Patent US1677213A successfully refreshed from Google Patents.
Patent US5200579A successfully refreshed from Google Patents.
US5200579A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board with conductive patterns formed of thermoplastic and thermosetting resins
Assignee: Toshiba Lighting and Technology Corp
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Filing: 1991-03-29
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Granted: 1993-04-06
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Expires: 2011-03-29
Abstract
Abstract A circuit board comprising a plurality of film substrates in which films having heat deformation properties are laminated one on another, conductive patterns formed on at least one surface of each of the resin films, and connecting portions for electrically connecting the conductive patterns. The connecting portions are formed of parts of the conductive patterns, where the parts of the conductive patterns are made of conductive material including thermoplastic resin, and other parts of said conductive patterns are made of thermosetting resin.
Inventors
- 👤 Megumu Takeuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4632; H05K3/4614; H05K3/4617; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0391; H05K2201/09; H05K2201/09818; H05K2201/09981; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
81 words
A circuit board with conductive patterns formed of conductive material and thermoplastic and thermosetting resins comprising: a plurality of resin film substrates in which films having heat deformation properties are laminated one upon the other; conductive patterns formed on at least one surface of each of said resin films; and connecting portions for electrically connecting said conductive patterns, said connecting portions being made of conductive material including thermoplastic resin, and said conductive patterns being made of conductive material including thermosetting resin.
Claim 2
Dependent Claim
81 words
A circuit board with conductive patterns formed of conductive material and thermoplastic and thermosetting resins comprising: a plurality of resin film substrates in which films having heat deformation properties are laminated one upon the other; conductive patterns formed on at least one surface of each of said resin films; and connecting portions for electrically connecting said conductive patterns, said connecting portions being made of conductive material including thermoplastic resin, and said conductive patterns being made of conductive material including thermosetting resin.
Claim 3
Dependent Claim
19 words
The circuit board according to claim 1, wherein said connecting portions are through holes formed in said resin films.
Claim 4
Dependent Claim
33 words
The circuit board according to claim 1, wherein said conductive patterns are made of good conductive metal such as a material selected from the group consisting of Ag, Ni, Cu, Au and Pd.
Claim 5
Dependent Claim
42 words
The circuit board according to claim 1, wherein said resin films are made of resins selected from the group consisting of polycarbonate resin, polyvinyl chloride, polystyrene, saturated polyester resin, polyethylene resin, polypropylene, polyphenylene oxide, polysulfone resin, polyarylate resin, and polyether sulfone resin.
Claim 6
Dependent Claim
39 words
The circuit board according to claim 1, wherein said thermoplastic resin is selected from the group consisting of polycarbonate resin, polyvinyl chloride, polystyrene, saturated polyester resin, polyethylene resin, polypropylene, polyphenylene oxide, polysulfone resin, polyarylate resin, and polyether sulfone resin.
Claim 7
Dependent Claim
27 words
The circuit board according to claim 1, wherein aid thermosetting resin is selected from the group, consisting of resin, unsaturated polyester resin, phenolic resin, and diallyl phthalate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |