Patent US5235741A successfully refreshed from Google Patents.
US5235741A
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US
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Electrical connection and method for making the same
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1992-08-11
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Granted: 1993-08-17
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Expires: 2012-08-11
Abstract
Abstract Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.
Inventors
- 👤 Akira Mase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:06
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/62; H01R4/00; H01R4/04; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0108; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0221; H05K2201/023; H05K2201/0233; H05K2201/0263; H05K2201/0272; H05K3/36; H05K3/361; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49194; Y10T29/49201
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
129 words
A method of making electrical connection between a first electrode arrangement formed on a first substrate and a second electrode arrangement formed on a second substrate, said method comprising the steps of: placing said first substrate on said second substrate; aligning the first electrode arrangement with the second electrode arrangement with a UV light curable adhesive therebetween, said adhesive including first conductive particles and second inelastic particles whose diameter is smaller than that of said first particles; pressing said first substrate against said second substrate to such extent that the distance between the inner surfaces of said first and second electrode arrangements becomes substantially same as the diameter of said second particles with said first particles being deformed; and exposing said adhesive to UV light to cure said adhesive.
Claim 2
Independent Claim
129 words
A method of making electrical connection between a first electrode arrangement formed on a first substrate and a second electrode arrangement formed on a second substrate, said method comprising the steps of: placing said first substrate on said second substrate; aligning the first electrode arrangement with the second electrode arrangement with a UV light curable adhesive therebetween, said adhesive including first conductive particles and second inelastic particles whose diameter is smaller than that of said first particles; pressing said first substrate against said second substrate to such extent that the distance between the inner surfaces of said first and second electrode arrangements becomes substantially same as the diameter of said second particles with said first particles being deformed; and exposing said adhesive to UV light to cure said adhesive.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein the diameter of said second particles is 60% to 95% of the diameter of said first particles.
Claim 4
Dependent Claim
12 words
The method of claim 1 wherein said first particles are resilient particles.
Claim 5
Independent Claim
88 words
A method of making electrical connection between a first electrode arrangement formed on a first substrate and a second electrode arrangement formed on a second substrate, comprising the steps of: placing said first substrate on said second substrate; aligning the first electrode arrangement with the second electrode arrangement with a curable connecting means therebetween; and curing said connecting means while pressing said first and second substrates against each other, wherein said curable connecting means comprises a curable adhesive, elastic first particles having conductive surfaces and inelastic second particles.
Claim 6
Independent Claim
88 words
A method of making electrical connection between a first electrode arrangement formed on a first substrate and a second electrode arrangement formed on a second substrate, comprising the steps of: placing said first substrate on said second substrate; aligning the first electrode arrangement with the second electrode arrangement with a curable connecting means therebetween; and curing said connecting means while pressing said first and second substrates against each other, wherein said curable connecting means comprises a curable adhesive, elastic first particles having conductive surfaces and inelastic second particles.
Claim 7
Dependent Claim
16 words
A method as in claim 4 wherein said curable adhesive is a UV curable organic adhesive.
Claim 8
Dependent Claim
15 words
A method as in claim 4 wherein said first electrode arrangement comprises transparent conductive strips.
Claim 9
Dependent Claim
18 words
A method as in claim 4 wherein said second electrode arrangement comprises transparent conductive strips or metal strips.
Claim 10
Dependent Claim
14 words
A method as in claim 4 wherein said first substrate is a glass substrate.
Claim 11
Dependent Claim
15 words
A method as in claim 4 wherein said second substrate is a printed circuit board.
Claim 12
Dependent Claim
15 words
A method as in claim 4 wherein said second electrode arrangement comprises ITO (indium-tin-oxide) strips.
Claim 13
Dependent Claim
17 words
A method as in claim 10 wherein said ITO strips are further provided with a metal layer.
Claim 14
Dependent Claim
12 words
A method as in claim 11 wherein said metal layer comprises nickel.
Claim 15
Dependent Claim
19 words
A method as in claim 12 wherein said metal layer is provided with a further metal layer comprising Au.
Claim 16
Dependent Claim
27 words
A method as in claim 4 wherein said elastic first particles comprise elastic organic particles and metal layers are formed on the surfaces of said organic particles.
Claim 17
Dependent Claim
15 words
A method as in claim 4 wherein said inelastic second particles comprise SiO 2 .
Claim 18
Dependent Claim
18 words
A method as in claim 4 wherein said second particles are 60-90% of said first particles in diameter.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-16 | 1997-02-15 | 1997-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-16 | 2001-02-15 | 2001-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-16 | 2005-02-15 | 2005-08-17 | $7700.00 | Window Closed / Lapsed |