EP0347824A2
Expired / Lapsed
EP
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A thick film forming process
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1989-06-20
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Granted: —
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Expires: 2009-06-20
Abstract
Abstract A thick film forming process according to the present invention comprises using the screen printing to form thick films in the vicinity of the edges or parts of large areas of a substrate, and next using the direct writing to form thick films of patterns on the other parts of the substrate. The process of this invention enables a circuit pattern in thick films to be changed easily in set conditions.
Inventors
- 👤 Takeshi C/O Yokohama Works Of Sekiguchi
- 👤 Nobuo C/O Yokohama Works Of Shiga
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 15:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/22; H05K3/24; H05K3/245; H05K3/1241; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09736; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K3/1216
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
53 words
A thick film forming process comprising: a first step of forming a thick film of a required pattern on a substrate using screen printing; and a second step of forming a thick film of a required pattern on the substrate with the thick film formed thereon in the first step, using direct writing.
Claim 2
Dependent Claim
53 words
A thick film forming process comprising: a first step of forming a thick film of a required pattern on a substrate using screen printing; and a second step of forming a thick film of a required pattern on the substrate with the thick film formed thereon in the first step, using direct writing.
Claim 3
Dependent Claim
48 words
A thick film forming process according to claim 1, wherein thick films of a common pattern are formed on a plurality of substrates in the first step, and in the second step thick films of patterns different from one another are formed on the respective substrates as required.
Claim 4
Dependent Claim
53 words
A thick film forming process according to claim 1 or 2, wherein a thick film to be formed in a vicinity of an edge of the substrate is formed in the first step, and a thick film to be formed in a region spaced from the edge is formed in the second step.
Claim 5
Dependent Claim
44 words
A thick film forming process according to any one of claims 1 to 3, wherein a thick film of a thick line pattern is formed in the first step, and a thick film of a thin line pattern is formed in the second step.
Claim 6
Dependent Claim
122 words
A thick film forming process according to claim 3 or 4, wherein a nozzle for discharging a paste for the direct writing has a spacer at the tip end thereof for keeping a gap between the substrate and the same, and when a distance between the spacer and the center of the opening in the tip end of the nozzle is represented by L, and a length of a minimum essential overlap between the thick film formed by the first step and that formed by a second step for electric connection therebetween is represented by ℓ , a thick film in the vicinity of the edge within a distance of L + ℓ from the edge is formed in the first step.
Claim 7
Dependent Claim
29 words
A thick film forming process according to any one of claims 1 to 5, comprising drying in the first and second steps and sintering in the second step only.
Claim 8
Dependent Claim
24 words
A thick film forming process according to any one of claims 1 to 5, comprising both drying and sintering in the second step only.
References Cited (Backward Citations)
No citation records indexed.
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