US5281320A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer coating system
Assignee: Novellus Systems Inc
•
Filing: 1991-04-04
•
Granted: 1994-01-25
•
Expires: 2011-04-04
Abstract
Abstract Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock, and an intermittently rotting vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. Both surfaces of wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment minimized.
Inventors
- 👤 Frederick T. Turner
- 👤 Martin A. Hutchinson
- 👤 R. Howard Shaw
- 👤 Lawrence T. Lamont, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/30; H10P72/33; H10P72/3308; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/50; C23C14/54; C23C14/541; C23C14/56; H10P72/04; H10P72/0431; H10P72/0434; H10P72/70; H10P72/76; H10P72/7602
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
271 words
Apparatus for individually processing semiconductor wafers held stationary during processing, said apparatus comprising: processing chamber means having an entrance opening for wafers in a wall thereof; a wafer carrier assembly movably supported inside said chamber means, said carrier assembly comprising wafer holding means for releasably holding a wafer adjacent the periphery of the wafer and supporting the wafer for resilient movement; said wafer carrier assembly further comprising sealing means in the form of a first continuous annular planar sealing surface; pressure sealing means having a second continuous annular planar sealing surface matching said first annular sealing surface; said wafer holding means being positioned on said carrier assembly inwardly of said first annular sealing surface, whereby a wafer in said holding means is supported for resilient movement relative to said first annular sealing surface; wafer processing means spaced from said entrance opening for processing a wafer held on said carrier assembly by said wafer holding means; means for moving said carrier assembly to move said wafer holding means along a first path for positioning said wafer holding means selectively in alignment with one or the other of said entrance opening and said processing means, said moving means including means for stopping said movement along said first path when said wafer holding means is in alignment with either said entrance opening or said processing means; and means for causing relative movement between said first and second annular planar sealing surfaces in a direction transverse to said first path when said carrier assembly movement along said first path is stopped, whereby a seal is formed between said first and second annular planar sealing surfaces.
Claim 2
Dependent Claim
271 words
Apparatus for individually processing semiconductor wafers held stationary during processing, said apparatus comprising: processing chamber means having an entrance opening for wafers in a wall thereof; a wafer carrier assembly movably supported inside said chamber means, said carrier assembly comprising wafer holding means for releasably holding a wafer adjacent the periphery of the wafer and supporting the wafer for resilient movement; said wafer carrier assembly further comprising sealing means in the form of a first continuous annular planar sealing surface; pressure sealing means having a second continuous annular planar sealing surface matching said first annular sealing surface; said wafer holding means being positioned on said carrier assembly inwardly of said first annular sealing surface, whereby a wafer in said holding means is supported for resilient movement relative to said first annular sealing surface; wafer processing means spaced from said entrance opening for processing a wafer held on said carrier assembly by said wafer holding means; means for moving said carrier assembly to move said wafer holding means along a first path for positioning said wafer holding means selectively in alignment with one or the other of said entrance opening and said processing means, said moving means including means for stopping said movement along said first path when said wafer holding means is in alignment with either said entrance opening or said processing means; and means for causing relative movement between said first and second annular planar sealing surfaces in a direction transverse to said first path when said carrier assembly movement along said first path is stopped, whereby a seal is formed between said first and second annular planar sealing surfaces.
Claim 3
Dependent Claim
17 words
Apparatus as claimed in claim 1 wherein said pressure sealing means is aligned with said entrance opening.
Claim 4
Dependent Claim
90 words
Apparatus as claimed in claim 1 wherein said wafer holding means is adapted for movement between an open position for accepting a wafer and a closed position for holding a wafer; said apparatus further comprising moveable chuck means supported outside said chamber means and adapted to releasably support a wafer; and means for moving said chuck means to insert a wafer through said entrance opening and automatically release a wafer directly to said wafer holding means on said carrier assembly when said aperture is in alignment with said entrance opening.
Claim 5
Dependent Claim
34 words
Apparatus as claimed in claim 3 further comprising actuating means for contacting and moving said movable wafer holding means, said actuating means being connected to said chuck means for movement with said chuck means.
Claim 6
Dependent Claim
19 words
Apparatus as claimed in claim 4 further comprising means for moving said actuating means relative to said chuck means.
Claim 7
Dependent Claim
223 words
Apparatus for individually processing semiconductor wafers comprising: processing chamber means having an entrance opening for wafers in a wall thereof; a wafer carrier assembly movably supported inside said chamber means, said carrier assembly comprising wafer holding means for releasably holding a wafer adjacent the periphery of the wafer and supporting the wafer for resilient movement; said carrier assembly further comprising sealing means in the form of a first continuous annular planar sealing surface; pressure sealing means having a second continuous annular sealing surface matching said first annular planar sealing surface and adapted for sealing therewith; said wafer holding means being positioned on said carrier assembly inwardly of said first annular planar sealing surface, whereby a wafer in said holding means is supported for resilient movement relative to said first annular sealing surface; wafer processing means spaced from said entrance opening for processing a wafer held on said carrier assembly by said wafer holding means; and means for moving said carrier assembly to move said wafer holding means along a first path for positioning said wafer holding means selectively in alignment with one or the other of said entrance opening and said processing means, said moving means including means for stopping said movement along said first path when said wafer holding means is in alignment with either said entrance opening or said processing means.
Claim 8
Dependent Claim
223 words
Apparatus for individually processing semiconductor wafers comprising: processing chamber means having an entrance opening for wafers in a wall thereof; a wafer carrier assembly movably supported inside said chamber means, said carrier assembly comprising wafer holding means for releasably holding a wafer adjacent the periphery of the wafer and supporting the wafer for resilient movement; said carrier assembly further comprising sealing means in the form of a first continuous annular planar sealing surface; pressure sealing means having a second continuous annular sealing surface matching said first annular planar sealing surface and adapted for sealing therewith; said wafer holding means being positioned on said carrier assembly inwardly of said first annular planar sealing surface, whereby a wafer in said holding means is supported for resilient movement relative to said first annular sealing surface; wafer processing means spaced from said entrance opening for processing a wafer held on said carrier assembly by said wafer holding means; and means for moving said carrier assembly to move said wafer holding means along a first path for positioning said wafer holding means selectively in alignment with one or the other of said entrance opening and said processing means, said moving means including means for stopping said movement along said first path when said wafer holding means is in alignment with either said entrance opening or said processing means.
Claim 9
Dependent Claim
64 words
Apparatus as claimed in claim 6 further comprising: a moveable chuck means supported outside said chamber means and adapted to releasably support a wafer; and means for moving said chuck means to insert a wafer through said entrance opening and automatically release a wafer directly to said wafer holding means on said carrier assembly when said apertures is in alignment with said entrance opening.
References Cited (Backward Citations)
US1953492A
Cited
US2337329A
Cited
US2865643A
Cited
US2864332A
Cited
US3159395A
Cited
US3340176A
Cited
US3521765A
Cited
US3625384A
Cited
US3566960A
Cited
US3652444A
Cited
US3598083A
Cited
US3721210A
Cited
US3856654A
Cited
US3838028A
Cited
US3874525A
Cited
US3915117A
Cited
US3921572A
Cited
US3977955A
Cited
US4060470A
Cited
US3981791A
Cited
US4047624A
Cited
US3983838A
Cited
US4094722A
Cited
US4068814A
Cited
JPS54150333A
Cited
US4261808A
Cited
US4228358A
Cited
US4261762A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-24 | 1997-07-26 | 1998-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-24 | 2001-07-26 | 2002-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-24 | 2005-07-26 | 2006-01-25 | $7700.00 | Window Closed / Lapsed |