Patent US5340992A successfully refreshed from Google Patents.
Patent US5159529A successfully refreshed from Google Patents.
US5159529A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite liquid cooled plate for electronic equipment
Assignee: International Business Machines Corp
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Filing: 1991-05-15
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Granted: 1992-10-27
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Expires: 2011-05-15
Abstract
Abstract A composite liquid cooled plate is disclosed having a heat transfer plate, preferably made of copper, on one or both sides of a core, which is preferably plastic. The core has flow channels to direct water against the heat transfer plates underneath the "hot" areas of the heat transfer plates, thereby providing a very low thermal resistance. The assembly remains lightweight by restricting the use of copper or other conducting materials to only the areas requiring thermal conduction.
Inventors
- 👤 Eric P. Lovgren
- 👤 Donald P. Rearick
- 👤 Clifford B. Wells
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:31
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20536; H05K7/20627; H05K7/20636; H05K7/20218; H05K7/20254
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
173 words
A coolant management system for cooling electrical components using a coolant, said system comprising: (a) a first heat transfer plate, said first heat transfer plate having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; and (b) coolant management means for directing the coolant against said first heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate, said coolant management means being capable of being molded into a desired shape, wherein said first heat transfer plate is attached to said coolant management means so as to be in direct thermal connection with the coolant and to form a first coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.
Claim 2
Dependent Claim
173 words
A coolant management system for cooling electrical components using a coolant, said system comprising: (a) a first heat transfer plate, said first heat transfer plate having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; and (b) coolant management means for directing the coolant against said first heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate, said coolant management means being capable of being molded into a desired shape, wherein said first heat transfer plate is attached to said coolant management means so as to be in direct thermal connection with the coolant and to form a first coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.
Claim 3
Dependent Claim
74 words
The coolant management system of claim 1 further comprising a second heat transfer plate, said second heat transfer plate having a high thermal conductivity, wherein said second heat transfer plate includes a mounting side for mounting electronic components and a flow channel side, wherein said second heat transfer plate is attached to said coolant management means so as to be in direct thermal connection with the coolant and to form a second coolant cavity.
Claim 4
Dependent Claim
27 words
The coolant management system of claim 2 wherein said coolant management means has means to permit communication between said first coolant cavity and said second coolant cavity.
Claim 5
Dependent Claim
27 words
The coolant management system of claim 2 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.
Claim 6
Dependent Claim
28 words
The coolant management system of claim 2 wherein said coolant management means is an insert encapsulated between said first heat transfer plate and said second heat transfer plate.
Claim 7
Dependent Claim
31 words
The coolant management system of claim 2 wherein said coolant management means further comprises flow channels configured to cause coolant to contact only selected areas of said second heat transfer plate.
Claim 8
Dependent Claim
34 words
The coolant management system of claim 2 further comprising at least one hose connection fitting, said at least one hose connection fitting having an internal lumen for passing coolant to said coolant management means.
Claim 9
Dependent Claim
29 words
The coolant management system of claim 7 wherein said first heat transfer plate, said second heat transfer plate and said at least one hose connection fitting are metallurgically joined.
Claim 10
Dependent Claim
22 words
The coolant management system of claim 7 wherein said at least one hose connection fitting is integral with said coolant management means.
Claim 11
Dependent Claim
27 words
The coolant management system of claim 1 wherein said first heat transfer plate and said coolant management means are glued together to form said coolant management system.
Claim 12
Dependent Claim
242 words
A coolant management system for cooling electrical components using a coolant, said system comprising: (a) a first heat transfer plate, said first heat transfer plate being made of a material having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; (b) a second heat transfer plate, said second heat transfer plate being made of a material having a high thermal conductivity, wherein said second heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; (c) coolant management means for directing the coolant against said first heat transfer plate and said second heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate and said high thermal conductivity of said second heat transfer plate, said coolant management means being formed from material capable of being molded into a desired shape, wherein said first heat transfer plate and said second heat transfer plate encapsulate said coolant management means so as to be in direct thermal connection with the coolant and to form at least one coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.
Claim 13
Dependent Claim
242 words
A coolant management system for cooling electrical components using a coolant, said system comprising: (a) a first heat transfer plate, said first heat transfer plate being made of a material having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; (b) a second heat transfer plate, said second heat transfer plate being made of a material having a high thermal conductivity, wherein said second heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; (c) coolant management means for directing the coolant against said first heat transfer plate and said second heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate and said high thermal conductivity of said second heat transfer plate, said coolant management means being formed from material capable of being molded into a desired shape, wherein said first heat transfer plate and said second heat transfer plate encapsulate said coolant management means so as to be in direct thermal connection with the coolant and to form at least one coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.
Claim 14
Dependent Claim
23 words
The coolant management system of claim 11 wherein said first heat transfer plate and said second heat transfer plate are made of copper.
Claim 15
Dependent Claim
31 words
The coolant management system of claim 11 wherein said coolant management means further comprises flow channels configured to cause coolant to contact only selected areas of said second heat transfer plate.
Claim 16
Dependent Claim
27 words
The coolant management system of claim 11 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.
Claim 17
Dependent Claim
27 words
The coolant management system of claim 13 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-27 | 1996-04-27 | 1996-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-27 | 2000-04-27 | 2000-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-27 | 2004-04-27 | 2004-10-27 | $7700.00 | Window Closed / Lapsed |