a width W of each pad and a pad-to-pad distance D satisfy a relation W>D.
Claim 17
Dependent Claim
32 words
A circuit board according to claim 1, wherein the solder layer contains an Sn-Pb alloy formed by a substitution reaction between a lead salt of an organic acid and a tin powder.
Claim 18
Dependent Claim
33 words
A circuit board according to claim 11, wherein the solder layer contains an Sn-Pb-Bi alloy formed by a substitution reaction between a lead salt of an organic acid and an Sn-Bi alloy powder.
Claim 19
Dependent Claim
33 words
A circuit board according to claim 11, wherein the solder layer contains an Sn-Pb-In alloy formed by a substitution reaction between a lead salt of an organic acid and an Sn-In alloy powder.
Claim 20
Independent Claim
114 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads on the board body at a pitch of not more than 0.5 mm such that a width W of each pad and a pad-to-pad distance D satisfy a relation W>D; and forming a solder layer on each pad, the solder layer being formed by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding an other metal or metals in the solder layer to an organic acid.
Claim 21
Independent Claim
114 words
A method of manufacturing a solder-coated printed circuit board, comprising the steps of: preparing a printed circuit board body; forming a plurality of pads on the board body at a pitch of not more than 0.5 mm such that a width W of each pad and a pad-to-pad distance D satisfy a relation W>D; and forming a solder layer on each pad, the solder layer being formed by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding an other metal or metals in the solder layer to an organic acid.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-21 | 1997-09-20 | 1998-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-21 | 2001-09-20 | 2002-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-21 | 2005-09-20 | 2006-03-22 | $7700.00 | Window Closed / Lapsed |