Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
30 words
A method for producing a conductive oxide pattern comprising: forming a conductive oxide layer on an insulating substrate; patterning said conductive oxide layer; and oxidizing the patterned conductive oxide layer.
Claim 2
Independent Claim
30 words
A method for producing a conductive oxide pattern comprising: forming a conductive oxide layer on an insulating substrate; patterning said conductive oxide layer; and oxidizing the patterned conductive oxide layer.
Claim 3
Dependent Claim
29 words
The method for producing a conductive oxide pattern in claim 1 wherein the temperature of said substrate is not more than 100° C. when said forming step is performed.
Claim 4
Dependent Claim
28 words
The method for producing a conductive oxide pattern in claim 2 wherein said oxidizing step is performed at a temperature in the range of 100° to 400° C.
Claim 5
Independent Claim
90 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate at a substrate temperature not higher than 100° C.; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer with an etchant consisting essentially of hydrochloric acid in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern; and oxidizing the remaining portion of said conductive oxide layer to produce said conductive oxide pattern.
Claim 6
Independent Claim
90 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate at a substrate temperature not higher than 100° C.; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer with an etchant consisting essentially of hydrochloric acid in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern; and oxidizing the remaining portion of said conductive oxide layer to produce said conductive oxide pattern.
Claim 7
Dependent Claim
19 words
The method for producing a conductive oxide pattern in claim 4 wherein said mask pattern is a photoresist pattern.
Claim 8
Dependent Claim
29 words
The method for producing a conductive oxide pattern in claim 5 wherein said oxidizing step is performed at a temperature in the range of 100° C. to 400° C.
Claim 9
Dependent Claim
24 words
The method for producing a conductive oxide pattern in claim 6 wherein the concentration of said hydrochloric acid is not more than 6 normality.
Claim 10
Dependent Claim
22 words
The method for producing a conductive oxide pattern in claim 4 wherein said conductive oxide pattern is made of indium tin oxide.
Claim 11
Dependent Claim
21 words
The method for producing a conductive oxide pattern in claim 4 wherein said conductive oxide pattern is made of tin oxide.
Claim 12
Independent Claim
112 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate at a substrate temperature not higher than 100° C.; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer with an etchant consisting essentially of hydrochloric acid in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern by a plasma ashing with said substrate heated; oxidizing the remaining portion of said conductive oxide layer, wherein said removing step and said oxidizing step are sequentially performed in a common reaction container with an oxygen containing plasma.
Claim 13
Independent Claim
112 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate at a substrate temperature not higher than 100° C.; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer with an etchant consisting essentially of hydrochloric acid in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern by a plasma ashing with said substrate heated; oxidizing the remaining portion of said conductive oxide layer, wherein said removing step and said oxidizing step are sequentially performed in a common reaction container with an oxygen containing plasma.
Claim 14
Dependent Claim
19 words
The method for producing a conductive oxide pattern in claim 10 wherein said mask pattern is a photoresist pattern.
Claim 15
Dependent Claim
30 words
The method for producing a conductive oxide pattern in claim 11 wherein the temperature of said substrate is not more than 100° C. when said conductive oxide layer is formed.
Claim 16
Dependent Claim
22 words
The method for producing a conductive oxide pattern in claim 10 wherein the oxidized conductive oxide layer is made of tin oxide.
Claim 17
Dependent Claim
21 words
The method for producing a conductive oxide pattern in claim 11 wherein said removing step is performed in an oxidizing atmosphere.
Claim 18
Independent Claim
101 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern; and forming a second layer on said substrate and the remaining portion of said conductive oxide layer; wherein the formation of said second layer includes a step of heating said substrate in an oxidizing atmosphere so that said conductive oxide layer is simultaneously oxidized.
Claim 19
Independent Claim
101 words
A method for producing a conductive oxide pattern comprising the steps of: forming a conductive oxide layer on a substrate; forming a mask pattern on said conductive oxide layer; etching a portion of said conductive oxide layer in order to leave a portion of said conductive oxide layer under said mask pattern remaining; removing said mask pattern; and forming a second layer on said substrate and the remaining portion of said conductive oxide layer; wherein the formation of said second layer includes a step of heating said substrate in an oxidizing atmosphere so that said conductive oxide layer is simultaneously oxidized.
Claim 20
Dependent Claim
21 words
The method for producing a conductive oxide pattern in claim 15 wherein said etching step is performed utilizing a hydrochloric acid.
Claim 21
Dependent Claim
19 words
The method for producing a conductive oxide pattern in claim 16 wherein said mask pattern is a photoresist pattern.
Claim 22
Dependent Claim
30 words
The method for producing a conductive oxide pattern in claim 17 wherein the temperature of said substrate is not more than 100° C. when said conductive oxide layer is formed.
Claim 23
Dependent Claim
24 words
The method for producing a conductive oxide pattern in claim 18 wherein the concentration of said hydrochloric acid is not more than 6 normality.
Claim 24
Dependent Claim
23 words
The method for producing a conductive oxide pattern in claim 16 wherein the oxidized conductive oxide layer is made of indium tin oxide.
Claim 25
Dependent Claim
25 words
A method according to claim 15 wherein said second layer comprises a material selected from the group consisting of silicon oxide, silicon nitride and polyimide.