Patent US5250451A successfully refreshed from Google Patents.
US5250451A
Expired / Lapsed
US
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Process for the production of thin film transistors
Assignee: Zarbana Digital Fund LLC
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Filing: 1992-04-10
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Granted: 1993-10-05
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Expires: 2012-04-10
Abstract
Abstract Process for the local passivation of a substrate by a hydrogenated amorphous carbon layer and process for producing thin film transistors on said passivated substrate. The local passivation process consists of producing photosensitive resin patterns (3) on the substrate (1), subjecting the structure obtained to a radio-frequency plasma essentially constituted by a hydrocarbon for thus depositing a hydrogenated amorphous carbon layer (6) on the structure and dissolving the resin patterns (3) in order to eliminate the amorphous carbon deposited on the resin, the amorphous carbon deposited on the substrate constituting the said passivation.
Inventors
- 👤 Yannick Chouan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:36
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/60; H10D30/67; H10D30/6704; H10D30/6725; H10D30/674; H10D30/6741; H10D30/6743; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/69; H10P14/6902; Y; Y10; Y10S; Y10S148/00; Y10S148/10; Y10S148/15; Y10S438/00; Y10S438/958
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
179 words
Process for the production of a thin film transistor comprising: a) depositing on an electrically insulating substrate (1) a layer (2) of a first conductive material, b) producing photosensitive resin patterns (3) on the layer of the first conductive material defining the patterns to be etched in said layer, c) eliminating the areas of the first conductive material layer not covered with resin, d) depositing an amorphous hydrogenated carbon layer (6) on the structure obtained in c), e) dissolving the resin patterns in order to eliminate the amorphous carbon deposited on the resin, f) depositing a layer (8) of a semiconductor on the structure obtained in e), g) depositing a layer (9) of a first electrical insulant on the semiconductor layer, h) depositing a layer (10) of a second conductive material on the layer of the first insulant, i) photoengraving the stack of layers of the second conductive material, the first electrical insulant and the semiconductor in order to fix the dimensions of the transistor and j) passivating the structure obtained in i) with a second electrical insulant (12).
Claim 2
Dependent Claim
179 words
Process for the production of a thin film transistor comprising: a) depositing on an electrically insulating substrate (1) a layer (2) of a first conductive material, b) producing photosensitive resin patterns (3) on the layer of the first conductive material defining the patterns to be etched in said layer, c) eliminating the areas of the first conductive material layer not covered with resin, d) depositing an amorphous hydrogenated carbon layer (6) on the structure obtained in c), e) dissolving the resin patterns in order to eliminate the amorphous carbon deposited on the resin, f) depositing a layer (8) of a semiconductor on the structure obtained in e), g) depositing a layer (9) of a first electrical insulant on the semiconductor layer, h) depositing a layer (10) of a second conductive material on the layer of the first insulant, i) photoengraving the stack of layers of the second conductive material, the first electrical insulant and the semiconductor in order to fix the dimensions of the transistor and j) passivating the structure obtained in i) with a second electrical insulant (12).
Claim 3
Dependent Claim
18 words
Process according to claim 1, characterized in that the second electrical insulant (12) is of amorphous hydrogenated carbon.
Claim 4
Dependent Claim
28 words
Process according to claim 1, characterized in that the amorphous carbon film (6) deposited in (d) has a thickness equal to that of the first conductive material film.
Claim 5
Dependent Claim
22 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited from a radio-frequency plasma essentially constituted by hydrocarbon.
Claim 6
Dependent Claim
15 words
Process according to claim 4, characterized in that the plasma is a pure methane plasma.
Claim 7
Dependent Claim
17 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited at ambient temperature.
Claim 8
Dependent Claim
19 words
Process according to claim 1, characterized in that use is made of a substrate self-bias voltage below 55 V.
Claim 9
Dependent Claim
14 words
Process according to claim 1, characterized in that the substrate (1) is of glass.
Claim 10
Dependent Claim
16 words
Process according to claim 1, characterized in that the semiconductor (8) is of amorphous hydrogenated silicon.
Claim 11
Dependent Claim
22 words
Process according to claim 1, characterized in that the deposited amorphous carbon has a resistivity between 10 12 and 10 14 ohms.cm.
Claim 12
Dependent Claim
23 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited using a hydrocarbon pressure of 6.6 to 20 Pa.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-04 | 1997-04-05 | 1997-10-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-04 | 2001-04-05 | 2001-10-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-04 | 2005-04-05 | 2005-10-05 | $7700.00 | Window Closed / Lapsed |