US4153107A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Temperature equalizing element for a conduction cooling module
Assignee: International Business Machines Corp
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Filing: 1977-06-30
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Granted: 1979-05-08
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Expires: 1997-06-30
Abstract
Abstract A thermal conduction element having a predetermined diminished diameter portion of a predetermined length along the length of the thermal conduction element is provided within each of the housing member openings located opposite the low-power components in a conduction cooling module. The thermal conduction elements and housing form part of a heat transfer path for removing heat from electronic components to be cooled. The thermal conduction elements and the interfaces associated therewith provide an increased thermal resistance, thereby, increasing the heat transfer path thermal resistance to prevent the low-power electronic components from being cooled below the lower temperature limit and allowing them to operate at a higher temperature.
Inventors
- 👤 Vincent W. Antonetti
- 👤 Omkarath R. Gupta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 17:33
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/70; H10W40/77; H10W40/774
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
164 words
In a conduction cooling module of the type having a conduction heat transfer path for removing heat from electronic components to be cooled, at least one low-power electronic component to be cooled within said module; a housing member included in the heat transfer path; said housing member having openings therein, one opposite each of the electronic components to be cooled; a thermal conduction element located in each of said housing member openings defining a gap between said thermal conduction element and said housing member; a predetermined diminished diameter portion of a predetermined length extending intermediate full diameter end portions of said thermal conduction elements located in said housing member opening located opposite said low-power electronic components thereby increasing the gap between said thermal conduction elements and said housing member which increases the thermal resistance of the path for the low-power electronic components; and resilient means urging said thermal conduction elements against the electronic components to be cooled to form a heat transfer interface therebetween.
Claim 2
Dependent Claim
164 words
In a conduction cooling module of the type having a conduction heat transfer path for removing heat from electronic components to be cooled, at least one low-power electronic component to be cooled within said module; a housing member included in the heat transfer path; said housing member having openings therein, one opposite each of the electronic components to be cooled; a thermal conduction element located in each of said housing member openings defining a gap between said thermal conduction element and said housing member; a predetermined diminished diameter portion of a predetermined length extending intermediate full diameter end portions of said thermal conduction elements located in said housing member opening located opposite said low-power electronic components thereby increasing the gap between said thermal conduction elements and said housing member which increases the thermal resistance of the path for the low-power electronic components; and resilient means urging said thermal conduction elements against the electronic components to be cooled to form a heat transfer interface therebetween.
Claim 3
Dependent Claim
52 words
In a conduction cooling module according to claim 1, wherein said predetermined diminished diameter portion of a predetermined length extending intermediate full diameter end portions of said thermal conduction element is symmetrical about the center of the length of said thermal conduction element thereby leaving full diameter end portions of equal lengths.
Claim 4
Dependent Claim
27 words
In a conduction cooling module according to claim 1, wherein said increased heat transfer gap includes a heat transfer medium to provide heat transfer thereacross by conduction.
Claim 5
Dependent Claim
27 words
In a conduction cooling module according to claim 3, wherein said increased heat transfer gap includes thermal conductive inert gas to provide heat transfer thereacross by conduction.
Claim 6
Dependent Claim
17 words
In a conduction cooling module according to claim 4, wherein said thermal conductive inert gas is helium.
Claim 7
Dependent Claim
18 words
In a conduction cooling module according to claim 1, wherein said thermal conduction element is made of copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-05-07 | 1982-11-06 | 1983-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-05-07 | 1986-11-06 | 1987-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-05-07 | 1990-11-06 | 1991-05-08 | $7700.00 | Window Closed / Lapsed |