US4888247A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
Assignee: Lockheed Martin Corp
•
Filing: 1986-08-27
•
Granted: 1989-12-19
•
Expires: 2006-08-27
Abstract
Abstract Heat conducting laminates and laminated heat conducting devices having at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. The coefficient of thermal expansion and the thermal conductivity of the laminated heat conducting devices are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material in the laminate. The coefficient of thermal expansion and thermal conductivity of a heat conducting device can be controlled by bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. In one embodiment, the laminated heat conducting device comprises a plurality of alternating layers of aluminum and epoxy resin having graphite fibers distributed throughout the epoxy resin.
Inventors
- 👤 Carl H. Zweben
- 👤 Rodman A. Mogle
- 👤 Benjamin T. Rodini, Jr.
- 👤 Charles L. Thaw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:18
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/092; B32B15/20; B32B27/00; B32B27/34; B32B27/38; B32B3/00; B32B3/26; B32B3/266; B32B7/00; B32B7/02; B32B7/027; B32B7/04; B32B7/12; H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; B32B2250/00; B32B2250/42; B32B2262/00; B32B2262/10; B32B2262/106; B32B2307/00; B32B2307/30; B32B2307/302; Y; Y10; Y10S; Y10S428/00; Y10S428/902; Y10S428/922; Y10T; Y10T428/00; Y10T428/24; Y10T428/24058; Y10T428/24273; Y10T428/24322; Y10T428/29; Y10T428/2982; Y10T428/2991; Y10T428/2993; Y10T428/2996; Y10T428/30; Y10T428/31504; Y10T428/31678; Y10T428/31692; Y10T442/00; Y10T442/30; Y10T442/3382; Y10T442/3415; Y10T442/3423; Y10T442/60; Y10T442/654; Y10T442/656
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
28 words
A heat conducting laminate comprising at least one layer of metal and at least one layer of thermoset polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.
Claim 2
Dependent Claim
28 words
A heat conducting laminate comprising at least one layer of metal and at least one layer of thermoset polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.
Claim 3
Dependent Claim
32 words
The heat conducting laminate of claim 1 wherein the low-thermal-expansion reinforcing material is selected from the group consisting of inorganic fibers, inorganic whiskers, inorganic particles, organic fibers, organic whiskers and mixtures thereof.
Claim 4
Dependent Claim
23 words
The heat conducting laminate of claim 2 wherein the reinforcing material has a unidirectional orientation throughout the layer of polymer matrix composite material.
Claim 5
Dependent Claim
22 words
The heat conducting laminate of claim 2 wherein the reinforcing material is randomly distributed throughout the layer of polymer matrix composite material.
Claim 6
Dependent Claim
29 words
The heat conducting laminate of claim 2 wherein the organic fibers or whiskers are selected from the group consisting of polyaramid fibers or whiskers and PBT fibers or whiskers.
Claim 7
Dependent Claim
21 words
The heat conducting laminate of claim 2 wherein the fibers are in the form of a woven fabric or non-woven mat.
Claim 8
Dependent Claim
45 words
The heat conducting laminate of claim 1 at least one layer of metal and at least one layer of an ordered polymer film having low-thermal-expansion reinforcing material embedded therein said low-thermal-expansion reinforcing material being orientated portions of the polymer itself within said ordered polymer film.
Claim 9
Dependent Claim
22 words
The heat conducting laminate of claim 7 wherein the ordered polymer film is selected from the group consisting of polyaramid and PBT.
Claim 10
Dependent Claim
42 words
The heat conducting laminate of claim 1 wherein the low-thermal-expansion reinforcing material is inorganic fibers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica and mixtures thereof.
Claim 11
Dependent Claim
46 words
The heat conducting laminate of claim 1 wherein the low-thermal-expansion reinforcing material is inorganic whiskers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, silicon nitride, nickel aluminide and mixtures thereof.
Claim 12
Dependent Claim
69 words
The heat conducting laminate of claim 1 wherein the low-thermal-expansion reinforcing material is inorganic particles selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, nickel aluminide, silicon nitride, beryllium oxide, aluminum nitride, titanium carbide, aluminum dodecaboride, tungsten carbide, chromium carbide, molybdenum disilicide, hollow glass spheres, hollow quartz spheres, hollow graphite spheres and mixtures thereof.
Claim 13
Dependent Claim
28 words
The heat conducting laminate of claim 1 wherein the coefficient of thermal expansion of the reinforcing material is less than the coefficient of thermal expansion of the metal.
Claim 14
Dependent Claim
38 words
The heat conducting laminate of claim 1 wherein the coefficient of thermal expansion of the layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein is less than the coefficient of thermal expansion of the metal.
Claim 15
Dependent Claim
15 words
The heat conducting laminate of claim 1 wherein the low-thermal-expansion reinforcing material is thermally conductive.
Claim 16
Dependent Claim
31 words
The heat conducting laminate of claim 14 wherein the thermally conductive, low-thermal-expansion reinforcing material is aligned in the polymer matrix composite material to direct heat in the direction of the alignment.
Claim 17
Dependent Claim
56 words
The heat conducting laminate of claim 14 wherein the thermally conductive, low-thermal-expansion reinforcing material is particles, whiskers, fibers, fabrics, mats or any combination of particles, whiskers, fibers, fabrics or mats selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, titanium diboride, beryllium, nickel aluminide, aluminum nitride, aluminum dodecaboride, molybdenum disilicide and mixtures thereof.
Claim 18
Dependent Claim
88 words
A laminated heat conducting device comprising at least one layer of metal and at least one layer of a thermoset polymer matrix composite material adhered thereto, the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein, whereby the coefficient of thermal expansion and the thermal conductivity of the device are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material, and the coefficient of thermal expansion of the laminated device is less than the coefficient of thermal expansion of the metal.
Claim 19
Dependent Claim
88 words
A laminated heat conducting device comprising at least one layer of metal and at least one layer of a thermoset polymer matrix composite material adhered thereto, the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein, whereby the coefficient of thermal expansion and the thermal conductivity of the device are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material, and the coefficient of thermal expansion of the laminated device is less than the coefficient of thermal expansion of the metal.
Claim 20
Dependent Claim
18 words
The laminated heat conducting device of claim 17 comprising alternating layers of metals and polymer matrix composite material.
Claim 21
Dependent Claim
19 words
The laminated heat conducting device of claim 17 comprising a plurality of layers symmetrically disposed about a central plane.
Claim 22
Dependent Claim
27 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material has a unidirectional orientation.
Claim 23
Dependent Claim
27 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material is randomly distributed therein.
Claim 24
Dependent Claim
57 words
The laminated heat conducting device of claim 17 having a plurality of polymer matrix composite material layers wherein the low-thermal-expansion reinforcing material of at least one of the polymer matrix composite material layers is aligned at an angle up to 90° relative to the low-thermal-expansion reinforcing material of at least one other polymer matrix composite material layer.
Claim 25
Dependent Claim
30 words
The laminated heat conducting device of claim 22 wherein the low-thermal-expansion reinforcing material in one layer is in an orthogonal orientation relative to the low-thermal-expansion reinforcing material of another layer.
Claim 26
Dependent Claim
26 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material is thermally conductive.
Claim 27
Dependent Claim
32 words
The laminated heat conducting device of claim 24 wherein the thermally conductive, low-thermal-expansion reinforcing material is aligned in the polymer matrix composite material to direct heat in the direction of the alignment.
Claim 28
Dependent Claim
58 words
The laminated heat conducting device of claim 24 wherein the thermally conductive, low-thermal-expansion reinforcing material is particles, whiskers, fibers, fabrics or any combination of particles, whiskers, fibers or fabrics selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, titanium diboride, beryllium, nickel aluminide, aluminum nitride, aluminum dodecarboride, molybdenum disilicide, hollow graphite spheres and mixtures thereof.
Claim 29
Dependent Claim
35 words
The laminated heat conducting device of claim 17 having a plurality of polymer matrix composite material layers wherein at least two of the polymer matrix composite material layers have different low-thermal-expansion reinforcing materials embedded therein.
Claim 30
Dependent Claim
25 words
The laminated heat conducting device of claim 17 having a plurality of metal layers wherein at least two of the metal layers are different metals.
Claim 31
Dependent Claim
30 words
The laminated heat conducting device of claim 17 having a plurality of polymer matrix material layers wherein at least two of the polymer matrix composite material layers are different polymers.
Claim 32
Dependent Claim
26 words
The laminated heat conducting device of claim 29 wherein at least two of the polymer matrix composite material layers have different low-thermal-expansion reinforcing materials embedded therein.
Claim 33
Dependent Claim
48 words
The laminated heat conducting device of claim 17 having a plurality of metal layers and a plurality of polymer matrix composite material layers wherein at least two of the metal layers are different metals and at least two of the polymer matrix composite material layers are different polymers.
Claim 34
Dependent Claim
53 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is in a form or shape selected from the group consisting of fibers, whiskers, particles, fabrics, mats and mixtures thereof.
Claim 35
Dependent Claim
44 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is selected from the group consisting of polyaramid fibers and PBT.
Claim 36
Dependent Claim
63 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material which, in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic fibers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica and mixtures thereof.
Claim 37
Dependent Claim
67 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic whiskers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, silicon nitride, nickel aluminide and mixtures thereof.
Claim 38
Dependent Claim
89 words
The laminated heat conducting device of claim 17 wherein the low-thermal-expansion reinforcing material which, in combination with polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic particles selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, nickel aluminide, silicon nitride, beryllium oxide, aluminum nitride, titanium carbide, aluminum dodecaboride, tungsten carbide, chromium carbide, molybdenum disilicide, hollow glass spheres, hollow quartz spheres, hollow graphite spheres and mixtures thereof.
Claim 39
Dependent Claim
25 words
The laminated heat conducting device of claim 17 wherein at least one layer is perforated to promote bonding of the adjacent layers to each other.
References Cited (Backward Citations)
GB1303301A
Cited
US3700538A
Cited
US3778334A
Cited
US4029838A
Cited
US4372804A
Cited
US4326238A
Cited
US4229473A
Cited
US4369222A
Cited
US4307147A
Cited
US4370191A
Cited
US4465741A
Cited
US4446191A
Cited
US4470063A
Cited
US4500589A
Cited
US4489123A
Cited
US4482912A
Cited
US4318954A
Cited
US4550051A
Cited
US4578308A
Cited
EP0147014A2
Cited
US4675246A
Cited
US4601941A
Cited
US4637851A
Cited
US4590539A
Cited
US4698267A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |