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US5225711A Expired / Lapsed US ⏱️ 0.0 years remaining

Palladium enhanced soldering and bonding of semiconductor device contacts

Assignee: International Business Machines Corp
•
Filing: 1991-03-11
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Granted: 1993-07-06
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Expires: 2011-03-11
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Abstract

Abstract The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

Inventors

  • 👤 Chin-An Chang
  • 👤 Nicholas G. Koopman
  • 👤 Judith M. Roldan
  • 👤 Steven Strickman
  • 👤 Kamalesh K. Srivastava
  • 👤 Helen L. Yeh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 22:00
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/001; H; H01; H01R; H01R43/00; H01R43/02; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 52 words
In semiconductor integrated circuit manufacturing fluxless contact technology an intermediate manufacturing product comprising: a first layer member containing palladium in a thickness between 200 to 1500 Angstroms and in contact with a second member composed of at least one material taken from the group of partially oxidized copper and partially oxidized solder.
Claim 2
Dependent Claim 52 words
In semiconductor integrated circuit manufacturing fluxless contact technology an intermediate manufacturing product comprising: a first layer member containing palladium in a thickness between 200 to 1500 Angstroms and in contact with a second member composed of at least one material taken from the group of partially oxidized copper and partially oxidized solder.
Claim 3
Dependent Claim 13 words
The product of claim 1 wherein said first layer member is pure palladium.
Claim 4
Dependent Claim 14 words
The product of claim 1 wherein the material of said second member is copper.
Claim 5
Dependent Claim 14 words
The product of claim 1 wherein the material of said second member is solder.
Claim 6
Dependent Claim 14 words
The product of claim 2 wherein the material of said second member is copper.
Claim 7
Dependent Claim 13 words
The product of claim 5 wherein said second member is a copper block.
Claim 8
Dependent Claim 12 words
The product of claim 2 wherein said second layer is a solder.
Claim 9
Dependent Claim 71 words
In low temperature fluxless bonding semiconductor integrated circuit manufacturing contact technology an intermediate manufacturing product comprising: a first layer member containing palladium in a thickness between 200 and 1500 Angstroms and in contact with, a second member composed of a material taken from the group of copper and solder having in contact with said palladium containing layer at least one selected from the group of oxides of copper, tin and lead.
Claim 10
Dependent Claim 71 words
In low temperature fluxless bonding semiconductor integrated circuit manufacturing contact technology an intermediate manufacturing product comprising: a first layer member containing palladium in a thickness between 200 and 1500 Angstroms and in contact with, a second member composed of a material taken from the group of copper and solder having in contact with said palladium containing layer at least one selected from the group of oxides of copper, tin and lead.
Claim 11
Dependent Claim 12 words
The product of claim 8 wherein said second member is of copper.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-07-05 1997-01-04 1997-07-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-07-05 2001-01-04 2001-07-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-07-05 2005-01-04 2005-07-06 $7700.00 Window Closed / Lapsed

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