Composite heat transfer device

Claim 2

A composite heat transfer assembly including at least first and second circuit boards on which are mounted a plurality of electronic components, the electronic components having a predetermined coefficient of thermal expansion, comprising: said first and second circuit boards having a first coefficient of thermal expansion; said first and second circuit boards each including a first surface on which is disposed at least one heat generating electronic component having a predetermined coefficient of thermal expansion, and a second surface from which heat is to be transferred; first and second composite heat conductive members, mounted proximate the second surfaces of said first and second circuit boards, and including a first material having a positive coefficient of thermal expansion, and a second material being of particulate form and having a negative coefficient of thermal expansion; said second material being mixed with and generally evenly distributed throughout said first material, in a quantity ratio to produce first and second composite heat conductive members each with a coefficient of thermal expansion which, when combined with said first coefficient of thermal expansion of the corresponding circuit board, closely matches said predetermined coefficient of thermal expansion of said heat generating electronic components mounted on the corresponding circuit board; and said first and second composite heat conductive members being connected by a hollow core structure adapted for allowing the flow of a fluid medium through the hollow core, to transfer heat between said first and second composite heat conductive members and said fluid medium.

Claim 3

A composite heat transfer assembly with a circuit board including a plurality of heat generating sources, said heat generating sources having a predetermined coefficient of thermal expansion, comprising: said circuit board having a first coefficient of thermal expansion, comprising: said circuit board including a first surface proximate at least one of said heat generating sources having a predetermined coefficient of thermal expansion, and a second surface from which heat is to be transferred; a composite heat conductive member, mounted proximate the second surface of said circuit board and including a first material having a positive coefficient of thermal expansion, and a second material being of particulate form and having a negative coefficient of thermal expansion; said first and second materials generally evenly distributed throughout said composite heat conductive member in a quantity ratio to produce a composite heat conductive member with a coefficient of thermal expansion which, when combined with said first coefficient of thermal expansion of said circuit board, closely matches said predetermined coefficient of thermal expansion of said heat generating sources; and a hollow core structure mounted proximate said composite heat conductive member and including at least one chamber adapted for allowing the flow of a fluid medium through said chamber to transfer heat with said composite heat conductive member and said fluid medium wherein said hollow core structure includes an undulating shape.

Claim 4

A composite heat transfer assembly with a circuit board including a plurality of heat generating sources, said heat generating sources having a predetermined coefficient of thermal expansion, comprising: said circuit board having a first coefficient of thermal expansion, comprising: said circuit board including a first surface proximate at least one of said heat generating sources having a predetermined coefficient of thermal expansion, and a second surface from which heat is to be transferred; a composite heat conductive member, mounted proximate the second surface of said circuit board and including a first material having a positive coefficient of thermal expansion, and a second material being of particulate form and having a negative coefficient of thermal expansion; said first and second materials generally evenly distributed throughout said composite heat conductive member in a quantity ratio to produce a composite heat conductive member with a coefficient of thermal expansion which, when combined with said first coefficient of thermal expansion of said circuit board, closely matches said predetermined coefficient of thermal expansion of said heat generating sources; and a hollow core structure mounted proximate said composite heat conductive member and including at least one chamber adapted for allowing the flow of a fluid medium through said chamber to transfer heat with said composite heat conductive member and said fluid medium wherein said hollow core structure includes an undulating shape.

Claim 5

A composite heat transfer assembly including first and second circuit boards on which are mounted a plurality of heat generating sources, said heat generating sources having a predetermined coefficient of thermal expansion, comprising: said first and second circuit boards having a first coefficient of thermal expansion; said first and second circuit boards each including a first surface proximate at least one of said heat generating sources having a predetermined coefficient or thermal expansion, and a second surface from which heat is to be transferred; first and second composite heat conductive members, mounted proximate the second surfaces of said first and second circuit boards and including a first material having a positive coefficient of thermal expansion, and a second material being of particulate form and having a negative coefficient of thermal expansion; said first and second materials generally evenly distributed throughout said composite heat conductive member in a quantity ratio to produce first and second composite heat conductive members with a coefficient of thermal expansion which, when combined with said first coefficient of thermal expansion of said circuit boards, closely matches said predetermined coefficient of thermal expansion of said heat generating sources; and a hollow core structure connected to said first and second heat conductive members, including at least one chamber, and adapted for allowing the flow of a fluid medium through the chamber of said hollow core structure to transfer heat with said first and second composite heat conductive members and said fluid medium, wherein said hollow core structure includes an undulating shape.

Claim 6

A composite heat transfer assembly including first and second circuit boards on which are mounted a plurality of heat generating sources, said heat generating sources having a predetermined coefficient of thermal expansion, comprising: said first and second circuit boards having a first coefficient of thermal expansion; said first and second circuit boards each including a first surface proximate at least one of said heat generating sources having a predetermined coefficient or thermal expansion, and a second surface from which heat is to be transferred; first and second composite heat conductive members, mounted proximate the second surfaces of said first and second circuit boards and including a first material having a positive coefficient of thermal expansion, and a second material being of particulate form and having a negative coefficient of thermal expansion; said first and second materials generally evenly distributed throughout said composite heat conductive member in a quantity ratio to produce first and second composite heat conductive members with a coefficient of thermal expansion which, when combined with said first coefficient of thermal expansion of said circuit boards, closely matches said predetermined coefficient of thermal expansion of said heat generating sources; and a hollow core structure connected to said first and second heat conductive members, including at least one chamber, and adapted for allowing the flow of a fluid medium through the chamber of said hollow core structure to transfer heat with said first and second composite heat conductive members and said fluid medium, wherein said hollow core structure includes an undulating shape.