Lead frame for semiconductor device

Abstract

Abstract PURPOSE:To increase the density of arrangement of leads and shorten bonding wire length by alternately arranging first and second leads, the former having a longer distance between an inner lead tip part and an island part than the later. CONSTITUTION:The tip end part of an inner lead 1 comprises a first inner lead tip end part located at a first distance near a pellet 3 and a second inner lead tip end part located at a second distance far from the pellet. Those first and second inner lead tip end parts are alternately arranged. Such an alternate arrangement of the leads each with shorter and longer distance from the pellet reduces bonding wire length and improve arrangement density of inner leads.

Inventors

• 👤 Yasuki Sugino
• 👤 杉埜　康喜

Bibliographic Details