Patent US5209815A successfully refreshed from Google Patents.
US5209815A
Expired / Lapsed
US
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Method for forming patterned films on a substrate
Assignee: International Business Machines Corp
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Filing: 1991-06-06
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Granted: 1993-05-11
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Expires: 2011-06-06
Abstract
Abstract A method of forming patterned film onto a substrate includes the steps of: depositing a polyether sulfone release layer 50; depositing a photoresist underlayer 52; patterning a predetermined film pattern through the underlayer 52 and the polyether sulfone layer 50; depositing a film layer 60 onto the wafer, thereby forming a patterned film 62 on the substrate 10; weakening the mechanical bonding strength to the polyether sulfone release layer 50 by immersing it in NMP; stripping off layers 54 and 60 by applying an adhesive backed tape 64 to the top of the film layer and applying a pulling force; and, removing the polyether sulfone release layer 50 by immersing the wafer in a NMP bath.
Inventors
- 👤 Robert J. Fleming
- 👤 Margaret J. Lawson
- 👤 Edward J. Leonard
- 👤 Bryan N. Rhoads
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:32
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/058; H10P; H10P76/00; H10P76/20; H10P76/202; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; H05K3/048
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
298 words
A method of forming a patterned film of a desired film material onto a substrate according to a predetermined film pattern and under film deposition conditions corresponding to the desired film material, said method comprising the steps of: a) depositing a release layer of a release material onto a surface of the substrate, wherein said release material is thermally stable under the film deposition conditions and is soluble in at least a first or a second solution; b) depositing an underlayer onto said release layer, wherein said underlayer is thermally stable under the film deposition conditions and said underlayer is mechanically bonded to said release layer by a first mechanical bonding strength; c) patterning the predetermining film pattern through said underlayer and said release layer thereby forming a patterned underlayer and a patterned release layer and further exposing the substrate surface according to the predetermined film pattern; d) depositing film layer onto said patterned underlayer and the exposed substrate, thereby forming the patterned film onto the exposed surface of the substrate according to the predetermined film pattern and wherein said film layer is mechanically bonded to said patterned underlayer by a second mechanical bonding strength; e) weakening the first mechanical bonding strength of said release layer, wherein the weakened first mechanical bonding strength is weaker than the second mechanical bonding strength; f) applying an adhesive backed tape to the top of said film layer, said adhesive backed tape not contacting the patterned film; g) applying a pulling force to said tape to break the mechanical bond between said underlayer and said release layer, thereby stripping said film layer and said patterned underlayer away from said patterned release layer, while leaving said patterned film and said patterned release layer on the substrate; and, h) removing said patterned release layer.
Claim 2
Independent Claim
298 words
A method of forming a patterned film of a desired film material onto a substrate according to a predetermined film pattern and under film deposition conditions corresponding to the desired film material, said method comprising the steps of: a) depositing a release layer of a release material onto a surface of the substrate, wherein said release material is thermally stable under the film deposition conditions and is soluble in at least a first or a second solution; b) depositing an underlayer onto said release layer, wherein said underlayer is thermally stable under the film deposition conditions and said underlayer is mechanically bonded to said release layer by a first mechanical bonding strength; c) patterning the predetermining film pattern through said underlayer and said release layer thereby forming a patterned underlayer and a patterned release layer and further exposing the substrate surface according to the predetermined film pattern; d) depositing film layer onto said patterned underlayer and the exposed substrate, thereby forming the patterned film onto the exposed surface of the substrate according to the predetermined film pattern and wherein said film layer is mechanically bonded to said patterned underlayer by a second mechanical bonding strength; e) weakening the first mechanical bonding strength of said release layer, wherein the weakened first mechanical bonding strength is weaker than the second mechanical bonding strength; f) applying an adhesive backed tape to the top of said film layer, said adhesive backed tape not contacting the patterned film; g) applying a pulling force to said tape to break the mechanical bond between said underlayer and said release layer, thereby stripping said film layer and said patterned underlayer away from said patterned release layer, while leaving said patterned film and said patterned release layer on the substrate; and, h) removing said patterned release layer.
Claim 3
Dependent Claim
27 words
A method of forming a patterned film onto a substrate according to claim 1, wherein step e) comprises immersing said patterned release layer in said first solution.
Claim 4
Dependent Claim
23 words
A method of forming a patterned film onto a substrate according to claim 2, wherein said first solution is comprised of N-methylpyrrolidone (NMP).
Claim 5
Dependent Claim
27 words
A method of forming a patterned film onto a substrate according to claim 1, wherein step h) comprises dissolving said patterned release layer in said second solution.
Claim 6
Dependent Claim
26 words
A method of forming a patterned film onto a substrate according to claim 4, wherein said second solution is comprised of N-methyl-2-pyrrolidone, 1,2-propanediol, and tetraalkylammonium hydroxide.
Claim 7
Dependent Claim
57 words
A method of forming a patterned film onto a substrate according to claim 4, wherein said second solution is comprised on the order of: a) 60-90% by weight of a N-methyl-2-pyrrolidone; b) 10-40% by weight of a 1,2-propanediol; and, c) a sufficient amount of a tetraalkylammonium hydroxide to provide a solution being from 0.1 to 0.22 N.
Claim 8
Dependent Claim
23 words
A method of forming a patterned film onto a substrate according to claim 4, wherein said second solution is comprised of N-methylpyrrolidone (NMP).
Claim 9
Dependent Claim
67 words
A method of forming a patterned film onto a substrate according to claim 1, wherein step c) comprises the steps of: a) depositing a patterning resist layer (PRL) onto said underlayer; b) patterning said PRL according to the predetermined film pattern; c) conditioning said PRL to be resistant to an image transfer process; and, d) transferring the predetermined film pattern to said underlayer and said release layer.
Claim 10
Dependent Claim
83 words
A method of forming patterned films onto a substrate according to claim 1, wherein step c) comprises the steps of: a) depositing a barrier layer (BL) which is resistant to oxygen RIE onto said underlayer; b) depositing a patterning resist layer (PRL) onto said BL; c) patterning said PRL according to the predetermined film pattern; d) transferring the predetermined film pattern through said BL using a CF 4 RIE; and, e) transferring the predetermined film pattern to said underlayer and said release layer.
Claim 11
Dependent Claim
23 words
A method of forming a patterned film onto a substrate according to claim 1, wherein step d) is comprises of depositing evaporated metal.
Claim 12
Dependent Claim
31 words
A method of forming a patterned film onto a substrate according to claim 1, wherein the patterned film is comprised of metal and step d) is comprised of a CVD process.
Claim 13
Dependent Claim
31 words
A method of forming a patterned film onto a substrate according to claim 1, wherein the patterned film is comprised of metal and step d) is comprised of a sputtering process.
Claim 14
Dependent Claim
22 words
A method of forming patterned films onto a substrate according to claim 1, wherein said release material is comprised of polyether sulfone.
Claim 15
Dependent Claim
22 words
A method of forming patterned films onto a substrate according to claim 1, wherein said underlayer is comprised of an organic polymer.
Claim 16
Dependent Claim
24 words
A method of forming patterned films onto a substrate according to claim 1, wherein said underlayer is comprised of an organic polymeric masking material.
Claim 17
Independent Claim
253 words
A method of forming a patterned film onto a substrate according to a predetermined film pattern, said method comprising the steps of: a) depositing a release layer of polyether sulfone onto a surface of the substrate; b) depositing an underlayer of an organic polymeric masking material onto said release layer, said underlayer being mechanically bonded to said release layer by a first mechanical bonding strength; c) patterning the predetermined film pattern through said underlayer and said release layer, thereby forming a patterned underlayer and a pattered release layer and further exposing the substrate surface according to the predetermined film pattern; d) depositing a film layer onto said patterned underlayer and exposed substrate thereby forming the pattered film onto the exposed surface of the substrate according to the predetermined film pattern, and wherein said film layer is mechanically bonded to said patterned underlayer by a second mechanical bonding strength; e) immersing said release layer in a solution comprised of N-methylpyrrolidone (NMP), thereby weakening the first mechanical bonding strength thereof, wherein the weakened first mechanical bonding strength is weaker than the second mechanical bonding strength; f) applying an adhesive tape to the top of said film layer, said adhesive tape not contacting the patterned film; g) applying a pulling force to said tape to break the mechanical bond between said underlayer and said release layer, thereby stripping said film layer and said patterned underlayer away from said patterned release layer and leaving the patterned film on the substrate; and, h) dissolving said patterned release layer.
Claim 18
Independent Claim
253 words
A method of forming a patterned film onto a substrate according to a predetermined film pattern, said method comprising the steps of: a) depositing a release layer of polyether sulfone onto a surface of the substrate; b) depositing an underlayer of an organic polymeric masking material onto said release layer, said underlayer being mechanically bonded to said release layer by a first mechanical bonding strength; c) patterning the predetermined film pattern through said underlayer and said release layer, thereby forming a patterned underlayer and a pattered release layer and further exposing the substrate surface according to the predetermined film pattern; d) depositing a film layer onto said patterned underlayer and exposed substrate thereby forming the pattered film onto the exposed surface of the substrate according to the predetermined film pattern, and wherein said film layer is mechanically bonded to said patterned underlayer by a second mechanical bonding strength; e) immersing said release layer in a solution comprised of N-methylpyrrolidone (NMP), thereby weakening the first mechanical bonding strength thereof, wherein the weakened first mechanical bonding strength is weaker than the second mechanical bonding strength; f) applying an adhesive tape to the top of said film layer, said adhesive tape not contacting the patterned film; g) applying a pulling force to said tape to break the mechanical bond between said underlayer and said release layer, thereby stripping said film layer and said patterned underlayer away from said patterned release layer and leaving the patterned film on the substrate; and, h) dissolving said patterned release layer.
Claim 19
Dependent Claim
31 words
A method of forming a patterned film onto a substrate according to claim 16, wherein step h) comprises dissolving said release layer in a solution comprising N-methyl-2-pyrrolidone, 1,2-propanediol, and tetraalkylammonium hydroxide.
Claim 20
Dependent Claim
28 words
A method of forming a patterned film onto a substrate according to claim 16, wherein step h) comprises dissolving said release layer in a solution comprising N-methylpyrrolidone (NMP).
References Cited (Backward Citations)
US4004044A
Cited
US4410622A
Cited
US4465538A
Cited
US4803181A
Cited
US4869760A
Cited
US4861732A
Cited
US4886728A
Cited
US5013397A
Cited
US4846931A
Cited
JPH02183255A
Cited
JPH02139559A
Cited
US5037504A
Cited
US5073230A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-10 | 1996-11-09 | 1997-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-10 | 2000-11-09 | 2001-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-10 | 2004-11-09 | 2005-05-11 | $7700.00 | Window Closed / Lapsed |