Patent US5210939A successfully refreshed from Google Patents.
US5210939A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead grid array integrated circuit
Assignee: Intel Corp
•
Filing: 1992-04-17
•
Granted: 1993-05-18
•
Expires: 2012-04-17
Abstract
Abstract A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.
Inventors
- 👤 Debendra Mallik
- 👤 Bidyut K. Bhattacharyya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:32
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10W70/40; H10W70/479; H10W90/00; H10W90/701; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K2201/10772; H05K2201/10886; H05K2201/10946; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/53; Y10T29/5313; Y10T29/53174
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
102 words
A method of constructing an integrated circuit package, comprising the steps of: a) providing a module having a plurality of contact pads; b) providing a sheet of electrically conductive material; c) removing portions of said sheet so that there is created a two dimensional array of beams; d) bending said beams; e) placing said sheet adjacent to said module so that all of said beams are aligned with said contact pads; f) attaching base portions of said beams to said contact pads; g) cutting said base portions to separate said beams from said sheet; and, h) removing said sheet from said module.
Claim 2
Independent Claim
102 words
A method of constructing an integrated circuit package, comprising the steps of: a) providing a module having a plurality of contact pads; b) providing a sheet of electrically conductive material; c) removing portions of said sheet so that there is created a two dimensional array of beams; d) bending said beams; e) placing said sheet adjacent to said module so that all of said beams are aligned with said contact pads; f) attaching base portions of said beams to said contact pads; g) cutting said base portions to separate said beams from said sheet; and, h) removing said sheet from said module.
Claim 3
Dependent Claim
22 words
The method as recited in claim 1, wherein each said beam is created by removing a C shaped slot in said sheet.
Claim 4
Dependent Claim
16 words
The method as recited in claim 2, wherein said beams are bent into an S shape.
Claim 5
Dependent Claim
14 words
The method as recited in claim 2, wherein said C shaped slots are etched.
Claim 6
Dependent Claim
14 words
The method as recited in claim 2, wherein said C shaped slots are punched.
Claim 7
Dependent Claim
19 words
The method as recited in claim 1, wherein each said beam is created by removing a pair of slots.
Claim 8
Dependent Claim
18 words
The method as recited in claim 6, wherein said beams are bent into a segment of a cylinder.
Claim 9
Dependent Claim
12 words
The method as recited in claim 6, wherein said slots are etched.
Claim 10
Dependent Claim
12 words
The method as recited in claim 6, wherein said slots are punched.
Claim 11
Dependent Claim
25 words
The method as recited in claim 1, wherein said sheet is removed from said beams by cutting at least one base portion of said beams.
Claim 12
Dependent Claim
15 words
The method as recited in claim 10, wherein said beams are cut with a laser.
Claim 13
Dependent Claim
40 words
The method as recited in claim 1, further comprising the steps of providing alignment means to align said beams and said contact pads, and aligning said beams to said contact pads before said beams are attached to said contact pads.
Claim 14
Independent Claim
130 words
A method of constructing an integrated circuit package, comprising the steps of: a) providing a module having a plurality of contact pads and at least two alignment studs; b) providing a sheet of electrically conductive material having at least two alignment holes; c) removing portions of said sheet so that there is created a two-dimensional array of beams; d) bending said beams; e) placing said sheet over said module such that said alignment studs extend through said alignment holes and said sheet is adjacent ot said module, such that all of said beams are aligned with said contact pads; e) attaching base portions of said beams to said contact pads; f) cutting said base portions to separate said beams from said sheet; and, g) removing said sheet from said module.
Claim 15
Independent Claim
130 words
A method of constructing an integrated circuit package, comprising the steps of: a) providing a module having a plurality of contact pads and at least two alignment studs; b) providing a sheet of electrically conductive material having at least two alignment holes; c) removing portions of said sheet so that there is created a two-dimensional array of beams; d) bending said beams; e) placing said sheet over said module such that said alignment studs extend through said alignment holes and said sheet is adjacent ot said module, such that all of said beams are aligned with said contact pads; e) attaching base portions of said beams to said contact pads; f) cutting said base portions to separate said beams from said sheet; and, g) removing said sheet from said module.
Claim 16
Dependent Claim
22 words
The method as recited in claim 13, wherein each said beam is created by removing a C shaped slot in said sheet.
Claim 17
Dependent Claim
16 words
The method as recited in claim 14, wherein said beams are bent into an S shape.
Claim 18
Dependent Claim
14 words
The method as recited in claim 15, wherein said C shaped slots are etched.
Claim 19
Dependent Claim
14 words
The method as recited in claim 15, wherein said C shaped slots are punched.
Claim 20
Dependent Claim
19 words
The method as recited in claim 13, wherein each said beam is created by removing a pair of slots.
Claim 21
Dependent Claim
18 words
The method as recited in claim 18, wherein said beams are bent into a segment of a cylinder.
Claim 22
Dependent Claim
12 words
The method as recited in claim 19, wherein said slots are etched.
Claim 23
Dependent Claim
12 words
The method as recited in claim 19, wherein said slots are punched.
References Cited (Backward Citations)
US4751199A
Cited
US4689875A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-17 | 1996-11-16 | 1997-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-17 | 2000-11-16 | 2001-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-17 | 2004-11-16 | 2005-05-18 | $7700.00 | Window Closed / Lapsed |