EP0078606A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A semiconductor assembly with wire support
Assignee: Texas Instruments Inc
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Filing: 1982-09-27
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Granted: —
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Expires: 2002-09-27
Abstract
Abstract An assembly having an integral wire support (110) located between the contact pads (92, 97) of a semiconductor device (22) and a lead frame (20) for supporting wires (102) attached between the contact pads (97) of the semiconductor device (22) and the contact pads (47) of the lead frame (20).
Inventors
- 👤 John W. Orcutt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 06:55
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/421; H10W70/435; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/581; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
67 words
An assembly comprising: (a) a semiconductor device having a first contact pad located thereon; (b) a lead frame having a second contact pad located thereon; (c) a wire extending from one end connected to said first contact pad to another end connected to said second contact pad; and (d) an insulated support for supporting said wire at a location between said one end and said another end.
Claim 2
Dependent Claim
67 words
An assembly comprising: (a) a semiconductor device having a first contact pad located thereon; (b) a lead frame having a second contact pad located thereon; (c) a wire extending from one end connected to said first contact pad to another end connected to said second contact pad; and (d) an insulated support for supporting said wire at a location between said one end and said another end.
Claim 3
Dependent Claim
61 words
Assembly as set forth in Claim 1 wherein at least a portion of said first contact pad is within a first plane and a portion of said second contact pad is within a second plane substantially parallel to said first plane and. said support extends between said first and second planes and beyond away from said first and second contact pads.
Claim 4
Dependent Claim
23 words
Assembly as set forth in Claim 1 wherein said location is approximately equidistant from said first contact pad and said second contact pad.
Claim 5
Dependent Claim
21 words
Assembly as set forth in Claim 1 wherein said support has its surface supporting said wire textured to engage said wire.
Claim 6
Dependent Claim
20 words
Assembly as set forth in Claim 1 wherein said support is provided with a groove for receiving said wire therein.
Claim 7
Dependent Claim
42 words
Assembly as set forth in Claim 1 wherein said support is provided with at least one foot and said lead frame is provided with an opening adapted to receive said foot therein for attaching and aligning said support to said lead frame.
Claim 8
Dependent Claim
80 words
An assembly forming connections between a first contact pad on a semiconductor device and a second contact pad on a lead frame comprising: (a) an insulating support disposed intermediate said contact pad and said second contact pad; and (b) a wire extending from one end connected to said first contact pad to another end opposite to one end thereof connected to said second contact pad and positioned adjacent said support at a location between said first and second contact pads.
Claim 9
Dependent Claim
80 words
An assembly forming connections between a first contact pad on a semiconductor device and a second contact pad on a lead frame comprising: (a) an insulating support disposed intermediate said contact pad and said second contact pad; and (b) a wire extending from one end connected to said first contact pad to another end opposite to one end thereof connected to said second contact pad and positioned adjacent said support at a location between said first and second contact pads.
Claim 10
Dependent Claim
23 words
Assembly as set forth in Claim 7 wherein said location is approximately equidistant from said first contact pad and said second contact pad.
Claim 11
Dependent Claim
103 words
An assembly comprising: (a) a semiconductor device having at least one contact - pad thereon; (b) a lead frame having at least one contact pad thereon spaced from said semiconductor device; (c) an insulating support located between the contact pad of said semiconductor device and the contact pad of said lead frame; and (d) a wire extending from one end connected to the contact pad of said semiconductor device to another end opposite to said one end thereof connected to the contact pad of said lead frame and adjacent said support at a location intermediate said one end and said another end thereof.
Claim 12
Dependent Claim
103 words
An assembly comprising: (a) a semiconductor device having at least one contact - pad thereon; (b) a lead frame having at least one contact pad thereon spaced from said semiconductor device; (c) an insulating support located between the contact pad of said semiconductor device and the contact pad of said lead frame; and (d) a wire extending from one end connected to the contact pad of said semiconductor device to another end opposite to said one end thereof connected to the contact pad of said lead frame and adjacent said support at a location intermediate said one end and said another end thereof.
Claim 13
Dependent Claim
17 words
Assembly as set forth in Claim 9 wherein said support extends around the sides of said semiconductor.device.
Claim 14
Dependent Claim
14 words
Assembly as set forth in Claim 10 wherein said support is a square frame.
Claim 15
Dependent Claim
13 words
Assembly as set forth in Claim 10 wherein said support is a ring.
Claim 16
Dependent Claim
16 words
Assembly as set forth in Claim 9 wherein said support is attached to said lead frame.
Claim 17
Dependent Claim
42 words
Assembly. as set forth in Claim 13 wherein said support is provided with a certain number of feet and said lead frame is provided with a certain number of openings equal to said certain number of feet for receiving said feet therein.
Claim 18
Dependent Claim
34 words
Assembly as set forth in Claim 14 wherein said feet in said openings are disposed for attachment only at a predetermined relative orientation of said support to said lead frame for relative alignment thereof.
Claim 19
Dependent Claim
28 words
Assembly as set forth in Claim 9 wherein the surface of said support adjacent said wire is textured for engaging said wire when said wire contacts said support.
Claim 20
Dependent Claim
26 words
Assembly as set forth in Claim 9 wherein the surface of said support is provided with a groove adjacent said wire for receiving said wire therein.
Claim 21
Dependent Claim
15 words
Assembly as set forth in Claim 17 wherein said wire is located within said groove.
Claim 22
Dependent Claim
56 words
Assembly as set forth in Claim 9 wherein said lead frame lies within a first plane and a portion of the contact pad of said semiconductor device lies within a second plane approximately parallel and spaced from said first plane and the surface of said support away from said first plane extends beyond said second plane.
Claim 23
Dependent Claim
93 words
An assembly comprising: (a) a substantially flat surface having a first plurality of contact pads thereon; (b) a semiconductor device having a second plurality of contact pads on a surface thereof parallel to said flat surface; (c) a plurality of wires, each wire extending from a contact pad of said first plurality to a contact pad of said second plurality; (d) an insulating member supporting said plurality of wires at locations between said first and second plurality of contact pads and extending above said flat surface and said surface of said semiconductor device.
Claim 24
Dependent Claim
93 words
An assembly comprising: (a) a substantially flat surface having a first plurality of contact pads thereon; (b) a semiconductor device having a second plurality of contact pads on a surface thereof parallel to said flat surface; (c) a plurality of wires, each wire extending from a contact pad of said first plurality to a contact pad of said second plurality; (d) an insulating member supporting said plurality of wires at locations between said first and second plurality of contact pads and extending above said flat surface and said surface of said semiconductor device.
Claim 25
Dependent Claim
38 words
Assembly as set forth in Claim 20 wherein at least two adjacent wires of said plurality of wires extend from said semiconductor device to said flat surface without crossing relative to the plane formed by said flat surface.
Claim 26
Dependent Claim
22 words
Assembly as set forth in Claim 20 wherein said upper surface of said member is textured to engage said plurality of wires.
Claim 27
Dependent Claim
31 words
Assembly as set forth in Claim 20 wherein the upper surface of said member is provided with at least one groove for receiving one wire of said plurality of wires therein.
Claim 28
Dependent Claim
49 words
Assembly as set forth in Claim 20 wherein the upper surface of said member is provided with a first groove having a first groove for receiving a first wire therein and a second groove having a second depth for receiving a second wire adjacent to said first wire therein.
Claim 29
Dependent Claim
63 words
Assembly as set forth in Claim 20 wherein at least one wire of said plurality of wires is supported by said member at a location equidistant from one end thereof connected to a contact pad of said second plurality of contact pads and another end opposite to said one end thereof connected to a contact pad of said first plurality of contact pads.
Claim 30
Dependent Claim
28 words
Assembly as set forth in Claim 20 wherein said surface of said semiconductor device has four sides with at least one contact pad located adjacent each side thereof.
Claim 31
Dependent Claim
35 words
Assembly as set forth in Claim 20 wherein said surface of said semiconductor device has four edges with at least one contact pad of said second plurality of contact pads located away from said edges.
Claim 32
Dependent Claim
101 words
An assembly comprising: (a) a first means having a plurality of contact pads on an upper surface thereof; (b) a second means having a plurality of contact pads surrounding said first means on an upper surface thereof; (c) a third means having a non-conducting upper surface extending above the upper surface of said first and second .means; and (d) a fourth means extending from said plurality of contact pads on said first means to said plurality of contact pads on said second means and supported by said third means for interconnecting individual contact pads of said first and second contact pads.
Claim 33
Dependent Claim
101 words
An assembly comprising: (a) a first means having a plurality of contact pads on an upper surface thereof; (b) a second means having a plurality of contact pads surrounding said first means on an upper surface thereof; (c) a third means having a non-conducting upper surface extending above the upper surface of said first and second .means; and (d) a fourth means extending from said plurality of contact pads on said first means to said plurality of contact pads on said second means and supported by said third means for interconnecting individual contact pads of said first and second contact pads.
Claim 34
Independent Claim
85 words
A method of interconnecting a semiconductor device to a lead frame comprising the steps of: (a) affixing a semiconductor device relative to a lead frame with a first contact pad on an upper surface of said semiconductor device disposed for connection to a second contact pad on an upper surface of said lead frame; (b) affixing an insulating support between said first contact pad and said second contact pad; and (c) connecting a wire between said first and said second contact pads over said support.
Claim 35
Independent Claim
85 words
A method of interconnecting a semiconductor device to a lead frame comprising the steps of: (a) affixing a semiconductor device relative to a lead frame with a first contact pad on an upper surface of said semiconductor device disposed for connection to a second contact pad on an upper surface of said lead frame; (b) affixing an insulating support between said first contact pad and said second contact pad; and (c) connecting a wire between said first and said second contact pads over said support.
References Cited (Backward Citations)
No citation records indexed.
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