US5244142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting semiconductor elements
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-11-19
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Granted: 1993-09-14
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Expires: 2011-11-19
Abstract
Abstract A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Inventors
- 👤 Masanori Nishiguchi
- 👤 Atsushi Miki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/241; H10W72/251; H10W72/252; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W80/00; H10W80/161; H10W80/168; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
101 words
A method of mounting semiconductor elements comprising the steps of: providing a plurality of semiconductor elements each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surfaces; forming a resist pattern on an undersurface of a heat sink to align said semiconductor elements; joining heat sinks to said second surfaces; pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning the bump electrodes with said wiring board electrodes; and heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board.
Claim 2
Independent Claim
101 words
A method of mounting semiconductor elements comprising the steps of: providing a plurality of semiconductor elements each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surfaces; forming a resist pattern on an undersurface of a heat sink to align said semiconductor elements; joining heat sinks to said second surfaces; pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning the bump electrodes with said wiring board electrodes; and heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board.
Claim 3
Dependent Claim
29 words
The method of claim 1, further comprising the step of applying a holding resin to said wiring board, said semiconductor elements and said heat sinks after said heating step.
Claim 4
Dependent Claim
25 words
The method of claim 1, wherein the step of joining is performed using solder having a melting point lower than that of the bump electrodes.
Claim 5
Dependent Claim
16 words
The method of claim 1, wherein said wiring board electrodes are formed in a concave shape.
Claim 6
Dependent Claim
16 words
The method of claim 1, wherein said wiring board electrodes are formed in a convex shape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-13 | 1997-03-15 | 1997-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-13 | 2001-03-15 | 2001-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-13 | 2005-03-15 | 2005-09-14 | $7700.00 | Window Closed / Lapsed |