US5235300A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Millimeter module package
Assignee: Northrop Grumman Systems Corp
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Filing: 1992-03-16
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Granted: 1993-08-10
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Expires: 2012-03-16
Abstract
Abstract A module package for unpackaged millimeter wave or microwave devices allows the device to be dropped into a cavity formed in a housing and then hermetically sealed therein. Employing dielectric probe members which pass through corresponding slots in the housing to electrically interconnect the device within an application circuit allow for effective hermetic sealing and minimize electrical discontinuities and transmission losses.
Inventors
- 👤 Steven S. Chan
- 👤 D. Ian Stones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 00:29
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
143 words
A module package for at least one unpackaged integrated circuit chip comprising: a housing having an interior cavity formed therein and a pair of slots formed therethrough, said chip being disposed within said cavity; a pair of probe members, each probe member being formed of a dielectric substrate having an electrically conductive path disposed thereon, each said probe member having a first end and a second end, said first ends each being disposed within said cavity; means for electrically connecting each said conductive path to said chip; and waveguide means in said housing for directing microwave or millimeter wave signals, said probe members intermediate said first and second ends each passing through one of said slots in said housing so as to extend from said cavity into said waveguide means, said probe members each forming a microstrip to stripline to microwave probe transition.
Claim 2
Dependent Claim
143 words
A module package for at least one unpackaged integrated circuit chip comprising: a housing having an interior cavity formed therein and a pair of slots formed therethrough, said chip being disposed within said cavity; a pair of probe members, each probe member being formed of a dielectric substrate having an electrically conductive path disposed thereon, each said probe member having a first end and a second end, said first ends each being disposed within said cavity; means for electrically connecting each said conductive path to said chip; and waveguide means in said housing for directing microwave or millimeter wave signals, said probe members intermediate said first and second ends each passing through one of said slots in said housing so as to extend from said cavity into said waveguide means, said probe members each forming a microstrip to stripline to microwave probe transition.
Claim 3
Dependent Claim
24 words
The package of claim 1 wherein each said means for electrically connecting comprises a metallic ribbon disposed between said probe member and said chip.
Claim 4
Dependent Claim
15 words
The package of claim 1 wherein said waveguide means is integrally formed with said housing.
Claim 5
Dependent Claim
27 words
The package of claim 1 wherein said waveguide means comprises a pair of hollow indentations in said housing, each disposed on an opposite side of said cavity.
Claim 6
Dependent Claim
22 words
The package of claim 1 wherein said housing further comprises a separately attachable cover, said cover being hermetically sealable onto said housing.
Claim 7
Dependent Claim
26 words
The package of claim 5 wherein said housing and said cover comprise a metallic material and wherein said cover is soldered or welded to said housing.
Claim 8
Dependent Claim
15 words
The package of claim 1 wherein said probe members are hermetically sealed in said slots.
Claim 9
Dependent Claim
131 words
A module package for at least one unpackaged integrated circuit chip comprising: a housing having an interior cavity formed therein and a pair of slots formed therethrough, said chip being disposed within said cavity; a pair of probe members, each probe member being formed of a dielectric substrate having a first end and a second end, said first ends each being disposed within said cavity, said probe members intermediate said first and second ends each passing through one of said slots in said housing, each of said probe members comprising a base portion and a raised portion, said raised portion being smaller in size than said base portion and disposed on said base portion intermediate said first and second ends; and an electrically conductive path disposed on each said probe member.
Claim 10
Dependent Claim
131 words
A module package for at least one unpackaged integrated circuit chip comprising: a housing having an interior cavity formed therein and a pair of slots formed therethrough, said chip being disposed within said cavity; a pair of probe members, each probe member being formed of a dielectric substrate having a first end and a second end, said first ends each being disposed within said cavity, said probe members intermediate said first and second ends each passing through one of said slots in said housing, each of said probe members comprising a base portion and a raised portion, said raised portion being smaller in size than said base portion and disposed on said base portion intermediate said first and second ends; and an electrically conductive path disposed on each said probe member.
Claim 11
Dependent Claim
32 words
The package of claim 8 wherein said base portion of each said probe member has a said electrically conductive path disposed thereon, said conductive path passing between said base and raised portions.
Claim 12
Dependent Claim
16 words
The package of claim 9 wherein said electrically conductive path is deposited on said base portion.
Claim 13
Dependent Claim
16 words
The package of claim 8 wherein said base and raised portions are formed of a ceramic.
Claim 14
Dependent Claim
25 words
The package of claim 10 wherein said electrically conductive path on each said probe member forms a microstrip to strip line to microwave probe transition.
Claim 15
Independent Claim
143 words
A method for packaging at least one unpackaged integrated circuit chip comprising the steps of: providing a housing having an interior cavity formed therein and a pair of slots formed therethrough; providing a waveguide means in said housing for directing microwave or millimeter wave signals; providing a pair of dielectric probe members such that a first end of each said probe member is disposed within said cavity and a second end of each said probe member protrudes from said housing cavity into said waveguide means, each of said probe members intermediate said first and second ends passing through one of said slots in said housing; providing an electrically conductive path on each said probe member so as to form a microstrip to stripline to microwave probe transistion; and depositing said chip into said cavity and electrically coupling said chip to said conductive paths.
Claim 16
Independent Claim
143 words
A method for packaging at least one unpackaged integrated circuit chip comprising the steps of: providing a housing having an interior cavity formed therein and a pair of slots formed therethrough; providing a waveguide means in said housing for directing microwave or millimeter wave signals; providing a pair of dielectric probe members such that a first end of each said probe member is disposed within said cavity and a second end of each said probe member protrudes from said housing cavity into said waveguide means, each of said probe members intermediate said first and second ends passing through one of said slots in said housing; providing an electrically conductive path on each said probe member so as to form a microstrip to stripline to microwave probe transistion; and depositing said chip into said cavity and electrically coupling said chip to said conductive paths.
Claim 17
Dependent Claim
23 words
The package of claim 13 wherein said housing is formed of a conductive material and said probe members are brazed into said slots.
Claim 18
Dependent Claim
28 words
The method of claim 13 further comprising the steps of attaching a cover to said housing to cover said cavity; and hermetically sealing said cover to said housing.
Claim 19
Dependent Claim
30 words
The method of claim 15 further comprising the step of hermetically sealing each of said probe members into said slots to effect hermetic sealing of said chip within said housing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-09 | 1997-02-08 | 1997-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-09 | 2001-02-08 | 2001-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-09 | 2005-02-08 | 2005-08-10 | $7700.00 | Window Closed / Lapsed |