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US5250451A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for the production of thin film transistors

Assignee: Zarbana Digital Fund LLC
•
Filing: 1992-04-10
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Granted: 1993-10-05
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Expires: 2012-04-10
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Abstract

Abstract Process for the local passivation of a substrate by a hydrogenated amorphous carbon layer and process for producing thin film transistors on said passivated substrate. The local passivation process consists of producing photosensitive resin patterns (3) on the substrate (1), subjecting the structure obtained to a radio-frequency plasma essentially constituted by a hydrocarbon for thus depositing a hydrogenated amorphous carbon layer (6) on the structure and dissolving the resin patterns (3) in order to eliminate the amorphous carbon deposited on the resin, the amorphous carbon deposited on the substrate constituting the said passivation.

Inventors

  • 👤 Yannick Chouan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:26
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/60; H10D30/67; H10D30/6704; H10D30/6725; H10D30/674; H10D30/6741; H10D30/6743; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/69; H10P14/6902; Y; Y10; Y10S; Y10S148/00; Y10S148/10; Y10S148/15; Y10S438/00; Y10S438/958

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 179 words
Process for the production of a thin film transistor comprising: a) depositing on an electrically insulating substrate (1) a layer (2) of a first conductive material, b) producing photosensitive resin patterns (3) on the layer of the first conductive material defining the patterns to be etched in said layer, c) eliminating the areas of the first conductive material layer not covered with resin, d) depositing an amorphous hydrogenated carbon layer (6) on the structure obtained in c), e) dissolving the resin patterns in order to eliminate the amorphous carbon deposited on the resin, f) depositing a layer (8) of a semiconductor on the structure obtained in e), g) depositing a layer (9) of a first electrical insulant on the semiconductor layer, h) depositing a layer (10) of a second conductive material on the layer of the first insulant, i) photoengraving the stack of layers of the second conductive material, the first electrical insulant and the semiconductor in order to fix the dimensions of the transistor and j) passivating the structure obtained in i) with a second electrical insulant (12).
Claim 2
Dependent Claim 179 words
Process for the production of a thin film transistor comprising: a) depositing on an electrically insulating substrate (1) a layer (2) of a first conductive material, b) producing photosensitive resin patterns (3) on the layer of the first conductive material defining the patterns to be etched in said layer, c) eliminating the areas of the first conductive material layer not covered with resin, d) depositing an amorphous hydrogenated carbon layer (6) on the structure obtained in c), e) dissolving the resin patterns in order to eliminate the amorphous carbon deposited on the resin, f) depositing a layer (8) of a semiconductor on the structure obtained in e), g) depositing a layer (9) of a first electrical insulant on the semiconductor layer, h) depositing a layer (10) of a second conductive material on the layer of the first insulant, i) photoengraving the stack of layers of the second conductive material, the first electrical insulant and the semiconductor in order to fix the dimensions of the transistor and j) passivating the structure obtained in i) with a second electrical insulant (12).
Claim 3
Dependent Claim 18 words
Process according to claim 1, characterized in that the second electrical insulant (12) is of amorphous hydrogenated carbon.
Claim 4
Dependent Claim 28 words
Process according to claim 1, characterized in that the amorphous carbon film (6) deposited in (d) has a thickness equal to that of the first conductive material film.
Claim 5
Dependent Claim 22 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited from a radio-frequency plasma essentially constituted by hydrocarbon.
Claim 6
Dependent Claim 15 words
Process according to claim 4, characterized in that the plasma is a pure methane plasma.
Claim 7
Dependent Claim 17 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited at ambient temperature.
Claim 8
Dependent Claim 19 words
Process according to claim 1, characterized in that use is made of a substrate self-bias voltage below 55 V.
Claim 9
Dependent Claim 14 words
Process according to claim 1, characterized in that the substrate (1) is of glass.
Claim 10
Dependent Claim 16 words
Process according to claim 1, characterized in that the semiconductor (8) is of amorphous hydrogenated silicon.
Claim 11
Dependent Claim 22 words
Process according to claim 1, characterized in that the deposited amorphous carbon has a resistivity between 10 12 and 10 14 ohms.cm.
Claim 12
Dependent Claim 23 words
Process according to claim 1, characterized in that the amorphous hydrogenated carbon is deposited using a hydrocarbon pressure of 6.6 to 20 Pa.

References Cited (Backward Citations)

US4517733A Cited
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JPS58119669A Cited
US4808833A Cited
EP0284218A1 Cited
JPH01105577A Cited
EP0333208A2 Cited
EP0377365A1 Cited
US5079178A Cited
GB2228745A Cited
EP0381111A2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-10-04 1997-04-05 1997-10-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-10-04 2001-04-05 2001-10-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-10-04 2005-04-05 2005-10-05 $7700.00 Window Closed / Lapsed

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