EP0242025A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
Assignee: Resonac Corp
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Filing: 1987-02-13
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Granted: —
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Expires: 2007-02-13
Abstract
Abstract Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or film capable of exhibiting anisotropic-electroconductivity comprising an electrically insulating adhesive component and electroconductive particles each particle comprising a polymeric core material coated with a thin metal layer.
Inventors
- 👤 Isao Tsukagoshi
- 👤 Yutaka Yamaguchi
- 👤 Atsuo Nakajima
- 👤 Yoshikatsu Mikami
- 👤 Kuniteru Muto
- 👤 Yoshiyuki Ikezoe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 21:24
CPC Classifications
H; H01; H01R; H01R4/00; H01R4/04; H01B; H01B1/00; H01B1/20; H01B1/22; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0221; H05K2201/0233; H05K2201/06; H05K2201/068; H05K3/36; H05K3/361; H10; H10W; H10W72/00; H10W72/071; H10W72/074; H10W72/20; H10W72/261; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W99/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49194
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
68 words
An adhesive composition for connecting conductors and capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating, comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material.
Claim 2
Dependent Claim
68 words
An adhesive composition for connecting conductors and capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating, comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material.
Claim 3
Dependent Claim
68 words
An adhesive film for connecting conductors and capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating, comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material.
Claim 4
Dependent Claim
68 words
An adhesive film for connecting conductors and capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating, comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material.
Claim 5
Dependent Claim
79 words
An adhesive composition or film according to claim l or 2, wherein the electroconductive particles have an average aspect ratio of 0.05 to l.0 and an average particle size of 0.5 to 300 µm, the ratio of the thermal expansion coefficient of the adhesive component to that of the core material being 0.5/l to l0/l and the ratio of the modulus of elasticity in tension of the adhesive component to that of the core material being l.2/l to 0.0l/l.
Claim 6
Dependent Claim
43 words
An adhesive composition or film according to any one of claims l to 3, wherein the core material has plastic deformation properties under pressure or pressure with heating and a thermal expansion coefficient of 20 × l0⁻⁵ (l/°C) to 2 × l0⁻⁵ (l/°C).
Claim 7
Dependent Claim
27 words
An adhesive composition or film according to any one of claims l to 4, wherein the adhesive component is a heat-sensitive adhesive and/or a photocuring type adhesive.
Claim 8
Dependent Claim
40 words
An adhesive composition or film according to any one of claims l to 5, wherein the thickness of the metal thin layer is 0.0l to 5 µm and l/5 to l/l000 of the average particle size of the electroconductive particles.
Claim 9
Independent Claim
136 words
A method for connecting conductors which comprises interposing an adhesive composition or an adhesive film capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating comprising 0.l to l5% by volume of electroconductive particles, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material, said electroconductive particles being dispersed in 99.9 to 85% by volume of an adhesive component, between conductors which are electrode circuits standing opposite to each other, and pressing or pressing with heating said conductors so as to make the thickness of the adhesive layer between the conductors in the range of 0.02 to 0.95 of the initial thickness so as to produce an electrical connection and mechanical bonding between the conductors.
Claim 10
Independent Claim
136 words
A method for connecting conductors which comprises interposing an adhesive composition or an adhesive film capable of exhibiting anisotropic-electroconductivity by applying pressure or pressure with heating comprising 0.l to l5% by volume of electroconductive particles, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material, said electroconductive particles being dispersed in 99.9 to 85% by volume of an adhesive component, between conductors which are electrode circuits standing opposite to each other, and pressing or pressing with heating said conductors so as to make the thickness of the adhesive layer between the conductors in the range of 0.02 to 0.95 of the initial thickness so as to produce an electrical connection and mechanical bonding between the conductors.
Claim 11
Dependent Claim
23 words
A method according to claim 7, wherein the adhesive composition or film is as defined in any one of claims 3 to 6.
Claim 12
Dependent Claim
97 words
A connected conductor structure comprising conductors standing opposite to each other and connecting material connecting said conductors electrically, said connecting material comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material, and at least some of said electroconductive particles being fixed between the conductors standing opposite to each other in a deformed state pressed by the conductors.
Claim 13
Dependent Claim
97 words
A connected conductor structure comprising conductors standing opposite to each other and connecting material connecting said conductors electrically, said connecting material comprising 0.l to l5% by volume of electroconductive particles and 99.9 to 85% by volume of electrically insulating adhesive component, each electroconductive particle comprising a polymeric material as a core material and an electrically conductive metal thin layer coated on at least almost the whole surface of said core material, and at least some of said electroconductive particles being fixed between the conductors standing opposite to each other in a deformed state pressed by the conductors.
Claim 14
Dependent Claim
29 words
l0. A connected conductor structure according to claim 9, wherein the connecting material is an adhesive composition or film as defined in any one of claims 3 to 6.
References Cited (Backward Citations)
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