US5158645A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of external circuitization of a circuit panel
Assignee: International Business Machines Corp
•
Filing: 1991-09-03
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Granted: 1992-10-27
•
Expires: 2011-09-03
Abstract
Abstract A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.
Inventors
- 👤 Kathleen L. Covert
- 👤 Charles C. Emmons
- 👤 Elizabeth Foster
- 👤 Richard W. Malek
- 👤 Voya R. Markovich
- 👤 Stephen L. Tisdale
- 👤 Charyl L. Tytran
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:35
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/425; H05K3/427; H05K3/0011; H05K3/0044; H05K3/0047; H05K3/426; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0796; H05K2203/13; H05K2203/1377; H05K2203/1388; H05K2203/14; H05K2203/1407; H05K3/0055; H05K3/10; H05K3/108; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/389
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
120 words
In a method of fabricating a printed circuit panel, which method comprises applying a protective layer to a surface of the panel to protect the surface morphology of the panel for further processing, drilling a through hole in the panel, cleaning the through hole to remove drilling debris therefrom, and circuitizing the surface of the panel and the through hole, the improvement comprising: a. applying a strippable thin film of Cu to the surface of the printed circuit panel; b. drilling the through hole through the strippable thin film of Cu and the printed circuit panel; c. thereafter etching the strippable thin film of Cu to uncover the surface morphology; and d. circuitizing the surface of the printed circuit panel.
Claim 2
Dependent Claim
120 words
In a method of fabricating a printed circuit panel, which method comprises applying a protective layer to a surface of the panel to protect the surface morphology of the panel for further processing, drilling a through hole in the panel, cleaning the through hole to remove drilling debris therefrom, and circuitizing the surface of the panel and the through hole, the improvement comprising: a. applying a strippable thin film of Cu to the surface of the printed circuit panel; b. drilling the through hole through the strippable thin film of Cu and the printed circuit panel; c. thereafter etching the strippable thin film of Cu to uncover the surface morphology; and d. circuitizing the surface of the printed circuit panel.
Claim 3
Dependent Claim
29 words
The method of claim 1 comprising first etching the strippable thin film of Cu to uncover the surface morphology, and thereafter circuitizing the surface of the printed circuit panel.
Claim 4
Dependent Claim
30 words
The method of claim 1 comprising first circuitizing the surface of the printed circuit panel, and thereafter etching the exposed strippable thin film of Cu to uncover the surface morphology.
Claim 5
Dependent Claim
32 words
The method of claim 1 comprising seeding the surface of the printed circuit panel, and thereafter flash plating the strippable copper thin film to the seeded surface of the printed circuit panel.
Claim 6
Dependent Claim
19 words
The method of claim 4 comprising flash plating the strippable copper to thickness of about 0.03 to 0.05 mil.
Claim 7
Dependent Claim
16 words
The method of claim 1 comprising flash etching the strippable Cu in aqueous CuCl 2 .
Claim 8
Dependent Claim
23 words
The method of claim 1 comprising cleaning the drilled hole and thereafter etching the thin film of Cu to uncover the surface morphology.
Claim 9
Dependent Claim
13 words
The method of claim 7 comprising cleaning the drilled hole with permanganate solution.
Claim 10
Dependent Claim
28 words
The method of claim 1 comprising cleaning the drilled hole, circuitizing the printed circuit panel, and thereafter etching the thin film of Cu to uncover the surface morphology.
Claim 11
Dependent Claim
13 words
The method of claim 9 comprising cleaning the drilled hole with permanganate solution.
Claim 12
Dependent Claim
43 words
The method of claim 1 comprising etching the strippable copper, and thereafter applying a seed layer to the surface morphology, applying photoresist atop the seed layer, exposing and developing the photoresist, applying copper atop the seed layer and photoresist, and stripping the photoresist.
Claim 13
Dependent Claim
23 words
The method of claim 11 comprising applying copper atop the seed layer and photoresist to a thickness of at least about 0.50 mil.
Claim 14
Dependent Claim
44 words
The method of claim 1 comprising etching the strippable copper, and thereafter applying a seed layer to the surface morphology, applying copper atop the seed layer, applying photoresist atop the copper, exposing and developing the photoresist, removing the uncovered copper, and stripping the photoresist.
Claim 15
Dependent Claim
20 words
The method of claim 13 comprising applying copper atop the seed layer to thickness of at least about 0.50 mil.
Claim 16
Dependent Claim
58 words
The method of claim 1 comprising desmearing a via or through hole, applying a second seed layer atop the thin protective layer, applying photoresist atop the seed layer, exposing and developing the photoresist, applying copper atop the thin protective layer and the second seed layer, and stripping the photoresist and the exposed thin protective layer and seed layer.
Claim 17
Dependent Claim
23 words
The method of claim 15 comprising applying copper atop the seed layer and photoresist to a thickness of at least about 0.50 mil.
Claim 18
Dependent Claim
46 words
The method of claim 1 comprising desmearing a via or through hole, applying a second seed layer atop the thin protective layer, applying copper atop the seed layer, applying photoresist atop the copper, exposing and developing the photoresist, removing the uncovered copper, and stripping the photoresist.
Claim 19
Dependent Claim
20 words
The method of claim 17 comprising applying copper atop the seed layer to thickness of at least about 0.50 mil.
Claim 20
Independent Claim
91 words
A method of fabricating a printed circuit panel, which method comprises: a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing; b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel; c. cleaning the through hole to remove drilling debris therefrom; d. etching the strippable thin film of Cu to uncover the surface morphology; and e. thereafter circuitizing the surface of the panel and the through hole.
Claim 21
Independent Claim
91 words
A method of fabricating a printed circuit panel, which method comprises: a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing; b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel; c. cleaning the through hole to remove drilling debris therefrom; d. etching the strippable thin film of Cu to uncover the surface morphology; and e. thereafter circuitizing the surface of the panel and the through hole.
Claim 22
Dependent Claim
32 words
The method of claim 19 comprising seeding the surface of the printed circuit panel, and thereafter flash plating the strippable copper thin film to the seeded surface of the printed circuit panel.
Claim 23
Dependent Claim
19 words
The method of claim 20 comprising flash plating the strippable copper to thickness of about 0.03 to 0.05 mil.
Claim 24
Dependent Claim
16 words
The method of claim 20 comprising flash etching the strippable Cu in aqueous CuCl 2 .
Claim 25
Dependent Claim
23 words
The method of claim 19 comprising cleaning the drilled hole and thereafter etching the thin film of Cu to uncover the surface morphology.
Claim 26
Dependent Claim
13 words
The method of claim 23 comprising cleaning the drilled hole with permanganate solution.
Claim 27
Dependent Claim
43 words
The method of claim 19 comprising etching the strippable copper, and thereafter applying a seed layer to the surface morphology, applying photoresist atop the seed layer, exposing and developing the photoresist, applying copper atop the seed layer and photoresist, and stripping the photoresist.
Claim 28
Dependent Claim
23 words
The method of claim 25 comprising applying copper atop the seed layer and photoresist to a thickness of at least about 0.50 mil.
Claim 29
Dependent Claim
44 words
The method of claim 19 comprising etching the strippable copper, and thereafter applying a seed layer to the surface morphology, applying copper atop the seed layer, applying photoresist atop the copper, exposing and developing the photoresist, removing the uncovered copper, and stripping the photoresist.
Claim 30
Dependent Claim
20 words
The method of claim 27 comprising applying copper atop the seed layer to thickness of at least about 0.50 mil.
Claim 31
Independent Claim
91 words
A method of fabricating a printed circuit panel, which method comprises: a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing; b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel; c. cleaning the through hole to remove drilling debris therefrom; d. circuitizing the surface of the panel and the through hole; and e. thereafter etching the strippable thin film of Cu to uncover the surface morphology.
Claim 32
Independent Claim
91 words
A method of fabricating a printed circuit panel, which method comprises: a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing; b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel; c. cleaning the through hole to remove drilling debris therefrom; d. circuitizing the surface of the panel and the through hole; and e. thereafter etching the strippable thin film of Cu to uncover the surface morphology.
Claim 33
Dependent Claim
32 words
The method of claim 29 comprising seeding the surface of the printed circuit panel, and thereafter flash plating the strippable copper thin film to the seeded surface of the printed circuit panel.
Claim 34
Dependent Claim
19 words
The method of claim 30 comprising flash plating the strippable copper to thickness of about 0.03 to 0.05 mil.
Claim 35
Dependent Claim
16 words
The method of claim 30 comprising flash etching the strippable Cu in aqueous CuCl 2 .
Claim 36
Dependent Claim
27 words
The method of claim 29 comprising cleaning the drilled hole, circuitizing the panel, and thereafter etching the uncircuitized thin film of Cu to uncover the surface morphology.
Claim 37
Dependent Claim
13 words
The method of claim 33 comprising cleaning the drilled hole with permanganate solution.
Claim 38
Dependent Claim
50 words
The method of claim 29 comprising applying a seed layer atop the protective Cu layer, applying photoresist atop the seed layer, exposing and developing the photoresist, applying copper atop the protective Cu layer, seed layer, and photoresist, and thereafter stripping the photoresist and the protective Cu layer underlying the photoresist.
Claim 39
Dependent Claim
26 words
The method of claim 35 comprising applying copper atop the protective Cu layer, seed layer and photoresist to a thickness of at least about 0.50 mil.
Claim 40
Dependent Claim
44 words
The method of claim 29 comprising etching the strippable copper, and thereafter applying a seed layer to the surface morphology, applying copper atop the seed layer, applying photoresist atop the copper, exposing and developing the photoresist, removing the uncovered copper, and stripping the photoresist.
Claim 41
Dependent Claim
20 words
The method of claim 37 comprising applying copper atop the seed layer to thickness of at least about 0.50 mil.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-27 | 1996-04-27 | 1996-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-27 | 2000-04-27 | 2000-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-27 | 2004-04-27 | 2004-10-27 | $7700.00 | Window Closed / Lapsed |