Patent US5234866A successfully refreshed from Google Patents.
US5234866A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and process for producing the same, and lead frame used in said process
Assignee: Hitachi Ltd
•
Filing: 1992-04-03
•
Granted: 1993-08-10
•
Expires: 2012-04-03
Abstract
Abstract According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
Inventors
- 👤 Takayuki Okinaga
- 👤 Hiroshi Tachi
- 👤 Hiroshi Ozaki
- 👤 Kanji Otsuka
- 👤 Michiaki Furukawa
- 👤 Yasuyuki Yamasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/435; H10W70/456; H10W70/458; H10W70/479; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/0198; H10W72/071; H10W72/073; H10W72/07311; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
106 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face; bonding said plurality of leads at said first end to an insulating sheet; after bonding said plurality of leads to said insulating sheet, bonding said insulating sheet to said circuit-forming face via an adhesive; electrically connecting one of said plurality of leads at said first end to one of said bonding pads; and molding said pellet and plurality of said leads with a resin.
Claim 2
Independent Claim
106 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face; bonding said plurality of leads at said first end to an insulating sheet; after bonding said plurality of leads to said insulating sheet, bonding said insulating sheet to said circuit-forming face via an adhesive; electrically connecting one of said plurality of leads at said first end to one of said bonding pads; and molding said pellet and plurality of said leads with a resin.
Claim 3
Dependent Claim
19 words
A method of producing a semiconductor device according to claim 1, wherein said insulating sheet comprises a polyimide resin.
Claim 4
Dependent Claim
31 words
A method of producing a semiconductor device according to claim 1, wherein said one of said plurality of leads are connected to said one of bonding pads by a bonding wire.
Claim 5
Dependent Claim
17 words
A method of producing a semiconductor device according to claim 3, wherein said resin comprises epoxy resin.
Claim 6
Dependent Claim
27 words
A method of producing a semiconductor device according to claim 1, wherein said insulating sheet is bonded to said circuit-forming face at a position except bonding pads.
Claim 7
Independent Claim
97 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end with an insulating sheet attached to said first ends of said plurality of leads, and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face; bonding said insulating sheet to said circuit-forming face via an adhesive; electrically connecting one of said plurality of leads at said first end to one of said bonding pads; and molding said pad and plurality of said leads with a resin.
Claim 8
Independent Claim
97 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end with an insulating sheet attached to said first ends of said plurality of leads, and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face; bonding said insulating sheet to said circuit-forming face via an adhesive; electrically connecting one of said plurality of leads at said first end to one of said bonding pads; and molding said pad and plurality of said leads with a resin.
Claim 9
Dependent Claim
19 words
A method of producing a semiconductor device according to claim 6, wherein said insulating sheet comprises a polyimide resin.
Claim 10
Dependent Claim
31 words
A method of producing a semiconductor device according to claim 6, wherein said one of said plurality of leads are connected to said one of bonding pads by a bonding wire.
Claim 11
Dependent Claim
17 words
A method of producing a semiconductor device according to claim 6, wherein said resin comprises epoxy resin.
Claim 12
Dependent Claim
27 words
A method of producing a semiconductor device according to claim 6, wherein said insulating sheet is bonded to said circuit-forming face at a portion except bonding pads.
Claim 13
Independent Claim
97 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end with an insulating sheet attached to said first ends of said plurality of leads, and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face and a non-circuit-forming face; bonding said insulating sheet to said non-circuit-forming face via an adhesive; electrically connecting one of said plurality of leads to one of said bonding pads; and molding said pellet and plurality of said leads with a resin.
Claim 14
Independent Claim
97 words
A method of producing a semiconductor device comprising the steps of: preparing a lead frame having a plurality of leads each including a first end with an insulating sheet attached to said first ends of said plurality of leads, and a pellet having a circuit-forming face with a plurality of bonding pads on said circuit-forming face and a non-circuit-forming face; bonding said insulating sheet to said non-circuit-forming face via an adhesive; electrically connecting one of said plurality of leads to one of said bonding pads; and molding said pellet and plurality of said leads with a resin.
Claim 15
Dependent Claim
19 words
A method of producing a semiconductor device according to claim 11, wherein said insulating sheet comprises a polyimide resin.
Claim 16
Dependent Claim
31 words
A method of producing a semiconductor device according to claim 11, wherein said one of said plurality of leads are connected to said one of bonding pads by a bonding wire.
Claim 17
Dependent Claim
17 words
A method of producing a semiconductor device according to claim 11, wherein said resin comprises epoxy resin.
References Cited (Backward Citations)
US4264917A
Cited
US4595945A
Cited
US4612564A
Cited
US4812420A
Cited
US4824362A
Cited
US4859632A
Cited
US4837184A
Cited
US4937656A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-09 | 1997-02-08 | 1997-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-09 | 2001-02-08 | 2001-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-09 | 2005-02-08 | 2005-08-10 | $7700.00 | Window Closed / Lapsed |