Process for producing a developer having a low metal ion level

Claim 2

A process for producing a developer containing a surfactant, having a very low level of metal ions, which comprises: a) treating an acidic ion exchange resin with water, followed by a mineral acid solution to reduce the level of sodium and iron ions in the ion exchange resin to less than 500 ppb each; b) providing a solution of 1 to 40 weight percent of a surfactant in a deionized solvent; c) passing the surfactant solution through the ion exchange resin and reducing the level of total sodium and iron ions in the solution to less than 200 ppb each; d) formulating a developer composition containing a surfactant by providing an admixture of: (1) the ion exchange resin treated surfactant solution in a suitable deionized solvent; (2) a suitable metal ion free developer.

Claim 3

The process of claim 1 wherein, prior to the ion exchange resin is treated with a solvent which is the same as, or at least compatible with, the solvent for the component or mixture of components which is to be treated with the ion exchange resin.

Claim 4

The process of claim 2 wherein the ion exchange resin is treated with sufficient new solvent to substantially remove other solvents and to saturate the ion exchange resin with the new solvent.

Claim 5

The process of claim 1 wherein the deionized solvent is selected from the group consisting of water, ethanol and a water/ethanol mixture.

Claim 6

The process of claim 1 wherein the developer is an ammonium hydroxide.

Claim 7

The process of claim 5 wherein the developer is tetramethyl ammonium hydroxide.

Claim 8

A process for producing a semiconductor device by producing a photoimage on a suitable substrate comprising: a) treating an acidic ion exchange resin with water, followed by a mineral acid solution to reduce the level of sodium and iron ions in the ion exchange resin to less than 500 ppb each; b) providing a solution of 1 to 40 weight percent of a surfactant in a deionized solvent; c) passing the surfactant solution through the ion exchange resin and reducing the level of total sodium and iron ions in the solution to less than 200 ppb each; d) formulating a developer composition containing a surfactant by providing an admixture of: (1) the ion exchange resin treated surfactant solution in a suitable deionized solvent; (2) a suitable metal ion free developer; e) providing an admixture of: 1) a photosensitive component in an amount sufficient to photosensitize the photoresist composition, 2) a water insoluble, aqueous alkali soluble novolak resin and 3) a suitable solvent; f) coating a suitable substrate with the photoresist composition; g) heat treating the coated substrate until substantially all of the solvent is removed; h) image-wise exposing the photoresist composition; and i) removing the image-wise exposed areas of the photoresist composition with said developer.

Claim 9

A process for producing a semiconductor device by producing a photoimage on a suitable substrate comprising: a) treating an acidic ion exchange resin with water, followed by a mineral acid solution to reduce the level of sodium and iron ions in the ion exchange resin to less than 500 ppb each; b) providing a solution of 1 to 40 weight percent of a surfactant in a deionized solvent; c) passing the surfactant solution through the ion exchange resin and reducing the level of total sodium and iron ions in the solution to less than 200 ppb each; d) formulating a developer composition containing a surfactant by providing an admixture of: (1) the ion exchange resin treated surfactant solution in a suitable deionized solvent; (2) a suitable metal ion free developer; e) providing an admixture of: 1) a photosensitive component in an amount sufficient to photosensitize the photoresist composition, 2) a water insoluble, aqueous alkali soluble novolak resin and 3) a suitable solvent; f) coating a suitable substrate with the photoresist composition; g) heat treating the coated substrate until substantially all of the solvent is removed; h) image-wise exposing the photoresist composition; and i) removing the image-wise exposed areas of the photoresist composition with said developer.

Claim 10

The process of claim 7 wherein the developer is an ammonium hydroxide.

Claim 11

The process of claim 8 wherein the developer is tetramethyl ammonium hydroxide.