Patent US5252850A successfully refreshed from Google Patents.
US5252850A
Expired / Lapsed
US
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Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile
Assignee: Roper Technologies Inc
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Filing: 1992-01-27
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Granted: 1993-10-12
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Expires: 2012-01-27
Abstract
Abstract Large area semiconductor wafers such as CCDs typically have a non-flat profile. A vacuum chuck is used to generate a vacuum under the chip to reduce the curvature to conform to the flat profile of the substrate surface through which the vacuum is generated. Other than flat final profiles are useful also.
Inventors
- 👤 William V. Schempp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:59
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/78
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
61 words
Apparatus for mounting a semiconductor chip having an array of imaging cells for capturing an image incident thereto, said apparatus comprising a mounting assembly having a surface for juxtaposition with said chip, said mounting assembly including holes extending therethrough and communicating with said surface for permitting the formation of a vacuum therethrough for conforming a non planar chip to said surface.
Claim 2
Dependent Claim
61 words
Apparatus for mounting a semiconductor chip having an array of imaging cells for capturing an image incident thereto, said apparatus comprising a mounting assembly having a surface for juxtaposition with said chip, said mounting assembly including holes extending therethrough and communicating with said surface for permitting the formation of a vacuum therethrough for conforming a non planar chip to said surface.
Claim 3
Dependent Claim
26 words
Apparatus as set forth in claim 1 wherein said surface is flat, said surface being coated with an adhesive for securing said chip to said surface.
Claim 4
Dependent Claim
18 words
Apparatus as set forth in claim 2 wherein said mounting assembly comprises a rigid substrate for said chip.
Claim 5
Dependent Claim
20 words
Apparatus as set forth in claim 1 wherein said surface has a nonplanar profile different from that of said chip.
Claim 6
Dependent Claim
18 words
Apparatus as set forth in claim 4 wherein said mounting assembly comprises a rigid substrate for said chip.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-11 | 1997-04-12 | 1997-10-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-11 | 2001-04-12 | 2001-10-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-11 | 2005-04-12 | 2005-10-12 | $7700.00 | Window Closed / Lapsed |