Method for manufacturing BICMOS devices

Claim 1

A method for manufacturing BiCMOS devices, comprising the steps of: forming a buried layer of second conductive type in a silicon substrate of first conductive type and forming a highly doped bottom layer of said first conductive types and a highly doped bottom layer of said second conductive types; growing an intrinsic epitaxial layer; forming wells of said first conductive type and wells of said second conductive type in an epitaxial layer by a twin well process; forming a channel stop region for preventing field inversion; forming selectively a first insulating layer by a local oxidation of silicon; defining a collector region of a vertical PNP transistor and a collector region of an NPN transistor photolithographically and doping said collector regions with impurities of said first conductive type and impurities of said second conductive type respectively; growing said first insulating layer and depositing a first polysilicon layer; defining an intrinsic base region of said NPN transistor photolithographically and doping said intrinsic base region with impurities of said first conductive type; removing said first polysilicon layer and said first insulating layer on said NPN transistor region and said vertical PNP transistor region defined photolithographically; depositing a second polysilicon layer and doping said second polysilicon layer with highly doped impurities of said second conductive type; depositing a second insulating layer on said second polysilicon layer; forming gates of CMOS transistors, emitter electrodes and collector electrodes of said NPN transistor, and base electrodes of said vertical PNP transistor by removing predetermined parts of said second insulating layer and said second polysilicon layer photolithographically; defining an NMOS transistor region and an intrinsic base region of said vertical PNP transistor photolithographically and doping said regions with impurities of the second conductive type; defining source/drain regions of said PMOS transistor photolithographically and doping said source/drain regions with impurities of said first conductive type; depositing a third insulating layer and forming sidewall spacers by reactive ion etching of said third insulating layer; defining source/drain regions of said NMOS transistor photolithographically and doping said source/drain regions with impurities of said second conductive type; highly doping said source/drain regions of said PMOS transistor, said emitter/collector regions of said vertical PNP transistor, and said base of said NPN transistor; removing said second insulating layer; forming said extrinsic base of said vertical PNP transistor by using said second polysilicon layer as a diffusion source; and performing contact and metal interconnections.

Claim 2

A method for manufacturing BiCMOS devices, comprising the steps of: forming a buried layer of second conductive type in a silicon substrate of first conductive type and forming a highly doped bottom layer of said first conductive types and a highly doped bottom layer of said second conductive types; growing an intrinsic epitaxial layer; forming wells of said first conductive type and wells of said second conductive type in an epitaxial layer by a twin well process; forming a channel stop region for preventing field inversion; forming selectively a first insulating layer by a local oxidation of silicon; defining a collector region of a vertical PNP transistor and a collector region of an NPN transistor photolithographically and doping said collector regions with impurities of said first conductive type and impurities of said second conductive type respectively; growing said first insulating layer and depositing a first polysilicon layer; defining an intrinsic base region of said NPN transistor photolithographically and doping said intrinsic base region with impurities of said first conductive type; removing said first polysilicon layer and said first insulating layer on said NPN transistor region and said vertical PNP transistor region defined photolithographically; depositing a second polysilicon layer and doping said second polysilicon layer with highly doped impurities of said second conductive type; depositing a second insulating layer on said second polysilicon layer; forming gates of CMOS transistors, emitter electrodes and collector electrodes of said NPN transistor, and base electrodes of said vertical PNP transistor by removing predetermined parts of said second insulating layer and said second polysilicon layer photolithographically; defining an NMOS transistor region and an intrinsic base region of said vertical PNP transistor photolithographically and doping said regions with impurities of the second conductive type; defining source/drain regions of said PMOS transistor photolithographically and doping said source/drain regions with impurities of said first conductive type; depositing a third insulating layer and forming sidewall spacers by reactive ion etching of said third insulating layer; defining source/drain regions of said NMOS transistor photolithographically and doping said source/drain regions with impurities of said second conductive type; highly doping said source/drain regions of said PMOS transistor, said emitter/collector regions of said vertical PNP transistor, and said base of said NPN transistor; removing said second insulating layer; forming said extrinsic base of said vertical PNP transistor by using said second polysilicon layer as a diffusion source; and performing contact and metal interconnections.