Process for growing crystal

Claim 2

A process of growing a monocrystal on an insulating film having at least one opening provided on a metal electrode, which comprises: providing a non-monocrystalline semiconductor film on a substrate having a metal electrode and an insulating film, causing said semiconductor film and said insulating film to undergo a solid phase reaction at the interface therebetween, forming a monocrystalline cohering body of said semiconductor film at each said opening of said insulating film by applying annealing for cohesion of said semiconductor film on said metal electrode, wherein said annealing and said solid phase reaction are carried out in an atmosphere containing hydrogen gas and allowing a monocrystal to grow with said monocrystalline cohering body as a seed.

Claim 3

A process according to claim 1, wherein said insulating film comprises silicon oxide.

Claim 4

A process according to claim 1, wherein said semiconductor film comprises silicon.

Claim 5

A process according to claim 1, wherein said semiconductor film contains an element of the group III of the periodic table.

Claim 6

A process according to claim 1, wherein said semiconductor film contains an element of the group V of the periodic table.

Claim 7

A process according to claim 1, wherein said annealing is carried out at a temperature of 850° C. or higher and not higher than the melting point of the semiconductor material.

Claim 8

A process according to claim 1, wherein a plurality of monocrystals are formed on said substrate.

Claim 9

A process according to claim 1, wherein said semiconductor film is provided on a substrate with said metal electrode exposed from each said opening of said insulating film.

Claim 10

A process according to claim 1, wherein said insulating film having the opening has a thickness which is thicker than that of said semiconductor film.

Claim 11

A process according to claim 1, wherein said semiconductor film is provided in contact with said insulating film and is sufficiently small to become a single cohering body by said solid phase reaction.

Claim 12

A process according to claim 1, wherein said semiconductor film has a thickness which is thicker than that of said insulating film.

Claim 13

A process of growing a semiconductor monocrystal on an insulating film having an opening provided on a metal electrode, which comprises: providing a non-monocrystalline semiconductor thin film so as to cover a substrate having said insulating film and a metal electrode surface exposed from the opening of said insulating film with a thickness which is thinner than that of said insulating film, annealing said semiconductor thin film to effect the solid phase reaction between the insulating film and the semiconductor film, thereby removing only the semiconductor thin film existing on the insulating film, and also allowing the semiconductor thin film on the metal electrode to cohere so that a monocrystallized cohering body is formed, where said annealing is carried out in an atmosphere containing hydrogen gas and permitting a monocrystal to grow with said cohering body as a seed.

Claim 14

A process of growing a semiconductor monocrystal on an insulating film having an opening provided on a metal electrode, which comprises: providing a non-monocrystalline semiconductor thin film so as to cover a substrate having said insulating film and a metal electrode surface exposed from the opening of said insulating film with a thickness which is thinner than that of said insulating film, annealing said semiconductor thin film to effect the solid phase reaction between the insulating film and the semiconductor film, thereby removing only the semiconductor thin film existing on the insulating film, and also allowing the semiconductor thin film on the metal electrode to cohere so that a monocrystallized cohering body is formed, where said annealing is carried out in an atmosphere containing hydrogen gas and permitting a monocrystal to grow with said cohering body as a seed.

Claim 15

A process according to claim 12, wherein said insulating film comprises silicon oxide.

Claim 16

A process according to claim 12, wherein said semiconductor film comprises silicon.

Claim 17

A process according to claim 12, wherein said semiconductor film contains an element of the group III of the periodic table.

Claim 18

A process according to claim 12, wherein said semiconductor film contains an element of the group V of the periodic table.

Claim 19

A process according to claim 12, wherein said annealing is carried out at a temperature of 850° C. or higher and not higher than the melting point of the semiconductor material.

Claim 20

A process according to claim 12, wherein a plurality of monocrystals are formed on said substrate.

Claim 21

A process according to claim 12, wherein the opening of said insulating film has its maximum diameter of 5 μm.

Claim 22

A process of growing a monocrystal on an insulating film provided on a metal electrode, which comprises: providing a semiconductor film which is non-monocrystalline and subjected to patterning, on said insulating film of a substrate having the metal electrode and the insulating film, annealing said semiconductor film to effect the solid phase reaction between said semiconductor film and said insulating film, thereby removing said insulating film at the portion where said semiconductor film subjected to patterning is provided, and effecting cohesion of said semiconductor film on said metal electrode to form a monocrystallized cohering body, wherein said annealing is carried out in an atmosphere containing hydrogen gas and permitting a monocrystal to grow with said cohering body as a seed.

Claim 23

A process of growing a monocrystal on an insulating film provided on a metal electrode, which comprises: providing a semiconductor film which is non-monocrystalline and subjected to patterning, on said insulating film of a substrate having the metal electrode and the insulating film, annealing said semiconductor film to effect the solid phase reaction between said semiconductor film and said insulating film, thereby removing said insulating film at the portion where said semiconductor film subjected to patterning is provided, and effecting cohesion of said semiconductor film on said metal electrode to form a monocrystallized cohering body, wherein said annealing is carried out in an atmosphere containing hydrogen gas and permitting a monocrystal to grow with said cohering body as a seed.

Claim 24

A process according to claim 20, wherein said insulating film comprises silicon oxide.

Claim 25

A process according to claim 20, wherein said semiconductor film comprises silicon.

Claim 26

A process according to claim 20, wherein said semiconductor film contains an element of the group III of the periodic table.

Claim 27

A process according to claim 20, wherein said semiconductor film contains an element of the group V of the periodic table.

Claim 28

A process according to claim 20, wherein said annealing is carried out at a temperature of 850° C. or higher and not higher than the melting point of the semiconductor material.

Claim 29

A process according to claim 20, wherein a plurality of monocrystals are formed on said substrate.

Claim 30

A process according to claim 20, wherein said semiconductor film has a thickness which is thicker than that of said insulating film.

Claim 31

A process according to claim 20, wherein said insulating film has a maximum diameter of 5 μm.