US4162932A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for removing resin smear in through holes of printed circuit boards
Assignee: Perstorp AB
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Filing: 1977-10-26
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Granted: 1979-07-31
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Expires: 1997-10-26
Abstract
Abstract A method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy and applying a water-jet stream to said resin smear to remove it from said laminate.
Inventors
- 👤 Jiri Konicek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0055; H05K2203/00; H05K2203/03; H05K2203/0346; H05K2203/07; H05K2203/0736; H05K2203/0746; H05K3/0085; H05K3/0088; H05K3/02; H05K3/022; H05K3/025
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
115 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy, the improvement consisting of applying a water-jet stream to said resin smear to remove it from said laminate.
Claim 2
Dependent Claim
115 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy, the improvement consisting of applying a water-jet stream to said resin smear to remove it from said laminate.
Claim 3
Dependent Claim
186 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising electroplating said thin continuous layer of copper or copper alloy to a temporary base of a throwaway type comprising a foil of aluminum or an alloy thereof having a thickness of up to about 200μm, laminating said layer of copper or copper alloy on said temporary based under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy, the improvement consisting of removing the foil of aluminum or aluminum alloy by etching, stripping, tearing off, or a combination thereof, leaving said thin electroplated layer of copper or copper alloy on the final base and applying a water-jet stream to said resin smear to remove it from said laminate.
Claim 4
Dependent Claim
186 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising electroplating said thin continuous layer of copper or copper alloy to a temporary base of a throwaway type comprising a foil of aluminum or an alloy thereof having a thickness of up to about 200μm, laminating said layer of copper or copper alloy on said temporary based under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy, the improvement consisting of removing the foil of aluminum or aluminum alloy by etching, stripping, tearing off, or a combination thereof, leaving said thin electroplated layer of copper or copper alloy on the final base and applying a water-jet stream to said resin smear to remove it from said laminate.
Claim 5
Dependent Claim
192 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer or copper alloy, comprising electroplating said thin continuous layer of copper or copper alloy to a temporary base of a throwaway type comprising a foil of aluminum or an alloy thereof having a thickness of up to about 200μm, laminating said layer of copper or copper alloy on said temporary base under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of burrs and resin smear in said layer of copper or copper alloy, the improvement consisting of dissolving said burrs, removing the alloy of aluminum or aluminum foil by etching, stripping, tearing off, or a combination thereof, leaving said thin electroplated layer of copper or copper alloy on the final base free of burrs and applying a water-jet stream to said resin smear to remove it from said laminate.
Claim 6
Dependent Claim
192 words
In a method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer or copper alloy, comprising electroplating said thin continuous layer of copper or copper alloy to a temporary base of a throwaway type comprising a foil of aluminum or an alloy thereof having a thickness of up to about 200μm, laminating said layer of copper or copper alloy on said temporary base under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, and subsequently drilling or punching holes in said laminate causing the formation of burrs and resin smear in said layer of copper or copper alloy, the improvement consisting of dissolving said burrs, removing the alloy of aluminum or aluminum foil by etching, stripping, tearing off, or a combination thereof, leaving said thin electroplated layer of copper or copper alloy on the final base free of burrs and applying a water-jet stream to said resin smear to remove it from said laminate.
References Cited (Backward Citations)
US3276106A
Cited
US3568296A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-07-30 | 1983-01-29 | 1983-07-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-07-30 | 1987-01-29 | 1987-07-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-07-30 | 1991-01-29 | 1991-07-31 | $7700.00 | Window Closed / Lapsed |