Patent US5229916A successfully refreshed from Google Patents.
US5229916A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip edge interconnect overlay element
Assignee: International Business Machines Corp
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Filing: 1992-03-04
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Granted: 1993-07-20
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Expires: 2012-03-04
Abstract
Abstract A chip overlay element is formed of a flexible substrate of polymer having electrically conductive material applied to one side thereof and circuitized to form signal lines. A metal stiffener/heat spreader is laminated to the polymer on the opposite side of the conductor. I/Os are formed on one end of the signal lines of the circuitized layer (near the end of the overlay element) and interconnection pads, bumps, or the like are formed on the opposite end (near the center of the element). The metal stiffener is then etched to form three distinct areas. The chip edge is then placed on the center metal stiffener area and bonded, with the other two stiffener areas being bent around the chip and bonded to the corresponding chip sides. The original I/Os are then electrically connected to the I/Os formed on the signal lines of the overlay element.
Inventors
- 👤 Richard F. Frankeny
- 👤 Ronald L. Imken
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W72/00; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
72 words
An apparatus for reconfiguring the input/output connection points of an associated integrated circuit device, comprising: a substrate, including a support means, that contacts at least two surfaces of an integrated circuit device; input/output means for providing electrical connections to said substrate disposed on a first surface of said substrate opposite said support means; and electrical connection means for interconnecting the input/output connection point included on an integrated circuit with said input/output means.
Claim 2
Independent Claim
72 words
An apparatus for reconfiguring the input/output connection points of an associated integrated circuit device, comprising: a substrate, including a support means, that contacts at least two surfaces of an integrated circuit device; input/output means for providing electrical connections to said substrate disposed on a first surface of said substrate opposite said support means; and electrical connection means for interconnecting the input/output connection point included on an integrated circuit with said input/output means.
Claim 3
Dependent Claim
28 words
An apparatus according to claim 1 wherein said electrical connection means comprises circuitized electrical signal lines interconnected with said input/output means and disposed on said first substrate surface.
Claim 4
Dependent Claim
37 words
An apparatus according to claim 1 wherein said support means comprises: first means for supporting said substrate input/output means; and second means for supporting said substrate, and for transferring heat away from an associated integrated circuit device.
Claim 5
Dependent Claim
50 words
An apparatus according to claim 3 wherein said electrical connection means further comprises: electrical connection pads in electrical communication with said signal lines and disposed on an end thereof opposite of said input/output means; and electrical conductors intermediate said electrical connection pads and associated integrated circuit device input/output connection points.
Claim 6
Dependent Claim
19 words
An apparatus according to claim 4 wherein said electrical connection pads comprise joining metallurgy compatible with wire bonded lines.
Claim 7
Dependent Claim
20 words
An apparatus according to claim 5 wherein said support means further comprises third means for supporting said electrical connection pads.
Claim 8
Dependent Claim
24 words
An apparatus according to claim 3 wherein said signal lines extend beyond said substrate and directly interconnect input/output connection points on an integrated circuit.
Claim 9
Dependent Claim
113 words
An apparatus according to claim 3 wherein said electrical connection means further comprises: electrical signal lines formed on a second surface of said substrate opposite said first surface and adjacent corresponding input/output connection points of an associated integrated circuit; a plurality of visa formed through said substrate and corresponding one of said signal lines formed on respective first and second surfaces of said substrate; electrically conductive material formed around an annulus of said vias for electrically interconnecting said corresponding one of said signal lines formed on said respective first and second surfaces; and means for electrically interconnecting said signal lines on said second surface with input/output connection points on an associated integrated circuit.
Claim 10
Dependent Claim
66 words
An apparatus according to claim 3 wherein said electrical connection means further comprises: a plurality of vias, formed through said substrate and adjacent input/output connecting points on an associated integrated circuit; electrically conductive material within said vias and in electrical contact with a corresponding one of said signal lines; and means for interconnecting said vias with a corresponding input/output connection points on an associated integrated circuit.
Claim 11
Dependent Claim
58 words
An apparatus according to claim 3 wherein said electrical connection means further comprises means for directly interconnecting said signal lines with input/output connection points on an associated integrated circuit by extending said substrate having said signal lines thereon such that the substrate is bent and the signal liens will face the connection points of the associated integrated circuit.
Claim 12
Dependent Claim
40 words
An apparatus according to claim 3 further comprising means for holding an associated integrated circuit device with reconfigured input/output connecting points such that the associated integrated circuit device is in electrical communication with other electronic components in a computer system.
Claim 13
Independent Claim
81 words
A method for reconfiguring the input/output connection points of an integrated circuit device, comprising the steps of: disposing electrical input/output connection means on a first surface of a substrate for providing electrical connections thereto; placing said substrate surface, including a support means opposite said first surface, in a position so that said support means contacts at least two surfaces of an associated integrated circuit device; and electrically interconnecting input/output connection points of an integrated circuit with said substrate input/output connection means.
Claim 14
Independent Claim
81 words
A method for reconfiguring the input/output connection points of an integrated circuit device, comprising the steps of: disposing electrical input/output connection means on a first surface of a substrate for providing electrical connections thereto; placing said substrate surface, including a support means opposite said first surface, in a position so that said support means contacts at least two surfaces of an associated integrated circuit device; and electrically interconnecting input/output connection points of an integrated circuit with said substrate input/output connection means.
Claim 15
Dependent Claim
39 words
A method according to claim 12 wherein said step of interconnecting comprises the steps of: forming circuitized electrical signal lines of said firs substrate surface; and interconnecting said signal lines with input/output connection points of an associated integrated circuit.
Claim 16
Dependent Claim
31 words
A method according to claim 12 wherein said step of supporting comprises the steps of: supporting said substrate input/output connection means; and transferring heat away form an associated integrated circuit device.
Claim 17
Dependent Claim
41 words
A method according to claim 14 further comprising the step of holding an associated integrated circuit device with reconfigured input/output connection points such that the associated integrated circuit device is in electrical communication with other electronic components in a computer system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-19 | 1997-01-18 | 1997-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-19 | 2001-01-18 | 2001-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-19 | 2005-01-18 | 2005-07-20 | $7700.00 | Window Closed / Lapsed |