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US3536892A Expired / Lapsed US ⏱️ 0.0 years remaining

Device for thermal processing of semiconductor wafers

Assignee: Siemens AG
•
Filing: 1968-04-04
•
Granted: 1970-10-27
•
Expires: 1988-04-04
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Abstract

No abstract record available.

Inventors

  • 👤 Albert Walther
  • 👤 Erhard Sussmann

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 04:14
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/46

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

US606792A Cited
US1514228A Cited
US1547647A Cited
US2691717A Cited
US2933586A Cited
US3151006A Cited
US3381114A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1973-10-26 1974-04-27 1974-10-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1977-10-26 1978-04-27 1978-10-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1981-10-26 1982-04-27 1982-10-27 $7700.00 Window Closed / Lapsed

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