Abstract A package is provided for a pair of microwave semiconductor devices, such package comprising upper and lower mating covers, each one of such covers having bonded thereto a corresponding one of the pair of microwave semiconductor devices. With such arrangement, after the devices are bonded to the cover to form a component of the package, the effective impedance of the thus formed component is electrically characterized, or measured. Having characterized a large quantity of such components, the components are then sorted into bins with components having substantially matched characteristics being placed in a common one of the bins. Pairs of such components in a common bin are used as the upper and lower cover for the package. Thus, assembly time is significantly reduced since additional matching compensation techniques are not required.
A package adapted for use with a pair of semiconductor devices, such package comprising: upper and lower mating covers, each one of such covers being substantially identical in configuration and having bonded thereto a corresponding one of the pair of the semiconductor devices; and wherein each one of such covers is substantially symmetrical about an axis of symmetry and each one of such pair of devices is bonded to mating face of the covers with each one of such pair of devices disposed on the same side of the axis of symmetry.
Claim 2
Dependent Claim
92 words
A package adapted for use with a pair of semiconductor devices, such package comprising: upper and lower mating covers, each one of such covers being substantially identical in configuration and having bonded thereto a corresponding one of the pair of the semiconductor devices; and wherein each one of such covers is substantially symmetrical about an axis of symmetry and each one of such pair of devices is bonded to mating face of the covers with each one of such pair of devices disposed on the same side of the axis of symmetry.
Claim 3
Dependent Claim
39 words
The package recited in claim 1 wherein each one of such covers has a pair of grooves, formed in the mating face thereof, each one of such grooves having bonded therein a corresponding one of the pair of devices.
Claim 4
Dependent Claim
31 words
The package recited in claim 1 wherein each one of the covers has integrally formed therewith a conductive member adapted to provide strip conductor circuitry for a series tuned resonant circuit.
Claim 5
Dependent Claim
26 words
The packaged recited in claim 3 wherein the conductive member is shaped with an open region and including a mounting bolt passing through said open region.