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Method of manufacturing a semiconductor device having a semiconductor body with a buried silicide layer

Assignee: US Philips Corp
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Filing: 1992-03-09
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Granted: 1993-08-17
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Expires: 2012-03-09
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Abstract

Abstract A method of manufacturing a semiconductor device in which a thin buried silicide layer is formed by implantation includes the step of first forming an amorphous layer by implantation, which layer is then converted into the buried silicide layer by a heat treatment. A sufficiently thin buried silicide layer, of about 10 nm thickness, can be obtained in this manner, and the resulting structure is suitable, for example, for the manufacture of a metal-base transistor.

Inventors

  • 👤 Alfred H. Van Ommen
  • 👤 Jozef J. M. Ottenheim
  • 👤 Erik H. A. Dekempeneer
  • 👤 Gerrit C. van Hoften

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 20:48
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10D; H10D30/00; H10D30/01; H10D30/012; H10D48/00; H10D48/01; H10D48/031; H10D48/032; H10P30/208; Y; Y10; Y10S; Y10S148/00; Y10S148/147

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 80 words
A method of manufacturing a semiconductor device, in which a buried metal silicide layer is formed in a monocrystalline silicon body, comprising: implanting ions of an element different from said metal in said silicon body to form a buried amorphous layer in said silicon body; then implanting metal ions in said buried amorphous layer; and then heat treating said silicon body so that said metal ions react with silicon in said amorphous layer to form said buried metal silicide layer.
Claim 2
Independent Claim 80 words
A method of manufacturing a semiconductor device, in which a buried metal silicide layer is formed in a monocrystalline silicon body, comprising: implanting ions of an element different from said metal in said silicon body to form a buried amorphous layer in said silicon body; then implanting metal ions in said buried amorphous layer; and then heat treating said silicon body so that said metal ions react with silicon in said amorphous layer to form said buried metal silicide layer.
Claim 3
Dependent Claim 16 words
A method as claimed in claim 1, wherein silicon ions are implanted in said silicon body.
Claim 4
Dependent Claim 19 words
A method as claimed in claim 1, wherein ions of a rare gas are implanted in said silicon body.
Claim 5
Dependent Claim 17 words
A method as claimed in claim 1, wherein cobalt ions are implanted in said buried amorphous layer.
Claim 6
Dependent Claim 17 words
A method as claimed in claim 1, wherein nickel ions are implanted in said buried amorphous layer.

References Cited (Backward Citations)

US3726719A Cited
US4096622A Cited
US4558507A Cited
US4577396A Cited
US4875082A Cited
EP0259282A2 Cited
EP0271232A1 Cited
US4816421A Cited
US5122479A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-08-16 1997-02-15 1997-08-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-08-16 2001-02-15 2001-08-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-08-16 2005-02-15 2005-08-17 $7700.00 Window Closed / Lapsed

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