EP0140619A2
Expired / Lapsed
EP
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Anisotropic-electroconductive adhesive film and circuit connecting method using the same
Assignee: Resonac Corp
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Filing: 1984-10-11
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Granted: —
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Expires: 2004-10-11
Abstract
Abstract An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles of defined shape in an adhesive component layer of limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.
Inventors
- 👤 Isao Tsukagoshi
- 👤 Yutaka Yamaguchi
- 👤 Keiji Hazama
- 👤 Tadamitsu Nakayama
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 12:14
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H01; H01R; H01R4/00; H01R4/04; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0133; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0266; H05K3/36; H05K3/361
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
89 words
An anisotropic-electroconductive adhesive film comprising an adhesive component layer and electroconductive particles, characterized in that electroconductive particles having an average particle size of 1 to 50 pm and a ratio of the minimum particle diameter to the maximum particle diameter of each particle being 0.5 to 1.0 are included in an adhesive component in an amount of 0.1 to 10% by volume, and the thickness of the adhesive component layer is at least 110% of the average particle size of the electroconductive particles and not more than 100 pm.
Claim 2
Dependent Claim
89 words
An anisotropic-electroconductive adhesive film comprising an adhesive component layer and electroconductive particles, characterized in that electroconductive particles having an average particle size of 1 to 50 pm and a ratio of the minimum particle diameter to the maximum particle diameter of each particle being 0.5 to 1.0 are included in an adhesive component in an amount of 0.1 to 10% by volume, and the thickness of the adhesive component layer is at least 110% of the average particle size of the electroconductive particles and not more than 100 pm.
Claim 3
Dependent Claim
37 words
An adhesive film according to claim 1, characterized in that the electroconductive particles have a specific resistance of 10 -5 Ω-cm or less and the adhesive component layer has a total light transmittance of 40% or more.
Claim 4
Dependent Claim
28 words
An adhesive film according to claim 1 or 2, characterized in that the adhesive component is a heat-sensitive adhesive component containing a thermoplastic polymer as a main component.
Claim 5
Dependent Claim
48 words
An adhesive film according to claim 3, wherein the thermoplastic polymer is an ethylene-vinyl acetate copolymer, a polyethylene, an ethylene-propylene copolymer, an ethylene-acrylate copolymer, an acrylic rubber, a polyisobutylene, an atactic polypropylene, a poly(vinylbutyral), a styrene-butadiene copolymer, a polybutadiene, ethyl-cellulose, a polyamide, a polyurethane or a mixture thereof.
Claim 6
Dependent Claim
28 words
An adhesive film according to claim 1 or 2, characterized in that the adhesive component is a pressure-sensitive ahesive component containing a polymer having stickiness at room temperature.
Claim 7
Dependent Claim
37 words
An adhesive film according to claim 5, wherein the polymer is an acrylic rubber, natural rubber, a silicone rubber, a polychloroprene,a butadiene-styrene copolymer, an ethylene-vinyl acetate copolymer, a polyisobutylene, a poly(vinyl ether) rubber, or a mixture thereof.
Claim 8
Dependent Claim
59 words
An adhesive film according to any one of the preceding claims, wherein the adhesive film has a resistivity at the direction along the film layer of 10 6 Ω-cm or more, the minimum insulating width of 0.05 mm, a resistivity at the direction of thickness of 10 3 Ωcm or less, and adhesive strength of 300 g/cm or more.
Claim 9
Dependent Claim
42 words
An adhesive film according to any one of the preceding claims, wherein the electroconductive particles are particles of Ni, Fe, Cr. Co, A1, Sb, Mo, Cu, Ag, Pt, Au or a mixture thereof, or glass or plastic particles coated with these metals.
Claim 10
Independent Claim
69 words
A method for connecting circuits comprising interposing an anisotropic-electroconductive adhesive film having a total light transmittance of at least 40% as measured in accordance with JIS K-6714, between two circuit boards which are provided with connecting terminals on the respective surfaces facing each other, at least one of the circuit boards being light-transmissible, optically adjusting the two circuits to proper relative positions and connecting together the opposing connecting terminals.
Claim 11
Independent Claim
69 words
A method for connecting circuits comprising interposing an anisotropic-electroconductive adhesive film having a total light transmittance of at least 40% as measured in accordance with JIS K-6714, between two circuit boards which are provided with connecting terminals on the respective surfaces facing each other, at least one of the circuit boards being light-transmissible, optically adjusting the two circuits to proper relative positions and connecting together the opposing connecting terminals.
Claim 12
Dependent Claim
27 words
A method for connecting circuits according to claim 9, characterized in that the anisotropic-electroconductive adhesive film is one according to any one of claims 1 to 8.
References Cited (Backward Citations)
No citation records indexed.
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