US5059557A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of electrically connecting integrated circuits by edge-insertion in grooved support members
Assignee: Texas Instruments Inc
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Filing: 1990-04-02
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Granted: 1991-10-22
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Expires: 2010-04-02
Abstract
Abstract The specification discloses a package for a large number of integrated circuits. The package includes a top piece and a bottom piece formed of crystalline silicon with two levels of conductor regions formed in the top and bottom pieces. The integrated circuits are placed vertically between the top and bottom pieces and are held to the top and bottom pieces by high temperature adhesives. Solder balls which are placed on integrated circuits after the fabrication of the integrated circuits are then heated to cause the solder balls to reflow onto their respective connectors in the top and bottom pieces. TAB type conductors are then connected to the top and bottom pieces so that the integrated circuit held within this embodiment of the present invention may be connected to other circuitry.
Inventors
- 👤 Harvey G. Cragon
- 👤 Charles L. Hutchins
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:34
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/00; H10W90/401; H10W72/00; H10W72/01; H10W72/60; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
157 words
A process for packaging integrated circuits, comprising the steps of: a) forming a plurality of parallel grooves in a surface of each of a first support member and a second support member; b) disposing electrical conductors of said surface of said first support member; c) disposing internal electrical conductors within said first support member; d) coupling selected ones of said surface electrical conductors with selected ones of said internal electrical conductors; e) forming bonding pads along at least one edge of each one of a plurality of integrated circuits; f) inserting said at least one edge and another edge of each one of said plurality of integrated circuits into one of said grooves in both of said first and said second support members respectively; and g) electrically connecting said bonding pads formed along said at least one edge of each one of said plurality of integrated circuits to said surface electrical conductors in said first support member.
Claim 2
Dependent Claim
157 words
A process for packaging integrated circuits, comprising the steps of: a) forming a plurality of parallel grooves in a surface of each of a first support member and a second support member; b) disposing electrical conductors of said surface of said first support member; c) disposing internal electrical conductors within said first support member; d) coupling selected ones of said surface electrical conductors with selected ones of said internal electrical conductors; e) forming bonding pads along at least one edge of each one of a plurality of integrated circuits; f) inserting said at least one edge and another edge of each one of said plurality of integrated circuits into one of said grooves in both of said first and said second support members respectively; and g) electrically connecting said bonding pads formed along said at least one edge of each one of said plurality of integrated circuits to said surface electrical conductors in said first support member.
Claim 3
Dependent Claim
21 words
The process as set forth in claim 1 and further including the step of forming said support members of crystalline silicon.
Claim 4
Dependent Claim
32 words
The process as set forth in claim 1 and further including the step of terminating said surface conductors on an edge of their associated member normal to the direction of said grooves.
Claim 5
Dependent Claim
33 words
The process as set forth in claim 2 and further including the step of terminating said surface conductors on an edge of their associated support member normal to the direction of said grooves.
Claim 6
Dependent Claim
36 words
The process as set forth in claim 3 and further including the step of disposing said conductors on said surface in a plane parallel to and spaced from said conductors disposed within said first support member.
Claim 7
Dependent Claim
36 words
The process as set forth in claim 4 and further including the step of disposing said conductors on said surface in a plane parallel to and spaced from said conductors disposed within said first support member.
Claim 8
Dependent Claim
211 words
A process for packaging integrated circuits, comprising the steps of: a) forming a plurality of parallel grooves in a surface of each of a first support member and a second support member; b) disposing electrical conductors on said surface of said first support member and on said surface of said second support member; c) disposing internal electrical conductors within each of said first and second support members; d) coupling selected ones of said surface electrical conductors of said first support member with selected ones of said internal electrical conductors of said first support member; e) coupling selected ones of said surface electrical conductor of said second support member with selected ones of said internal electrical conductors of said second support members; f) forming bonding pads along both a first edge and a second edge of each one of a plurality of integrated circuits; g) inserting said first and second edges of each one of said plurality of integrated circuits into one of said grooves in both of said first and said second support members respectively; and h) electrically connecting said bonding pads formed along said first and second edges of each one of said plurality of integrated circuits to said surface electrical conductors in said first and second support members respectively.
Claim 9
Dependent Claim
211 words
A process for packaging integrated circuits, comprising the steps of: a) forming a plurality of parallel grooves in a surface of each of a first support member and a second support member; b) disposing electrical conductors on said surface of said first support member and on said surface of said second support member; c) disposing internal electrical conductors within each of said first and second support members; d) coupling selected ones of said surface electrical conductors of said first support member with selected ones of said internal electrical conductors of said first support member; e) coupling selected ones of said surface electrical conductor of said second support member with selected ones of said internal electrical conductors of said second support members; f) forming bonding pads along both a first edge and a second edge of each one of a plurality of integrated circuits; g) inserting said first and second edges of each one of said plurality of integrated circuits into one of said grooves in both of said first and said second support members respectively; and h) electrically connecting said bonding pads formed along said first and second edges of each one of said plurality of integrated circuits to said surface electrical conductors in said first and second support members respectively.
Claim 10
Dependent Claim
21 words
The process as set forth in claim 7 and further including the step of forming said support members of crystalline silicon.
Claim 11
Dependent Claim
33 words
The process as set forth in claim 7 and further including the step of terminating said surface conductors on an edge of their associated support member normal to the direction of said grooves.
Claim 12
Dependent Claim
32 words
The process as set forth in claim 8 and further including the step of terminating said conductors on an edge of their associated support member normal to the direction of said grooves.
Claim 13
Dependent Claim
35 words
The process as set forth in claim 9 and further including the of disposing conductors on said first surface in a plane parallel to and spaced from said conductors disposed within said first support member.
Claim 14
Dependent Claim
36 words
The process as set forth in claim 10 and further including the step of disposing conductors on said first surface in a plane parallel to and spaced from said conductors disposed within said first support member.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-21 | 1995-04-22 | 1995-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-21 | 1999-04-22 | 1999-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-21 | 2003-04-22 | 2003-10-22 | $7700.00 | Window Closed / Lapsed |