US4728568A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Masking tape for use in manufacturing a printed board
Assignee: Nippon Paper Industries Co Ltd
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Filing: 1986-10-20
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Granted: 1988-03-01
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Expires: 2006-10-20
Abstract
Abstract Disclosed is a masking tape suitable for use in manufacturing a printed circuit board. The masking tape comprises a water soluble paper as a tape base material, and a water soluble adhesive agent applied to one side of the paper. A method of filling through-holes employing such a water soluble masking tape in a process of manufacturing a printed circuit board is also disclosed.
Inventors
- 👤 Shigeru Sasada
- 👤 Tetsuo Ohwada
- 👤 Masaru Mishima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 08:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0094; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0139; H05K2203/0191; H05K2203/02; H05K2203/025; H05K2203/0278; H05K2203/05; H05K2203/0562; H05K2203/0582; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0786; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K3/02; H05K3/06; H05K3/061; H05K3/40; H05K3/42; H05K3/425; H05K3/427; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2813; Y10T428/2817; Y10T428/2826; Y10T428/31504; Y10T428/31855; Y10T428/3188; Y10T428/31895; Y10T428/31899; Y10T428/31902; Y10T428/31906
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
42 words
A masking tape for use in a process of filling through-holes in a printed board with a filler material, comprising: a water soluble paper as a tape base material; and a water soluble adhesive agent applied to one side of said paper.
Claim 2
Dependent Claim
42 words
A masking tape for use in a process of filling through-holes in a printed board with a filler material, comprising: a water soluble paper as a tape base material; and a water soluble adhesive agent applied to one side of said paper.
Claim 3
Dependent Claim
52 words
A masking tape as claimed in claim 1, wherein said water soluble adhesive agent is composed of a resin selected from a group consisting of an acrylic acid resin and a methacrylic acid resin as an adhesive constituent, blended with a derivative of polyethylene glycol that serves as a hydrophilic softening constituent.
Claim 4
Dependent Claim
31 words
A masking tape as claimed in claim 2, wherein said adhesive constituent and said hydrophilic softening constituent are blended with each other in the ratio of 100 parts to 50-150 parts.
Claim 5
Dependent Claim
64 words
A masking tape as claimed in claim 2, wherein said acrylic acid resin is a copolymer composed of from about 70% to about 90% by weight of alkyl ester monomer of acrylic acid of carbon number 4 and about 10% to about 30% by weight of a monomer containing a carboxyl group, from about 50% to about 80% of said carboxyl group being neutralized.
Claim 6
Dependent Claim
64 words
A masking tape as claimed in claim 2, wherein said methacrylic acid resin is a copolymer composed of from about 70% to about 90% by weight of alkyl ester monomer of methacrylic acid of carbon number 4 and about 10% to about 30% by weight of a monomer containing a carboxyl group, from about 50% to about 80% of said carboxyl group being neutralized.
Claim 7
Dependent Claim
20 words
A masking tape as claimed in claim 4, wherein said copolymer comprises not more than 10% of a vinyl monomer.
Claim 8
Dependent Claim
73 words
A masking tape as claimed in claim 2, wherein said derivative of polyethylene glycol is not more than 1,000 in molecular weight and expressed by the molecular formular of R 1 --O--(CH 2 CH 2 O)n--R 2 where R 1 is H or an alkyl group containing 1 to 2 carbon atoms, R 2 is hydrogen or an alkyl or acetyl group containing 1 to 2 carbon atoms, and n is an integer.
Claim 9
Independent Claim
134 words
A method for filling through-holes in a process of manufacturing a printed circuit board, comprising the steps of: preparing a substrate for use in manufacturing a desired printed circuit board for forming electrically conductive layers on both sides of said substrate and then forming through said conductive layers and substrate both through-holes for conducting electricity between the layers and positioning-holes for positioning said substrate at a desired position; covering said positioning-holes and peripheral edges of said substrate with a water soluble tape comprising a water soluble paper coated with a water soluble adhesive agent; filling said through-holes with a filling material capable of hardening in place; hardening said filling material; and removing any excess and undesirably located filling material applied on said substrate, and simultaneously removing said water soluble tape by applying water thereto.
Claim 10
Independent Claim
134 words
A method for filling through-holes in a process of manufacturing a printed circuit board, comprising the steps of: preparing a substrate for use in manufacturing a desired printed circuit board for forming electrically conductive layers on both sides of said substrate and then forming through said conductive layers and substrate both through-holes for conducting electricity between the layers and positioning-holes for positioning said substrate at a desired position; covering said positioning-holes and peripheral edges of said substrate with a water soluble tape comprising a water soluble paper coated with a water soluble adhesive agent; filling said through-holes with a filling material capable of hardening in place; hardening said filling material; and removing any excess and undesirably located filling material applied on said substrate, and simultaneously removing said water soluble tape by applying water thereto.
Claim 11
Dependent Claim
21 words
A method according to claim 8, wherein said step of removal of any excess and undesirably located material comprises abrading thereof.
Claim 12
Dependent Claim
35 words
A method according to claim 9, wherein said abrading is carried out under water so that both the water soluble tape and said abraded filling material mix with said water upon removal from said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-01 | 1991-08-31 | 1992-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-01 | 1995-08-31 | 1996-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-01 | 1999-08-31 | 2000-03-01 | $7700.00 | Window Closed / Lapsed |