Lead frame-chip package with improved configuration

Claim 1

A semiconductor chip package comprising: a semiconductor chip having a plurality of input and output pads thereon, a lead frame configuration having a first set and a second set of interdigitated extended fingers, the fingers of each set having inner ends surrounding said chip, said first set of said fingers having the inner ends thereof terminating at a first distance from said chip, the second set of said fingers having the inner ends thereof terminating at a second distance from said chip, said second distance being greater than said first distance, intermediate bonding regions positioned over and insulated from said first set of fingers and located between the inner ends of the second set of fingers and the inner ends said first set of fingers, a first set of wire means directly coupling respective pads on said chip to the fingers of said first set of fingers, a second set of wire means coupling respective pads on said chip with said second fingers, each wire of said second set of wire means having a first portion extending from its respective pad to a bonding region and bonded thereto, and a second portion extending from said bonding region to one of the fingers of said second set of fingers; and plastic encapsulation means enveloping said chip, and said inner ends of said fingers and said wire means.