US5156994A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Local interconnect method and structure
Assignee: Texas Instruments Inc
•
Filing: 1990-12-21
•
Granted: 1992-10-20
•
Expires: 2010-12-21
Abstract
Abstract An improved local electrical interconnect device fabrication and method are provided. Reacted refractory metal contacts and local interconnect lines (54) and (56) are formed by reacting a deposited refractory metal layer (53) with selectively grown semiconductor regions (48) and (50). Regions (48) and (50) are formed after a masked ion implantation which forms loosely bonded surface regions (44) and (46) within field insulating regions (12). As a result of the ion implantation, semiconductor regions (48a) and (50a) are able to form over field insulating regions (12).
Inventors
- 👤 Mehrdad M. Moslehi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 06:17
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/0698; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/0223; H10D30/0227; H10D30/027; H10D30/0275; H10D64/00; H10D64/20; H10D64/23; H10D64/251; H10D64/258; H10D64/259; H10P; H10P14/00; H10P14/40; H10P14/416; H10W20/064; H10W20/066; H10W20/40; H10W20/41; H10W20/44; H10W20/4451
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
119 words
A method of forming an electrical interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering selected regions of said semiconductor and insulating surfaces with a mask such that an area where the interconnect is to be formed is exposed; implanting ions into said exposed area such that said insulating surface in said exposed area is disturbed thereby freeing semiconductor atoms; removing said mask; forming a semiconductor interconnect region by selectively growing a semiconductor in said semiconductor surface and said insulating surface of exposed regions; selectively depositing refractory metal over said semiconductor interconnect region; and annealing said refractory metal over said exposed area such that it reacts with said semiconductor interconnect region.
Claim 2
Independent Claim
119 words
A method of forming an electrical interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering selected regions of said semiconductor and insulating surfaces with a mask such that an area where the interconnect is to be formed is exposed; implanting ions into said exposed area such that said insulating surface in said exposed area is disturbed thereby freeing semiconductor atoms; removing said mask; forming a semiconductor interconnect region by selectively growing a semiconductor in said semiconductor surface and said insulating surface of exposed regions; selectively depositing refractory metal over said semiconductor interconnect region; and annealing said refractory metal over said exposed area such that it reacts with said semiconductor interconnect region.
Claim 3
Dependent Claim
15 words
The method of claim 1, wherein said step of implanting ions comprises implanting semiconductor ions.
Claim 4
Dependent Claim
15 words
The method of claim 1, wherein said step of implanting ions comprises implanting inert ions.
Claim 5
Dependent Claim
15 words
The method of claim 2, wherein said step of implanting ions comprises implanting germanium ions.
Claim 6
Dependent Claim
15 words
The method of claim 2, wherein said step of implanting ions comprises implanting silicon ions.
Claim 7
Dependent Claim
21 words
The method of claim 1, wherein said step of forming a semiconductor interconnect region comprises selectively growing a silicon interconnect region.
Claim 8
Dependent Claim
21 words
The method of claim 1, wherein said step of forming a semiconductor interconnect region comprises selectively growing a semiconductor interconnect region.
Claim 9
Dependent Claim
21 words
The method of claim 1, wherein said step of forming a semiconductor interconnect region comprises selectively growing a silicon-germanium interconnect region.
Claim 10
Dependent Claim
40 words
The method of claim 1, wherein said step of forming a reacted refractory metal contacts and interconnect lines comprises: sputtering refractory metal over the exposed area; and annealing the refractory metal such that it reacts with the semiconductor interconnect region.
Claim 11
Dependent Claim
19 words
The method of claim 9, wherein said step of sputtering refractory metal over the exposed area comprise sputtering titanium.
Claim 12
Dependent Claim
35 words
The method of claim 1, wherein said step of forming a reacted refractory metal contact produces excess nitridized refractory metal and unreacted material, and further comprising removing the excess nitridized and unreacted refractory metal material.
Claim 13
Dependent Claim
21 words
The method of claim 11 wherein said step of removing comprises isotropically etching the excess nitridized and unreacted refractory metal material.
Claim 14
Dependent Claim
33 words
The method of claim 1 wherein said step of forming reacted refractory metal contacts and interconnect lines comprises: depositing refractory metal by chemical-vapor deposition over the exposed area; and annealing the refractory metal.
Claim 15
Dependent Claim
23 words
The method of claim 1 and further comprising annealing the reacted refractory metal contacts and interconnection lines to reduce the electrical resistivity thereof.
Claim 16
Dependent Claim
19 words
The method of claim 1 wherein said step of covering with a mask comprises covering with a photoresist mask.
Claim 17
Dependent Claim
19 words
The method of claim 1 wherein said step of covering with a mask comprises covering with a hard mask.
Claim 18
Independent Claim
94 words
A method of forming an interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering a selected region of the surface with a mask such that an area where the interconnect is to be formed is exposed; implanting inert ions into the exposed area to create semiconductor nucleation cites in said insulating surface; removing the mask; selectively growing a semiconductor interconnect region in said semiconductor surface and said insulating surface of the exposed area; and forming reacted refractory metal contacts and interconnect lines in the exposed area.
Claim 19
Independent Claim
94 words
A method of forming an interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering a selected region of the surface with a mask such that an area where the interconnect is to be formed is exposed; implanting inert ions into the exposed area to create semiconductor nucleation cites in said insulating surface; removing the mask; selectively growing a semiconductor interconnect region in said semiconductor surface and said insulating surface of the exposed area; and forming reacted refractory metal contacts and interconnect lines in the exposed area.
Claim 20
Dependent Claim
23 words
The method of claim 17 and further comprising annealing the reacted refractory metal contacts and interconnect lines to reduce the electrical resistivity thereof.
Claim 21
Dependent Claim
36 words
The method of claim 17 wherein said step of forming a reacted refractory metal contact comprises: sputtering titanium over the exposed area; and annealing the refractory metal such that it reacts with the semiconductor interconnect region.
Claim 22
Dependent Claim
33 words
The method of claim 17 wherein said step of forming reacted refractory metal contacts and interconnect lines comprises: depositing refractory metal by chemical-vapor deposition over the exposed area; and annealing the refractory metal.
Claim 23
Dependent Claim
13 words
The method of claim 1 wherein said insulating surface is a field oxide.
Claim 24
Dependent Claim
12 words
The method of claim 21 wherein said field oxide comprises silicon dioxide.
Claim 25
Dependent Claim
25 words
The method of claim 1 wherein said step of selectively growing a semiconductor is performed at temperatures less than or equal to about 900° C.
Claim 26
Dependent Claim
20 words
The method of claim 17 wherein said inert ions are selected from the group consisting of argon, helium, and xenon.
Claim 27
Independent Claim
111 words
A method of forming an electrical interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering selected regions of said semiconductor and insulating surfaces with a mask such that an area where the interconnect is to be formed is exposed; implanting ions into said exposed area such that said insulating surface in said exposed area is disturbed thereby freeing semiconductor atoms; removing said mask; forming a semiconductor interconnect region by selectively growing a semiconductor at least partially comprising germanium in said semiconductor surface and said insulating surface of exposed regions; and forming reacted refractory metal contacts and interconnect lines over said semiconductor interconnect region.
Claim 28
Independent Claim
111 words
A method of forming an electrical interconnect over a surface including a semiconductor surface and an insulating surface, comprising the steps of: covering selected regions of said semiconductor and insulating surfaces with a mask such that an area where the interconnect is to be formed is exposed; implanting ions into said exposed area such that said insulating surface in said exposed area is disturbed thereby freeing semiconductor atoms; removing said mask; forming a semiconductor interconnect region by selectively growing a semiconductor at least partially comprising germanium in said semiconductor surface and said insulating surface of exposed regions; and forming reacted refractory metal contacts and interconnect lines over said semiconductor interconnect region.
Claim 29
Dependent Claim
21 words
The method of claim 25 wherein said step of forming a semiconductor interconnect region comprises selectively growing a germanium interconnect region.
Claim 30
Dependent Claim
21 words
The method of claim 25 wherein said step of forming a semiconductor interconnect region comprises selectively growing a silicon-germanium interconnect region.
Claim 31
Dependent Claim
45 words
The method of claim 25 wherein said step of forming a reacted refractory metal and interconnect line comprises selectively depositing refractory metal over said semiconductor interconnect region; and annealing said refractory metal over said exposed area such that it reacts with said semiconductor interconnect region.
References Cited (Backward Citations)
US4102733A
Cited
US4873204A
Cited
JPS6231114A
Cited
US4822749A
Cited
US4868618A
Cited
US5001082A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-20 | 1996-04-20 | 1996-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-20 | 2000-04-20 | 2000-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-20 | 2004-04-20 | 2004-10-20 | $7700.00 | Window Closed / Lapsed |