US5179956A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Contact pressure sensor
Assignee: Omron Healthcare Co Ltd
•
Filing: 1991-06-26
•
Granted: 1993-01-19
•
Expires: 2011-06-26
Abstract
Abstract A contact pressure sensor including a semiconductor chip having opposite surfaces, at least one pressure sensing element provided in one of the opposite surfaces of the chip, a spacer member supporting the other surface of the chip, a substrate having a surface to which the spacer member is fixed, the one surface of the chip being pressed against an object which produces a pressure, so that the at least one sensing element detects the pressure produced by the object, a first connection terminal provided in the one surface of the chip, a second connection terminal provided in the surface of the substrate, and a flexible flat cable connecting between the first and second connection terminals, the flexible flat cable being bent into two portions one of which extends along a side surface of the spacer member and the other of which extends along the surface of the substrate. The contact pressure sensor may further comprise a light-shading layer covering the one surface of the chip in which the at least one pressure sensing element is provided.
Inventors
- 👤 Chikao Harada
- 👤 Norio Kawamura
- 👤 Ryuji Nakashima
- 👤 Arihiro Takahashi
- 👤 Toshimasa Yamazaki
- 👤 Masanobu Yasui
- 👤 Tatsushi Kondo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:33
CPC Classifications
A; A61; A61B; A61B5/00; A61B5/02; A61B5/021; A61B5/022; A61B5/02233; Y; Y10; Y10S; Y10S73/00; Y10S73/04
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
188 words
A contact pressure sensor comprising: a semiconductor having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; a spacer member supporting the other surface of said chip, said spacer member having a side surface substantially flush with an edge of said chip; a substrate having a surface to which said spacer member is fixed; said one surface of said chip being adapted to be pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; a first connection terminal provided in said one surface of said chip adapted to be pressed against said object; a second connection terminal provided in a free portion of said surface of said substrate which portion is free from said spacer member; and a flexible flat cable connecting between said first and second connection terminals, said flexible flat cable being bent into two portions one of which extends along said side surface of said spacer member and the other of which extends along said free portion of said surface of said substrate.
Claim 2
Dependent Claim
188 words
A contact pressure sensor comprising: a semiconductor having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; a spacer member supporting the other surface of said chip, said spacer member having a side surface substantially flush with an edge of said chip; a substrate having a surface to which said spacer member is fixed; said one surface of said chip being adapted to be pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; a first connection terminal provided in said one surface of said chip adapted to be pressed against said object; a second connection terminal provided in a free portion of said surface of said substrate which portion is free from said spacer member; and a flexible flat cable connecting between said first and second connection terminals, said flexible flat cable being bent into two portions one of which extends along said side surface of said spacer member and the other of which extends along said free portion of said surface of said substrate.
Claim 3
Dependent Claim
49 words
The contact pressure sensor according to claim 1, wherein said flexible flat cable is constituted by a plurality of conductor lines spaced apart from each other and a flexible sheet supporting said conductor lines, said conductor lines being formed of metal foil, said flexible sheet being formed of resin.
Claim 4
Dependent Claim
26 words
The contact pressure sensor according to claim 1, wherein said flexible flat cable is bent such that said two portions are angled at about 90 degrees.
Claim 5
Dependent Claim
38 words
The contact pressure sensor according to claim 1, further comprising a covering member covering said one surface of said semiconductor chip, said flexible flat cable, said side surface of said spacer member, and said surface of said substrate.
Claim 6
Dependent Claim
35 words
The contact pressure sensor according to claim 4, further comprising a black, electrically conducting layer superposed on a portion of the covering member which portion is located directly above said one surface of said chip.
Claim 7
Dependent Claim
28 words
The contact pressure sensor according to claim 1, wherein each of said at least one pressure sensing element is constituted by a Wheatstone's bridge including four semiconductor resistors.
Claim 8
Dependent Claim
54 words
The contact pressure sensor according to claim 1, further comprising an elastic diaphragm, and a sensor head case fixed at one of opposite surfaces thereof to said diaphragm and having a central recess in the other surface thereof, said substrate being accommodated within, and fixed to, said central recess of said sensor head case.
Claim 9
Dependent Claim
27 words
The contact pressure sensor according to claim 1, wherein said substrate includes a plate member formed of ceramics and a conductor pattern fixed to said plate member.
Claim 10
Dependent Claim
19 words
The contact pressure sensor according to claim 1, wherein said spacer member is formed of an electrical insulating material.
Claim 11
Dependent Claim
18 words
The contact pressure sensor according to claim 1, wherein said semiconductor chip is constituted by a monocrystalline-silicon plate.
Claim 12
Dependent Claim
43 words
The contact pressure sensor according to claim 10, further comprising a back-up plate formed of glass to which said semiconductor chip is adhered, said back-up plate having a hole formed therethrough for applying atmospheric pressure to said other surface of said semiconductor chip.
Claim 13
Dependent Claim
47 words
The contact pressure sensor according to claim 1, further comprising a casing having a central recess therein; said substrate being located within said central recess; and an elastic diaphragm coactive between the substrate and the casing for advancing the pressure sensing element with respect to the casing.
Claim 14
Dependent Claim
91 words
A contact pressure sensor comprising: a semiconductor chip having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; said one surface of said chip being pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; and a light-shading layer covering said one surface of said chip in which said at least one pressure sensing element is provided, said light-shading layer being formed of a black and electrically conducting material.
Claim 15
Dependent Claim
91 words
A contact pressure sensor comprising: a semiconductor chip having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; said one surface of said chip being pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; and a light-shading layer covering said one surface of said chip in which said at least one pressure sensing element is provided, said light-shading layer being formed of a black and electrically conducting material.
Claim 16
Dependent Claim
30 words
The contact pressure sensor according to claim 13, further comprising a covering member covering said one surface of said semiconductor chip, said light-shading layer being superposed on said covering member.
Claim 17
Dependent Claim
26 words
The contact pressure sensor according to claim 14, wherein said covering member comprises a thin rubber layer provided on said one surface of said semiconductor chip.
Claim 18
Dependent Claim
28 words
The contact pressure sensor according to claim 13, further comprising a back-up plate to which the other one of said opposite surfaces of said semiconductor chip is adhered.
Claim 19
Dependent Claim
44 words
The contact pressure sensor according to claim 13, wherein said semiconductor chip includes an elongate diaphragm portion having a thickness smaller than a thickness of a different portion of said chip, said at least one pressure sensing element being provided in said diaphragm portion.
Claim 20
Dependent Claim
38 words
The contact pressure sensor according to claim 17, wherein said at least one pressure sensing element comprises a plurality of pressure sensing elements provided at regular intervals of distance in said elongate diaphragm portion of said semiconductor chip.
Claim 21
Dependent Claim
99 words
A contact pressure sensor comprising: a semiconductor chip having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; said one surface of said chip being pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; a light-shading layer covering said one surface of said chip in which said at least one pressure sensing element is provided; and a covering member covering said one surface of said semiconductor chip, said light-shading layer being superimposed on said covering member.
Claim 22
Dependent Claim
99 words
A contact pressure sensor comprising: a semiconductor chip having opposite surfaces; at least one pressure sensing element provided in one of said opposite surfaces of said chip; said one surface of said chip being pressed against an object which produces a pressure, so that said at least one sensing element detects said pressure produced by said object; a light-shading layer covering said one surface of said chip in which said at least one pressure sensing element is provided; and a covering member covering said one surface of said semiconductor chip, said light-shading layer being superimposed on said covering member.
Claim 23
Dependent Claim
26 words
The contact pressure sensor according to claim 19, wherein said covering member comprise a thin rubber layer provided on said one surface of said semiconductor chip.
Claim 24
Dependent Claim
28 words
The contact pressure sensor according to claim 19, further comprising a back-up plate to which the other one of said opposite surfaces of said semiconductor chip is adhered.
Claim 25
Dependent Claim
48 words
The contact pressure sensor according to claim 19, wherein said one surface of said semiconductor chip includes an elongate diaphragm portion having a thickness smaller than a thickness of a different portion of said chip, said at least one pressure sensing element being provided in said diaphragm portion.
Claim 26
Dependent Claim
38 words
The contact pressure sensor according to claim 22, wherein said at least one pressure sensing element comprises a plurality of pressure sensing elements provided at regular intervals of distance in said elongate diaphragm portion of said semiconductor chip.
References Cited (Backward Citations)
US3817107A
Cited
US4423738A
Cited
US4399707A
Cited
US4561477A
Cited
US4665754A
Cited
US4763098A
Cited
US4839708A
Cited
US4686764A
Cited
US4987900A
Cited
US4784152A
Cited
US4771639A
Cited
US4928700A
Cited
US4901733A
Cited
US4830017A
Cited
US4966156A
Cited
US4972716A
Cited
US4945762A
Cited
US4947855A
Cited
US5058435A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-19 | 1996-07-20 | 1997-01-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-19 | 2000-07-20 | 2001-01-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-19 | 2004-07-20 | 2005-01-19 | $7700.00 | Window Closed / Lapsed |