Patent US5294830A successfully refreshed from Google Patents.
US5294830A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for indirect impingement cooling of integrated circuit chips
Assignee: International Business Machines Corp
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Filing: 1991-05-21
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Granted: 1994-03-15
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Expires: 2011-05-21
Abstract
Abstract An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.
Inventors
- 👤 Steven P. Young
- 👤 John Acocella
- 👤 Albert J. Fahey
- 👤 Gaetano P. Messina
- 👤 Seaho Song
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:40
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H10W40/70; H10W40/77; H10W40/774; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
84 words
A thermal conduction module comprising: a substrate having a chip-carrying surface; at least one integrated circuit chip on said substrate; a deformable, liquid-impermeable, thermally conductive film extending over an upper surface of said chip; and a piston having a lower surface for urging said film against said chip upper surface, the piston lower surface containing at least one open channel permitting coolant passage and wherein said coolant contacts said film for conveying heat from said chip without direct contact between said coolant and chip.
Claim 2
Dependent Claim
84 words
A thermal conduction module comprising: a substrate having a chip-carrying surface; at least one integrated circuit chip on said substrate; a deformable, liquid-impermeable, thermally conductive film extending over an upper surface of said chip; and a piston having a lower surface for urging said film against said chip upper surface, the piston lower surface containing at least one open channel permitting coolant passage and wherein said coolant contacts said film for conveying heat from said chip without direct contact between said coolant and chip.
Claim 3
Dependent Claim
14 words
The thermal conduction module of claim 1 wherein said film comprises a metal foil.
Claim 4
Dependent Claim
18 words
The thermal conduction module of claim 1 wherein said piston lower surface contains a plurality of said channels.
Claim 5
Dependent Claim
35 words
The thermal conduction module of claim 1 wherein said piston further includes at least one opening through the body of said piston for passage of said coolant to said channel on said piston lower surface.
Claim 6
Dependent Claim
54 words
The thermal conduction module of claim 1 wherein said piston further includes a central opening through the body of said piston to said lower surface for passage and impingement of said coolant against said film and wherein said piston lower surface contains a plurality of said channels extending radially outwardly from said central passageway.
Claim 7
Dependent Claim
20 words
The thermal conduction module of claim 1 wherein said film comprises a metal foil of thickness less than 0.020 in.
Claim 8
Dependent Claim
65 words
The thermal conduction module of claim 1 wherein said module contains a single film covering a plurality of chips mounted on a planar substrate surface, and wherein said module includes an independently suspended piston corresponding to each of said chips, said film and piston being adapted to conform said film against a chip whose upper surface is tilted out of the plane of the substrate.
Claim 9
Dependent Claim
17 words
The thermal conduction module of claim 1 wherein said piston is made of a non-electrically conductive material.
Claim 10
Dependent Claim
55 words
The thermal conduction module of claim 1 wherein said module contains a plurality of chips having different sizes or power consumption mounted on a substrate surface, and wherein said module includes a plurality of pistons, each piston having cooling characteristics corresponding to each of said chips to match cooling requirements at the individual chip locations.
Claim 11
Independent Claim
162 words
An apparatus for cooling at least one integrated circuit chip mounted on a substrate comprising: a flexible metal foil for contacting the surface of said chip; a housing over said foil forming a water-tight enclosure; an inlet in said housing for a fluid coolant; at least one piston disposed within said housing, said at least one piston having a lower face contacting said foil at a position corresponding to said at least one chip, said piston containing a passageway from said inlet to said lower face and plurality of channels on said lower face for flowing said coolant along said foil; an outlet in said housing for spent coolant from the piston channels; and an independent suspension associated with said at least one piston for urging said piston lower face against said foil to conform said foil against said at least one chip surface whereby heat may be thermally conducted from said chip to said foil for subsequent removal by said coolant.
Claim 12
Independent Claim
162 words
An apparatus for cooling at least one integrated circuit chip mounted on a substrate comprising: a flexible metal foil for contacting the surface of said chip; a housing over said foil forming a water-tight enclosure; an inlet in said housing for a fluid coolant; at least one piston disposed within said housing, said at least one piston having a lower face contacting said foil at a position corresponding to said at least one chip, said piston containing a passageway from said inlet to said lower face and plurality of channels on said lower face for flowing said coolant along said foil; an outlet in said housing for spent coolant from the piston channels; and an independent suspension associated with said at least one piston for urging said piston lower face against said foil to conform said foil against said at least one chip surface whereby heat may be thermally conducted from said chip to said foil for subsequent removal by said coolant.
Claim 13
Dependent Claim
15 words
The apparatus of claim 10 wherein said foil has a thickness less than 0.020 in.
Claim 14
Dependent Claim
39 words
The apparatus of claim 10 wherein said at least one piston is cylindrical in shape with said passageway along a central bore thereof, and wherein said channels extend radially outwardly from said central bore along the piston lower face.
Claim 15
Independent Claim
91 words
An apparatus for cooling at least one integrated circuit chip comprising: a deformable, liquid-impermeable, thermally conductive film for contacting upper surfaces of said chip; a housing over said film forming a water-tight enclosure; an inlet in said housing for a coolant; at least one piston disposed within said housing, said piston having a lower face contacting said film at a position over said chips, said piston having at least one channel on said lower face for directing said coolant along said film; and an outlet in said housing for spent coolant.
Claim 16
Independent Claim
91 words
An apparatus for cooling at least one integrated circuit chip comprising: a deformable, liquid-impermeable, thermally conductive film for contacting upper surfaces of said chip; a housing over said film forming a water-tight enclosure; an inlet in said housing for a coolant; at least one piston disposed within said housing, said piston having a lower face contacting said film at a position over said chips, said piston having at least one channel on said lower face for directing said coolant along said film; and an outlet in said housing for spent coolant.
Claim 17
Dependent Claim
12 words
The apparatus of claim 13 wherein said film comprises a metal foil.
Claim 18
Dependent Claim
16 words
The apparatus of claim 13 wherein said piston lower face contains a plurality of said channels.
Claim 19
Dependent Claim
33 words
The apparatus of claim 13 wherein said piston further includes at least one opening through the body of said piston for passage of said coolant to said channel on said piston lower face.
Claim 20
Dependent Claim
52 words
The apparatus of claim 13 wherein said piston further includes a central opening through the body of said piston to said lower face for passage and impingement of said coolant against said film and wherein said piston lower face contains a plurality of said channels extending radially outwardly from said central passageway.
Claim 21
Dependent Claim
18 words
The apparatus of claim 13 wherein said film comprises a metal foil of thickness less than 0.020 in.
Claim 22
Dependent Claim
51 words
The apparatus of claim 13 further including an independent suspension for said piston for urging said piston lower face against said film to conform said film against said chip surfaces whereby, below the piston, heat may be thermally conducted from said chip to said film for subsequent removal by said coolant.
Claim 23
Dependent Claim
59 words
The apparatus of claim 13 wherein said film covers a plurality of chips mounted on a planar substrate surface, and wherein said housing includes an independently suspended piston corresponding to each of said chips, said film and piston being adapted to conform said film against a chip whose upper surface is tilted out of the plane of the substrate.
Claim 24
Dependent Claim
15 words
The apparatus of claim 13 wherein said piston is made of a non-electrically conductive material.
Claim 25
Dependent Claim
50 words
The apparatus of claim 13 adapted for cooling a plurality of chips having different sizes or power consumption mounted on a substrate surface, said apparatus including a plurality of pistons, each piston having cooling characteristics corresponding to each of said chips to match cooling requirements at the individual chip locations.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-14 | 1997-09-13 | 1998-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-14 | 2001-09-13 | 2002-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-14 | 2005-09-13 | 2006-03-15 | $7700.00 | Window Closed / Lapsed |